Patents by Inventor Lei Duan

Lei Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8666984
    Abstract: Unsupervised clustering can be used for organization of micro-blog or other short length messages into message clusters. Messages can be compared with existing clusters to determine a similarity score. If at least one similarity score is greater than a threshold value, a message can be added to an existing message cluster. If a message is not similar to an existing cluster, the message can be compared against criteria for starting a new message cluster.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: March 4, 2014
    Assignee: Microsoft Corporation
    Inventors: Ki Yeun Kim, Lei Duan, Seokkyung Chung
  • Patent number: 8563361
    Abstract: A WLCSP method comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer to cover metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; forming a groove on front surface of first packaging layer along each scribe line by cutting along a straight line extended by two ends of scribe line exposed on front surface of un-covered ring; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal layer at bottom surface of wafer in recessed space; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and metal layer along groove.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: October 22, 2013
    Assignee: Alpha & Omega Semiconductor, Inc.
    Inventors: Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ping Huang, Lei Shi, Lei Duan, Yuping Gong
  • Publication number: 20130210195
    Abstract: A WLCSP method comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer to cover metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; forming a groove on front surface of first packaging layer along each scribe line by cutting along a straight line extended by two ends of scribe line exposed on front surface of un-covered ring; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal layer at bottom surface of wafer in recessed space; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and metal layer along groove.
    Type: Application
    Filed: July 12, 2012
    Publication date: August 15, 2013
    Inventors: Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ping Huang, Lei Shi, Lei Duan, Yuping Gong
  • Patent number: 8486803
    Abstract: A chip-scale packaging method, with bottom and side of a semiconductor chip encapsulated, includes the following steps: attaching backside of a thinned semiconductor wafer to a dicing tape; separating individual chips by cutting from front side of the wafer at scribe line but not cut through the dicing tape; flipping and attaching the wafer onto a top surface of a double-sided tape, then removing the dicing tape; attaching bottom surface of the double-sided tape on a supporting plate; filling the space between adjacent chips and covering the whole wafer backside with a molding material; flipping the whole structure and remove the supporting plate; placing solder balls at corresponding positions on electrodes of each chip and performing backflow treatment; finally separating individual chip packages by cutting through molding material at the space between adjacent chip packages with molding material encapsulating the bottom and side of each individual semiconductor chip.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: July 16, 2013
    Assignee: Alpha & Omega Semiconductor, Inc.
    Inventors: Ping Huang, Ruisheng Wu, Lei Duan, Yi Chen, Yuping Gong
  • Publication number: 20130159319
    Abstract: A plurality of web documents that include indicators corresponding to one or more selectable like objects may be obtained. A corresponding web domain associated with each of the plurality of obtained web documents may be determined. A domain total like object count of the indicators corresponding to the one or more selectable like objects may be determined for each one of the obtained plurality of web documents, for each determined corresponding web domain. A candidate group of the corresponding web domains may be determined based on a comparison of a predetermined first threshold value with one or more of the domain total like object counts. A likefarm domain confidence score may be determined for each one of a second group of the corresponding web domains based on a decision tree function that is based on a plurality of domain attributes.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: MICROSOFT CORPORATION
    Inventors: Lei Duan, Will Chin, Seokkyung Chung, Lei Guo, Guenther Schmuelling
  • Publication number: 20130095612
    Abstract: A chip-scale packaging method, with bottom and side of a semiconductor chip encapsulated, includes the following steps: attaching backside of a thinned semiconductor wafer to a dicing tape; separating individual chips by cutting from front side of the wafer at scribe line but not cut through the dicing tape; flipping and attaching the wafer onto a top surface of a double-sided tape, then removing the dicing tape; attaching bottom surface of the double-sided tape on a supporting plate; filling the space between adjacent chips and covering the whole wafer backside with a molding material; flipping the whole structure and remove the supporting plate; placing solder balls at corresponding positions on electrodes of each chip and performing backflow treatment; finally separating individual chip packages by cutting through molding material at the space between adjacent chip packages with molding material encapsulating the bottom and side of each individual semiconductor chip.
    Type: Application
    Filed: October 13, 2011
    Publication date: April 18, 2013
    Inventors: Ping Huang, Ruisheng Wu, Lei Duan, Yi Chen, Yuping Gong
  • Publication number: 20130097144
    Abstract: Systems, methods, and computer-readable storage media for presenting supplemental search results having indications that identified documents have been endorsed by the user and/or social network connections of the user are provided. A search query is received and it is determined that the user's social networking data is available. Documents that have been endorsed by the user and/or social network connections of the user are searched to identify those that satisfy the input search query. The satisfying documents are assigned a relevance score to determine whether each satisfying document is relevant enough to be shown and to determine placement of the document on the SERP relative to standard search results. Upon rendering of the SERP, a supplemental search result identifying documents that were endorsed by the user and/or social network connections of the user is presented, as is an indication about which social network connection(s) of the user endorsed the document.
    Type: Application
    Filed: December 30, 2011
    Publication date: April 18, 2013
    Applicant: MICROSOFT CORPORATION
    Inventors: YAJIE SIAMWALLA, RAJESH KRISHNA SHENOY, LEI DUAN, SATISH KUMAR MUSUKULA, CHARLES C. CARSON, JR., MICHAEL CHING
  • Publication number: 20120239650
    Abstract: Unsupervised clustering can be used for organization of micro-blog or other short length messages into message clusters. Messages can be compared with existing clusters to determine a similarity score. If at least one similarity score is greater than a threshold value, a message can be added to an existing message cluster. If a message is not similar to an existing cluster, the message can be compared against criteria for starting a new message cluster.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 20, 2012
    Applicant: MICROSOFT CORPORATION
    Inventors: KI YEUN KIM, LEI DUAN, SEOKKYUNG CHUNG
  • Publication number: 20120142165
    Abstract: A preparation process of wafer level chip scale packaging that prevents damaging a wafer in molding process is disclosed. In this process, a grinding grove is formed at a top side and around the edge of a wafer before molding is performed. The grinding groove effectively prevents the molding material from overflowing to the edge of the wafer, which avoids the damage of the wafer.
    Type: Application
    Filed: March 10, 2011
    Publication date: June 7, 2012
    Inventors: Ping Huang, Ruisheng Wu, Yi Chen, Lei Duan, Wei Chen, Lihua Bao
  • Publication number: 20120042020
    Abstract: Example methods, apparatuses, or articles of manufacture are disclosed that may be implemented using one or more computing devices to provide or otherwise support micro-blog message filtering.
    Type: Application
    Filed: August 16, 2010
    Publication date: February 16, 2012
    Applicant: Yahoo! Inc.
    Inventors: Pranam Kolari, Ruiqiang Zhang, Yi Chang, Anlei Dong, Zhaohui Zheng, Lei Duan
  • Patent number: 8112436
    Abstract: In one embodiment, access a search query comprising one or more query words, at least one of the query words representing one or more query concepts; access a network document identified for a search query by a search engine, the network document comprising one or more document words, at least one of the document words representing one or more document concepts; semantic-text match the search query and the network document to determine one or more negative semantic-text matches; and construct one or more negative features based on the negative semantic-text matches.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: February 7, 2012
    Assignee: Yahoo ! Inc.
    Inventors: Yumao Lu, Lei Duan, Fan Li, Benoit Dumoulin, Xing Wei
  • Publication number: 20110294262
    Abstract: A semiconductor packaging process with improved die attach method for ultrathin chips package comprises the steps of providing a semiconductor wafer having a wafer frontside and a wafer backside with a plurality of integrated circuit chips (IC chips) formed on the wafer frontside; adhering a supporting substrate onto the wafer frontside through a bonding layer to form a wafer combo; grinding the wafer backside with the supporting substrate and the wafer bonded together; dicing the wafer combo into a plurality of die combos each comprising a substrate piece stacked on top of an IC chip bonded by a bonding layer piece; attaching a die combo onto a die pad of a lead frame with a bottom of the IC chip connected to the lead frame thereof; and removing the substrate piece with the bonding layer piece from the top surface of the IC chip.
    Type: Application
    Filed: May 29, 2010
    Publication date: December 1, 2011
    Inventors: Ping Huang, Ruisheng Wu, Yi Chen, Lei Duan, Wei Chen, Lihua Bao
  • Patent number: 7974970
    Abstract: A system for detecting artificial promotion of a resource, including a search engine operative to index a set incoming links (“inlinks”) which reference the resource, a log module coupled with the search engine and configured to store log data associated with the set of inlinks, a partitioning module coupled with log module and operative to partition the set of inlinks into a plurality of groups of inlinks based on at least one partitioning scheme, a statistics module coupled with the partitioning module and operative to compute a statistic associated with the inlinks within each of the plurality of groups of inlinks, and a computation module coupled with the statistics module and operative to process the computed statistic associated with the inlinks of each of the plurality of groups of inlinks and compute a metric associated with set of inlinks where the metric indicates a level of uniformity of a distribution of values of the respective computed statistics among the plurality of groups of inlinks, and whe
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: July 5, 2011
    Assignee: Yahoo! Inc.
    Inventors: Gilbert Leung, Lei Duan, Dmitri Pavlovski, Su Han Chan, Kostas Tsioutsiouliklis
  • Publication number: 20110072021
    Abstract: In one embodiment, access a search query comprising one or more query words, at least one of the query words representing one or more query concepts; access a network document identified for a search query by a search engine, the network document comprising one or more document words, at least one of the document words representing one or more document concepts; semantic-text match the search query and the network document to determine one or more negative semantic-text matches; and construct one or more negative features based on the negative semantic-text matches.
    Type: Application
    Filed: September 21, 2009
    Publication date: March 24, 2011
    Applicant: YAHOO! INC.
    Inventors: Yumao Lu, Lei Duan, Fan Li, Benoit Dumoulin, Xing Wei
  • Publication number: 20110035345
    Abstract: Exemplary methods and apparatuses are provided which may be used for classifying and indexing segmented portions of web pages and providing related information for use in information extraction and/or information retrieval systems.
    Type: Application
    Filed: August 10, 2009
    Publication date: February 10, 2011
    Applicant: Yahoo! Inc.
    Inventors: Lei Duan, Fan Li, Srinivas Vadrevu, Emre Velipasaoglu, Swapnil Hajela, Deepayan Chakrabarti
  • Publication number: 20100327314
    Abstract: This invention discloses an IGBT device with its collector formed with Ge/Al and associated method of fabrication. The collector is formed on the substrate layer, which is on the back of IGBT, and contains Ge and Al thin films. After thinning and etching the back side of IGBT substrate, Ge and Al are sequentially deposited to form Ge/Al thin films on the back surface of the substrate. An annealing process is then carried out to diffuse Al into Ge thin film layer to form a P-doped Ge layer functioning as the IGBT collector. The present invention is applicable to both non punch through IGBTs as well as punch through IGBTs.
    Type: Application
    Filed: June 28, 2009
    Publication date: December 30, 2010
    Inventors: Ping Huang, Tao Feng, Ruisheng Wu, Yi Chen, Lei Duan
  • Publication number: 20100094868
    Abstract: A system for detecting artificial promotion of a resource, including a search engine operative to index a set incoming links (“inlinks”) which reference the resource, a log module coupled with the search engine and configured to store log data associated with the set of inlinks, a partitioning module coupled with log module and operative to partition the set of inlinks into a plurality of groups of inlinks based on at least one partitioning scheme, a statistics module coupled with the partitioning module and operative to compute a statistic associated with the inlinks within each of the plurality of groups of inlinks, and a computation module coupled with the statistics module and operative to process the computed statistic associated with the inlinks of each of the plurality of groups of inlinks and compute a metric associated with set of inlinks where the metric indicates a level of uniformity of a distribution of values of the respective computed statistics among the plurality of groups of inlinks, and whe
    Type: Application
    Filed: October 9, 2008
    Publication date: April 15, 2010
    Applicant: Yahoo! Inc.
    Inventors: Gilbert Leung, Lei Duan, Dmitri Pavlovski, Su Han Chan, Kostas Tsioutsiouliklis
  • Patent number: 7392186
    Abstract: A system and method for effectively implementing an optimized language model for speech recognition includes initial language models each created by combining source models according to selectable interpolation coefficients that define proportional relationships for combining the source models. A rescoring module iteratively utilizes the initial language models to process input development data for calculating word-error rates that each correspond to a different one of the initial language models. An optimized language model is then selected from the initial language models by identifying an optimal word-error rate from among the foregoing word-error rates. The speech recognizer may then utilize the optimized language model for effectively performing various speech recognition procedures.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: June 24, 2008
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Lei Duan, Gustavo Abrego, Xavier Menendez-Pidal, Lex Olorenshaw
  • Patent number: 7353173
    Abstract: The present invention comprises a system and method for implementing a Mandarin Chinese speech recognizer with an optimized phone set, and may include a recognizer configured to compare input speech data to phone strings from a vocabulary dictionary that is implemented according to an optimized Mandarin Chinese phone set. The optimized Mandarin Chinese phone set may be implemented with a phonetic technique to separately include consonantal phones and vocalic phones. For reasons of system efficiency, the optimized Mandarin Chinese phone set may preferably be implemented in a compact manner to include only a minimum required number of consonantal phones and vocalic phones to accurately represent Mandarin Chinese speech during the speech recognition procedure.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: April 1, 2008
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Xavier Menendez-Pidal, Lei Duan, Jingwen Lu, Lex Olorenshaw
  • Patent number: 7353174
    Abstract: The present invention comprises a system and method for effectively implementing a Mandarin Chinese speech recognition dictionary, and may include a recognizer configured to compare input speech data to phone strings from a vocabulary dictionary that is implemented according to an optimized Mandarin Chinese phone set. The optimized Mandarin Chinese phone set may efficiently be implemented by utilizing an allophone and phonemic variation technique. In addition, the foregoing vocabulary dictionary may be implemented by utilizing unified dictionary optimization techniques to provide robust and accurate speech recognition. Furthermore, the vocabulary dictionary may be implemented as an optimized dictionary to accurately recognize either Northern Mandarin Chinese speech or Southern Mandarin Chinese speech during the speech recognition procedure.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: April 1, 2008
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Xavier Menendez-Pidal, Lei Duan, Jingwen Lu, Lex Olorenshaw