Patents by Inventor Lei-Lei LIU

Lei-Lei LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210293486
    Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.
    Type: Application
    Filed: August 5, 2020
    Publication date: September 23, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Publication number: 20210195799
    Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
    Type: Application
    Filed: June 11, 2020
    Publication date: June 24, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG
  • Publication number: 20210148646
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung SUN, Te-Hsuan CHIN, Lei-Lei LIU
  • Patent number: 10935326
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: March 2, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin, Lei-Lei Liu
  • Publication number: 20200400382
    Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.
    Type: Application
    Filed: April 1, 2020
    Publication date: December 24, 2020
    Inventors: Jen-Chih CHENG, Lei-Lei LIU
  • Publication number: 20200326139
    Abstract: The disclosure provides a flat heat exchanger. The flat heat exchanger includes a flat pipe part, a first welded part, a second welded part and a capillary structure. The flat pipe part has a fluid channel. The first welded part and the second welded part are respectively located at two opposite ends of the flat pipe part to close two opposite ends of the fluid channel. At least part of the capillary is located within the fluid channel of the flat pipe part.
    Type: Application
    Filed: January 25, 2020
    Publication date: October 15, 2020
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Lei Lei LIU, Xiao Min ZHANG, Ding-Guo ZHOU
  • Patent number: 10697710
    Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 30, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu
  • Publication number: 20200191492
    Abstract: A method for manufacturing a roll-bond heat exchanger has steps of: (1) A preparing step: preparing an in-process roll-bond plate that has a main plate with a bulged structure, and a degassing portion with a tube; (2) A degassing step: removing air from the bulged structure through the tube; (3) A filling step: filling refrigerant into the bulged structure; (4) A pressing step: pressing the bulged structure flat to form a pressed portion; (5) A cutting step: cutting the degassing portion to form a cut portion on the main plate; and (6) A sealing step: welding the cut portion. The main plate and the degassing portion are integrally formed as a single part and the degassing portion is able to be directly connected with the vacuum filling machine. Accordingly, processing steps and manpower for manufacturing the roll-bond heat exchanger are reduced.
    Type: Application
    Filed: October 4, 2019
    Publication date: June 18, 2020
    Inventors: Lei Lei Liu, Yousen Lin
  • Publication number: 20190331433
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 31, 2019
    Applicant: COOLER MASTER CO.,LTD.
    Inventors: Chien-Hung SUN, Te-Hsuan CHIN, Lei-Lei LIU
  • Patent number: 10410954
    Abstract: A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: September 10, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu
  • Patent number: 10371458
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: August 6, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin, Lei-Lei Liu
  • Patent number: 10330392
    Abstract: A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 25, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Lei-Lei Liu, Xiao-Min Zhang
  • Publication number: 20190049190
    Abstract: A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
    Type: Application
    Filed: October 12, 2018
    Publication date: February 14, 2019
    Inventors: Lei-Lei LIU, Xiao-Min ZHANG
  • Publication number: 20180372419
    Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: Lei-Lei LIU, Xiao-Min ZHANG, Jen-Chih CHENG
  • Publication number: 20180356162
    Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Applicant: COOLER MASTER CO.,LTD.
    Inventors: Chien-Hung SUN, Lei-Lei LIU
  • Patent number: 10126069
    Abstract: A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: November 13, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu, Xiaomin Zhang
  • Patent number: 10077946
    Abstract: In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: September 18, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu
  • Patent number: 9939205
    Abstract: A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: April 10, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu, Xiao-Min Zhang
  • Publication number: 20170292793
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Application
    Filed: November 16, 2016
    Publication date: October 12, 2017
    Inventors: Chien-Hung SUN, Te-Hsuan CHIN, Lei-Lei LIU
  • Publication number: 20170227298
    Abstract: A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.
    Type: Application
    Filed: September 6, 2016
    Publication date: August 10, 2017
    Inventors: Chien-Hung SUN, Lei-Lei LIU, Xiaomin ZHANG