Patents by Inventor Lei-Lei LIU

Lei-Lei LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160330868
    Abstract: A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.
    Type: Application
    Filed: June 10, 2015
    Publication date: November 10, 2016
    Inventors: CHIEN-HUNG SUN, Lei-Lei LIU
  • Publication number: 20160003555
    Abstract: A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.
    Type: Application
    Filed: April 2, 2015
    Publication date: January 7, 2016
    Inventors: CHIEN-HUNG SUN, Lei-Lei LIU, Xiao-Min ZHANG
  • Patent number: 9003658
    Abstract: A method for enclosing a heat pipe with metal is disclosed. The method includes the steps of: a) providing a tube made of a metal; b) putting the heat pipe in a hollow of the tube; and c) stretching the tube to shrink an inner diameter of the tube for tightly enclosing the heat pipe.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Cooler Master Development Corporation
    Inventors: Chang-Yin Chen, Lei-Lei Liu
  • Publication number: 20140345137
    Abstract: A method for manufacturing a flat heat pipe with sectional differences includes following steps. First, form a plurality of grooves on an inner wall of a pipe body having one outer diameter. Subsequently, form a plurality of tubular sectional difference portions having various outer diameters on the pipe body. Then, degass an interior of the pipe body into vacuum and seal both ends thereof. Finally, press the respective sectional difference portions of the pipe body into flat.
    Type: Application
    Filed: August 12, 2014
    Publication date: November 27, 2014
    Inventors: Chang-Yin CHEN, Lei-Lei LIU, Lin-Chuan YEN
  • Publication number: 20140060793
    Abstract: A plate-type heat exchanger includes a casing having a chamber therein; and a support structure in the chamber and including a plurality of frameworks, any two of the frameworks distributing to each other at a distance; and a plurality of support portions, the support portions connecting with the frameworks in order to surround a plurality of hollow areas and being vertical, each of the support portions and each of the frameworks being combined by means of a twisted stagger; wherein the upper and lower positions of the support portion form an urging edge respectively, the two urging edges being against the upper inner side and the lower inner side of the casing respectively.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 6, 2014
    Applicant: COOLER MASTER DEVELOPMENT CORPORATION
    Inventors: Chien-Hung SUN, Lei-Lei LIU, Chun ZHOU, Xue-Mei WANG
  • Publication number: 20130180688
    Abstract: In a heat-dissipating module and a method for manufacturing the same, a hollow aluminum tube is put on a corresponding heat pipe to form an aluminum-skinned heat pipe. Then, one or more aluminum-skinned heat pipes are disposed in a casting space of a die casting mold. Fins are disposed into the die casting mold. Molten aluminum materials are filled in the casting space of the die casting mold to form a heat-dissipating module. By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe and connect with the fins, thereby finishing the heat-dissipating module.
    Type: Application
    Filed: January 16, 2012
    Publication date: July 18, 2013
    Inventors: Chia-Yu Lin, Lei-Lei Liu
  • Patent number: 8485698
    Abstract: A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: July 16, 2013
    Assignee: Cooler Master Co., Ltd.
    Inventors: Chia-Chun Cheng, Lei-Lei Liu
  • Publication number: 20130175007
    Abstract: The present invention relates to a heat-conducting module and a method for manufacturing the same. A hollow aluminum tube (110) is put on a corresponding heat pipe (111) to form an aluminum-skinned heat pipe (11). Then, one or more aluminum-skinned heat pipes (11) are disposed in a casting space (22) of a die casting mold (2). Molten aluminum materials are filled in the die casting space (11) of the die casting mold (2) to form a heat-conducting module (1). By using a die casting process, molten aluminum materials are used to cover at least one aluminum-skinned heat pipe (11), thereby finishing the heat-conducting module (1).
    Type: Application
    Filed: January 9, 2012
    Publication date: July 11, 2013
    Inventors: Chia-Yu LIN, Lei-Lei Liu
  • Publication number: 20130107547
    Abstract: A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.
    Type: Application
    Filed: October 26, 2011
    Publication date: May 2, 2013
    Inventors: Chia-Chun Cheng, Lei-Lei Liu
  • Publication number: 20130105131
    Abstract: The flattened heat pipe includes a flattened tube, a first wick structure, a second wick structure and a working fluid. The flattened tube has an annular wall and a chamber formed within the annular wall. The first wick structure is disposed on a portion of the annular wall. The second wick structure is disposed on another portion of the annular wall, and not overlapping with each other. The working fluid is filled in the chamber.
    Type: Application
    Filed: January 13, 2012
    Publication date: May 2, 2013
    Inventors: Chang-Yin Chen, Lei-Lei Liu
  • Publication number: 20130037242
    Abstract: A thin-type heat pipe structure includes a flat pipe, a second capillary structure, a third capillary structure, and a working fluid. The flat pipe has two boards and a containing chamber. A first capillary structure is set on the inner surface of the boards. The second capillary structure is contained in the containing chamber and covers a part of the first capillary structure. The third capillary structure is a stripe, contained in the containing chamber and clipped between the second capillary structure and another part of the first capillary structure. The working fluid is filled in the containing chamber. The overall design speeds up inner air's outflow and inner liquid's backflow.
    Type: Application
    Filed: August 9, 2011
    Publication date: February 14, 2013
    Inventors: Chang-Yin CHEN, Lei-Lei Liu
  • Publication number: 20120227933
    Abstract: The present invention provides a flat heat pipe with sectional differences and a method for manufacturing the same. The heat pipe has a flat hollow pipe body. A working fluid is sealed in the pipe body. The pipe body is provided along its length with a plurality of flat sectional difference portions having different widths. A connecting portion is formed between the sectional difference portions. The inner wall of the pipe body is formed with a plurality of grooves. The pitch between the grooves in the sectional difference portion of a relatively large width is larger than the pitch between the grooves in the sectional difference portion of a relatively small width.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 13, 2012
    Inventors: Chang-Yin CHEN, Lei-Lei LIU, Lin-Chuan YEN
  • Publication number: 20120175097
    Abstract: A method for enclosing a heat pipe with metal is disclosed. The method includes the steps of: a) providing a tube made of a metal; b) putting the heat pipe in a hollow of the tube; and c) stretching the tube to shrink an inner diameter of the tube for tightly enclosing the heat pipe.
    Type: Application
    Filed: December 8, 2011
    Publication date: July 12, 2012
    Inventors: Chang-Yin CHEN, Lei-Lei LIU
  • Publication number: 20120168435
    Abstract: A folding vapor chamber includes folding boards engaged and covered with one another, a folding edge formed between the adjacent folding boards and provided for connecting the folding boards integrally, and the adjacent folding boards being bent and folded by the corresponding folding edge and engaged with one another, and a capillary tissue installed at an internal surface between the folding boards. The casing is formed by the folding edge to reduce the length of the sealing edge of the vapor chamber, so as to achieve the effects of lowering the defective rate of the edge sealing operation, and preventing the sealing edge from being cracked easily.
    Type: Application
    Filed: January 4, 2011
    Publication date: July 5, 2012
    Inventors: Chang-Yin Chen, Lei-Lei Liu, Meng-Zhou Wang
  • Publication number: 20120152942
    Abstract: A vapor chamber includes a first board, a second board sealed with the first board, and a cavity formed between the first and second boards, and the cavity contains a first support arm and a second support arm corresponding to the first and second boards respectively, and the first support arm and the second support arm are engaged with each other along the first and second boards and arranged adjacent to each other. With the engagement of the first and second support arms, the first and second boards of the vapor chamber can be supported and pulled to achieve effect of preventing the first and second boards from being recessed or protruded.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Inventors: Chang-Yin CHEN, Lei-Lei LIU, Meng-Zhou WANG