Abstract: A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.

Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.

Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A vapor chamber including a first plate, second plate, plurality of first support structures, plurality of second support structures, and at least one tubular heat transfer structure is provided. The first plate and the second plate define an interior cavity having a first, second, and third portion, the first, second, and third portion each have a first, second, and third depth, respectively, the plurality of first support structures is disposed in the first portion, the plurality of support structures is disposed in the second portion and the third portion, respectively, the at least one tubular heat transfer structure is disposed in the first portion and includes a first working fluid having a first working fluid circulation path, the first portion, the second portion, and the third portion include a second working fluid having a second working fluid circulation path different from the first working fluid circulation path.

Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat dissipating apparatus includes a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.

Abstract: The disclosure provides a manufacturing method of a flat heat exchanger. The manufacturing method includes flattening a round heat pipe to a flat heat pipe, welding a first part of the flat heat pipe, and welding a second part of the flat heat pipe. After welding the second part of the flat heat pipe, the manufacturing method further includes cutting off part(s) of the first part or the second part of the flat heat pipe and trimming the flat heat pipe. Before welding the first part or the second part of the flat heat pipe, there is no pipe shrinkage process performed on the flat heat pipe.

Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.

Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

Abstract: A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.