Patents by Inventor Lei Lei

Lei Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11490006
    Abstract: Provided are a photographing method and device, a mobile terminal and a storage medium. The method includes: responsive to detecting a photographing instruction, continuously acquiring a target number of frames of images meeting a preset photographing parameter, the target number being N and determined by a mobile terminal based on a present photographing scenario and N being a positive integer; and determining a target image according to image quality of the N frames of images and outputting the target image. Through the method, the mobile terminal is more intelligent.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: November 1, 2022
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Chaoyu Feng, Shilong Ji, Lei Lei
  • Publication number: 20220323512
    Abstract: The present disclosure discloses a methicillin-resistant staphylococcus aureus mutant strain and use thereof, and belongs to the field of molecular biology and microorganisms. The methicillin-resistant staphylococcus aureus mutant strain disclosed by the present disclosure has a relatively low exopolysaccharide synthesis ability and a relatively low biofilm metabolism ability, but it is sensitive to an antibiotic cefoxitin. The mutant strain can be used for treating a related disease caused by methicillin-resistant staphylococcus aureus infection through an endogenous ecological treatment strategy. The present disclosure provides a new idea for treating the disease.
    Type: Application
    Filed: February 25, 2022
    Publication date: October 13, 2022
    Applicant: West China Hospital of Sichuan University
    Inventors: Shizhou Wu, Lei Lei, Yunjie Liu
  • Patent number: 11458639
    Abstract: A tool system for a robotic arm is provided. The tool system includes a tool support structure; a tool structure, coupled to the tool support structure, having at least one structural member; a connector mechanically coupled to the structural member and shaped for engaging the tool support structure; and a control unit mechanically coupled to the at least one structural member and configured to sense and adjust performance of the tool structure based on determining a connection to the tool support structure.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: October 4, 2022
    Assignee: MUJIN, INC.
    Inventors: Lei Lei, Yixuan Zhang
  • Patent number: 11421940
    Abstract: A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: August 23, 2022
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei Liu, Xue Mei Wang
  • Publication number: 20220219317
    Abstract: An object gripping assembly and associated systems and methods are disclosed herein. In some embodiments, the object gripping assembly includes a first carrying plate with a first mounting track extending along a first axis and two or more second carrying plates movably carried by the first mounting track. Each of the two or more second carrying plates can include a second mounting track extending along a second axis at least and extendable gripping components movably carried by the second mounting track. A first pitch adjusting component can be operably coupled the two or more second carrying plates to controllably change the pitch of the two or more second carrying plates along the first mounting track. A second pitch adjusting component can be operably coupled to the extendable gripping components on a corresponding second carrying plate to controllably change the pitch of the extendable gripping components along the second mounting track.
    Type: Application
    Filed: October 20, 2021
    Publication date: July 14, 2022
    Inventors: Lei Lei, Xu Chen, Yixuan Zhang, Pai Zheng, Yufan Du, Hironori Mizoguchi, Shekhar Gupta, Rosen Nikolaev Diankov
  • Publication number: 20220214115
    Abstract: A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 7, 2022
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Patent number: 11366220
    Abstract: A method is disclosed for designing a sparse array for an automotive radar. The method moves each of a number of antenna elements to candidate neighboring grid positions starting from an initial random seed placement to iteratively search for a placement of antenna elements that improves upon a cost function. The cost function for each candidate placement may be determined from characteristics of the FFT response associated with the candidate placement. The method may search for a candidate placement with the lowest cost function among the multiple candidate placements based on the random seed placement. The search may be repeated for a large number of random seed placements to find the candidate placement with the lowest cost function corresponding to each random seed placement. The method may compare the lowest cost functions corresponding to the multiple random seed placements to determine an optimized placement having the minimum cost function.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: June 21, 2022
    Assignee: BAIDU USA LLC
    Inventors: Lei Lei, Davy Huang
  • Patent number: 11353595
    Abstract: A method is disclosed for suppressing sidelobes due to artifacts introduced by FFT operations during automotive radar signal processing. Sidelobes of a stronger target from the FFT operations may bury the response from a weaker target when there are multiple targets. The method estimates the sidelobes of an identified target from a measured FFT response and subtracts the estimated sidelobes from the measured FFT response. The identified target may be the strongest target from the measured FFT response. The method estimates the sidelobes to suppress the sidelobes with respect to the peak signal of the identified target. After the estimated sidelobes of the identified target are removed, the updated FFT response may reveal other targets that had been buried. The method may identify additional targets to estimate their sidelobes and may iteratively remove the estimated sidelobes of additional targets from the FFT until a desired sidelobe residual level is achieved.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: June 7, 2022
    Assignee: BAIDU USA LLC
    Inventors: Lei Lei, Mei-Li Chi, Davy Huang
  • Publication number: 20220163267
    Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.
    Type: Application
    Filed: April 17, 2021
    Publication date: May 26, 2022
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei Liu, Xue Mei Wang
  • Publication number: 20220136778
    Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.
    Type: Application
    Filed: February 17, 2021
    Publication date: May 5, 2022
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Xue Mei WANG, Lei Lei LIU
  • Patent number: 11320211
    Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: May 3, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Lei-Lei Liu, Xiao-Min Zhang, Jen-Chih Cheng
  • Patent number: 11313626
    Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: April 26, 2022
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei Liu, Xue Mei Wang
  • Patent number: 11313628
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: April 26, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin, Lei-Lei Liu
  • Publication number: 20220082333
    Abstract: A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.
    Type: Application
    Filed: February 1, 2021
    Publication date: March 17, 2022
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Publication number: 20210407052
    Abstract: A method for processing an image includes first obtaining a media image. The media image has a target scene object at least partially shielded. A target shielding object is determined from the media image. The target shielding object at least partially shields the target scene object. Image inpainting is performed on a first region of the media image corresponding to the target shielding object to generate a target media image.
    Type: Application
    Filed: December 23, 2020
    Publication date: December 30, 2021
    Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Xiaotao WANG, Yanan LI, Guangqi SHAO, Lei LEI
  • Patent number: 11158027
    Abstract: An image capturing method includes: displaying an image capturing preview interface of an image capturing program, the image capturing preview interface displaying a preview image; identifying an image capturing scene of the preview image by calling a machine learning model; and activating a moon image capturing mode in the image capturing program when the image capturing scene is a moon image capturing scene, the moon image capturing mode being an image capturing mode configured to capture image of the moon in a night sky.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: October 26, 2021
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Lei Lei, Chaoyu Feng
  • Publication number: 20210306558
    Abstract: Provided are a photographing method and device, a mobile terminal and a storage medium. The method includes: responsive to detecting a photographing instruction, continuously acquiring a target number of frames of images meeting a preset photographing parameter, the target number being N and determined by a mobile terminal based on a present photographing scenario and N being a positive integer; and determining a target image according to image quality of the N frames of images and outputting the target image. Through the method, the mobile terminal is more intelligent.
    Type: Application
    Filed: September 9, 2020
    Publication date: September 30, 2021
    Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Chaoyu FENG, Shilong JI, Lei LEI
  • Publication number: 20210293486
    Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.
    Type: Application
    Filed: August 5, 2020
    Publication date: September 23, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Publication number: 20210229730
    Abstract: A drive mechanism which is adapted for use with a swing device includes at least one electromagnetic driving unit and a control unit. The at least one electromagnetic driving unit is adapted to be pivotally connected to a bottom of the swing device. The control unit is electrically connected to the at least one electromagnetic driving unit for controlling the at least one electromagnetic driving unit to be activated and deactivated, so as to generate an intermittent magnetic force to drive swinging movement of the swing device. The swing device including the drive mechanism is also disclosed.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 29, 2021
    Applicant: Wonderland Switzerland AG
    Inventor: Lei-Lei ZHENG
  • Publication number: 20210195799
    Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
    Type: Application
    Filed: June 11, 2020
    Publication date: June 24, 2021
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG