Patents by Inventor Lee

Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230367079
    Abstract: A light source uniformity adjusting device is provided, which easily and exactly performs a coiling task of an optical fiber. The light source uniformity adjusting device includes a base plate including a plurality of holes therein; a first fixing portion on one side of the base plate, fixing a first portion of an optical fiber; a second fixing portion disposed on another side of the base plate, fixing a second portion of the optical fiber; and a post portion inserted into at least one hole from among the plurality of holes, the post portion routing the optical fiber on the base plate such that the optical fiber has at least one curved shape between the first portion and the second portion.
    Type: Application
    Filed: January 12, 2023
    Publication date: November 16, 2023
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Sung-Il Choi, Hyong Joon Kim, Jong Koo Im, Kyung Beom Kim, Sung Yoon Ryu, Mi Ra Park, Jeong Han Yi, Jeung Hee Lee
  • Publication number: 20230363568
    Abstract: The present disclosure relates to an apparatus and a method for estimating a state of an object to be heated based on sound which is generated when the object to be heated is heated, and providing the estimated information to other devices in an Internet of Things (IoT) environment through a 5G communication network. The heating apparatus may include a housing having a receiving space therein, a heating member disposed within the housing, a power supplier for supplying power to the heating member, a top plate disposed on the top of the housing to support the object to be heated, a sound sensor disposed on the bottom of the top plate, and a controller for predicting the state of the object to be heated by using a deep neural network model that has been trained through machine learning based on a sound signal received from the sound sensor.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Applicant: LG ELECTRONICS INC.
    Inventors: Hyo Jin AN, Young Min LEE, Heung Sik CHOI
  • Publication number: 20230367367
    Abstract: According to an embodiment, an electronic device includes a housing providing an inner space, a sensor disposed in the inner space, and a key button including an electrode electrically connected to the sensor and configured to obtain biometric information through a contact with an external object through the sensor, wherein the key button includes a metal layer, a deposited layer including a hole connected to a part of the metal layer and disposed on the metal layer, and a conductive material disposed in the hole and contact with the metal layer exposed through the hole, wherein a diameter of one side of the hole facing an outside is greater than a thickness of the deposited layer.
    Type: Application
    Filed: February 22, 2023
    Publication date: November 16, 2023
    Inventors: Youngsoo HA, Yoonhee LEE, Hangyu HWANG
  • Publication number: 20230370618
    Abstract: An image encoding/decoding method and apparatus for performing template matching-based intra prediction are provided. An image decoding method may comprise deriving a first intra-prediction mode for a current block, generating a first intra-prediction block corresponding to the first intra-prediction mode, deriving a second intra-prediction mode for the current block, generating a second intra-prediction block corresponding to the second intra-prediction mode, and generating a final intra-prediction block by using a weighted sum of the first intra-prediction block and the second intra-prediction block.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Dong San JUN, Sung Chang LIM, Jung Won KANG, Hyun Suk KO, Jin Ho LEE, Ha Hyun LEE, Hui Yong KIM
  • Publication number: 20230367410
    Abstract: A touch display device, a display panel, and a gate driving circuit are disclosed. A touch display device comprises a display panel having subpixels, a gate driving circuit including gate stages for applying a scan signal to the display panel through gate lines and dummy stages selectively disposed between the gate stages, and a touch driving circuit applying a touch driving signal to the display panel through touch lines and receiving a touch sensing signal generated by the display panel, wherein the dummy stages are divided into two or more dummy stage groups, and wherein a group control signal line for applying a group control signal based on dummy stage group and an individual control signal line for applying an individual control signal to each dummy stage included in the dummy stage group are disposed along a bezel area.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 16, 2023
    Inventors: Byoungwoo Kim, JoonHo Lee, HyunHo Park, Sunghoon Paik
  • Publication number: 20230367612
    Abstract: An electronic device displays a first screen is provided. The electronic device includes a list of one or more second applications in a display based on a first application, the second applications being different from the first application. The electronic device displays, in response to a first input of selecting one application of the one or more second applications based on the list, a second screen based on execution of the selected application in the display. The electronic device identifies information indicating at least one application switchable from the second screen within the first application, in response to a second input executing a third application based on the second screen. The electronic device identifies whether to switch from the second screen to a third screen based on execution of the third application to initiate the execution of the third application.
    Type: Application
    Filed: January 19, 2023
    Publication date: November 16, 2023
    Inventors: Younggyun LEE, Wontaek KIM, Changmin CHOI, Yonggil HAN
  • Publication number: 20230367811
    Abstract: A method comprises storing, at a storage bucket of the communication system, an import file received from a client application at a workstation, wherein a user defined function of the communication system is triggered to execute when the import file is received from the workstation, retrieving, by the user defined function, the import file from the storage bucket, processing, by the user defined function, the import file to obtain a geospatial file, storing the geospatial file in a cloud database of the communication system, fetching, by an application of the communication system, the geospatial file from the cloud database, and generating, by a visualization application of the communication system, the multilayer geographical virtualization based on the geospatial file fetched from the cloud database.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Jeny Bhimani, Taha Lahrichi, Farrah Young Lee, James Byung Ha No
  • Publication number: 20230366938
    Abstract: A battery diagnosing apparatus may include a voltage measuring circuit for generating a voltage signal representing a battery voltage across both ends of each of batteries; a database for storing abnormal patterns, a plurality of reference time series, and a predetermined corresponding relationship between the abnormal patterns and the plurality of reference time series; and a control unit for generating a plurality of input time series representing a change history of the battery voltage of each battery, based on the voltage signal. The control unit may extract an abnormal input time series representing an abnormal voltage behavior among the plurality of input time series by comparing the plurality of input time series with each other. The control unit may identify an abnormal pattern of the abnormal input time series among the abnormal patterns by comparing the abnormal input time series with the plurality of reference time series one by one.
    Type: Application
    Filed: January 6, 2022
    Publication date: November 16, 2023
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventor: Hyun-Jun LEE
  • Publication number: 20230369285
    Abstract: A method of fabricating a semiconductor chip includes the following steps. A bonding material layer is formed on a first wafer substrate and is patterned to form a first bonding layer having a strength adjustment pattern. A semiconductor component layer and a first interconnect structure layer are formed on a second wafer substrate. The first interconnect structure layer is located. A second bonding layer is formed on the first interconnect structure layer. The second wafer substrate is bonded to the first wafer substrate by contacting the second bonding layer with the first bonding layer. A bonding interface of the second bonding layer and the first bonding layer is smaller than an area of the second bonding layer. A second interconnect structure layer is formed on the semiconductor component layer. A conductor terminal is formed on the second interconnect structure layer.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hong-Wei Chan, Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Lee
  • Publication number: 20230371315
    Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.
    Type: Application
    Filed: May 10, 2023
    Publication date: November 16, 2023
    Inventors: Jungmin LEE, Chung-chia CHEN, Ji Young CHOUNG, Yu-hsin LIN
  • Publication number: 20230368742
    Abstract: Provided is a display apparatus comprising a data driving circuit configured to output data signals through a plurality of output lines, a data distribution circuit including a first switch and a second switch, wherein the first switch connects a first data line to a first output line in response to a first control signal, and the second switch connects the second data line to the first output line in response to a second control signal, and a control circuit configured to alternately output the first control signal and the second control signal during each line time of one frame.
    Type: Application
    Filed: May 3, 2023
    Publication date: November 16, 2023
    Inventors: Jaesic Lee, Wonkyu Kwak, Kyunghoon Kim, Mincheol Lee
  • Publication number: 20230367234
    Abstract: A method of performing a lithography process includes providing a test pattern. The test pattern includes a first set of lines arranged at a first pitch, a second set of lines arranged at the first pitch, and further includes at least one reference line between the first set of lines and the second set of lines. The test pattern is exposed with a radiation source providing an asymmetric, monopole illumination profile to form a test pattern structure on a substrate. The test pattern structure is then measured and a measured distance correlated to an offset of a lithography parameter. A lithography process is adjusted based on the offset of the lithography parameter.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Chih-Jie Lee, Shih-Chun Huang, Shih-Ming Chang, Ken-Hsien Hsieh, Yung-Sung Yen, Ru-Gun Liu
  • Publication number: 20230369281
    Abstract: The present disclosure relates to a semiconductor structure including an interconnect structure disposed over a semiconductor substrate. A lower metal line is disposed at a first height over the semiconductor substrate and extends through a first interlayer dielectric layer. A second interlayer dielectric layer is disposed at a second height over the semiconductor substrate and comprises a first dielectric material. An upper metal line is disposed at a third height over the semiconductor substrate. A via is disposed at the second height. The via extends between the lower metal line and the upper metal line. A protective dielectric structure is disposed at the second height. The protective dielectric structure comprises a protective dielectric material and is disposed along a first set of opposing sidewalls of the via, the protective dielectric material differing from the first dielectric material.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao
  • Publication number: 20230369398
    Abstract: A semiconductor device includes a substrate, nanostructures vertically suspended above the substrate, a metal gate structure wrapping each of the nanostructures, an epitaxial feature having a first sidewall in physical contact with end portions of the nanostructures, and an air gap disposed between the epitaxial feature and the metal gate structure. The air gap exposes the first sidewall of the epitaxial feature and the end portions of the nanostructures.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 16, 2023
    Inventors: Pei-Yu Wang, Wei Ju Lee
  • Publication number: 20230368543
    Abstract: Disclosed herein are a system for autonomous emergency braking and a vehicle including the same. The system of the present disclosure includes a camera, and a processor configured to identify at least one of other vehicle and a lane line in an image based on image information acquired by the camera, determine whether a gradient of a front road for a vehicle to be entered changes to a reference gradient or more based on at least one of whether the other vehicle is present and whether the lane line is distorted, and control a pre-fill operation based on determining that the gradient of the front road changes to the reference gradient or more.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 16, 2023
    Applicant: HL Klemove Corp.
    Inventor: Sangju LEE
  • Publication number: 20230367407
    Abstract: A touch-type panel structure for a vehicle that is employed to operate electronic equipment, an air conditioning apparatus, or the like that is mounted in a vehicle, and a method of manufacturing the touch-type panel structure for a vehicle. The touch-type panel structure for a vehicle includes a touch film whose touch by a user is detected; and a transfer film arranged on a surface of a touch panel that is in a direction opposite to a direction in which a base film is arranged, wherein the touch film is formed of a multiplicity of electro-conductive plastics that have electroconductivity; and a thermoplastic combined with the multiplicity of electro-conductive plastics.
    Type: Application
    Filed: December 6, 2022
    Publication date: November 16, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Kyeong Jun LEE
  • Publication number: 20230369287
    Abstract: Multi-chip wafer level packages and methods of forming the same are provided. A multi-chip wafer level package includes a first tier and a second tier. The first tier includes a first redistribution layer structure and at least one chip over the first redistribution layer structure. The second tier includes a second redistribution layer structure and at least two other chips over the second redistribution layer structure. The first tier is bonded to the second tier with the at least one chip being in physical contact with the second redistribution layer structure. The total number of connectors of the at least two other chips is greater than the total number of connectors of the at least one chip.
    Type: Application
    Filed: July 18, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee
  • Publication number: 20230365125
    Abstract: A vehicle may include a camera configured to obtain image data associated with an image. The image may include a trailer being in proximity to the vehicle in an external field of view. The vehicle may further include a radar associated with a second external field of view of the vehicle and configured to obtain radar data associated with the trailer in the second external field of view, and a controller. The controller may be configured to determine whether the trailer is coupled to the vehicle by processing the image data and the radar data, perform at least one of: generating a warning signal or controlling a braking device based on a forward collision-avoidance assist (FCA) function, and change at least one of: a timing of the generating the warning signal or an operation of the controlling the braking device based on the trailer being coupled to the vehicle.
    Type: Application
    Filed: December 8, 2022
    Publication date: November 16, 2023
    Inventors: Hyoungjong Wi, Dong Hyun Sung, Yongseok Kwon, Tae-Geun An, Joon Ho Lee, Eungseo Kim, Sangmin Lee
  • Publication number: 20230364912
    Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and a fluid supplying part for providing a humidity control fluid onto the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.
    Type: Application
    Filed: April 24, 2023
    Publication date: November 16, 2023
    Applicant: SEMES CO.,LTD.
    Inventors: Won-Yong JIN, Hosang LEE, Jiyun AHN, Suk-Won JANG, Jae-Duck LEE
  • Publication number: 20230367194
    Abstract: A reticle is provided. The reticle includes a first reflective multilayer (ML) over a mask substrate and a capping layer over the first reflective ML. The reticle also includes a first absorption layer over the capping layer and a second reflective multilayer (ML) over the first absorption layer. The reticle further includes an etch stop layer over the second reflective ML and a third reflective multilayer (ML) over the etch stop layer. In addition, the reticle includes an absorption film pair over the third reflective ML.
    Type: Application
    Filed: June 28, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Chang HSUEH, Huan-Ling LEE, Chia-Jen CHEN, Hsin-Chang LEE