Abstract: A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.

Abstract: An illustrative example object detection system includes a plurality of first transmitters that respectively transmit a first signal at a first time, a plurality of second transmitters that respectively transmit a second signal at a second time, a plurality of receivers that receive the signals, and a processor that is configured to determine whether a transmission timing phase shift exists between the received first signals and the received second signals based on a relationship between matrices including the received signals.

Abstract: A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.

Abstract: Genes associated with nitrogen utilization efficiency (NUE) in plants are provided. The gene VRN1N was identified as TaNUE1 in chromosome 5A of the wheat cultivar Jagger and is encompassed by quantitative trait locus Qnue.osu-5A. VRN1N is regulated by nitrogen is associated with enhanced NUE by plants which contain the gene. In addition, the gene ANR1 from wheat cultivar Jagger has also been identified as involved in nitrogen metabolism. Methods for genetically engineering plants to contain and express one or both of VRN1N and ANR1 are also provided, as are genetically modified plants that have been transformed with one or both of the genes, and plants that have been bred conventionally and selected for the presence of one or both genes.

Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.

Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

Abstract: A drive mechanism which is adapted for use with a swing device includes two symmetrically-disposed electromagnetic driving units and a control unit. The electromagnetic driving units are adapted to be pivotally connected to a bottom of the swing device. The control unit is electrically connected to the electromagnetic driving units for controlling the electromagnetic driving units to be alternately activated and deactivated, so as to generate an intermittent magnetic force to drive swinging movement of the swing device. The swing device including the drive mechanism is also disclosed.

Abstract: A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.

Abstract: In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.

Abstract: A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.

Abstract: The present disclosure discloses method for calculating an area of a fingerprint overlapping region, including: collecting a to-be-matched fingerprint to obtain a to-be-matched fingerprint image; searching multiple pairs of matching characteristic points between the to-be-matched fingerprint image and a preset template fingerprint image; obtaining an image offset of the to-be-matched fingerprint image according to the multiple pairs of matching characteristic points; based on the image offset, adjusting a position of the to-be-matched fingerprint image to obtain an overlapping region between the to-be-matched fingerprint image and the preset template fingerprint image; and calculating a total number of image pixels within the overlapping region, and calculating an area of the overlapping region based on the total number of image pixels within the overlapping region.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: The disclosure is related to a framework that enables server-side controlling of data sampling at client devices. An application executing on a client device samples data related to various aspects of the application, generates a log file containing the sample data and transmits the log file to the server. The application samples the data based on specified criteria, e.g., specified events, specified actions of a user of the client device, at a specified sampling rate. The framework enables controlling the sampling of such data from the server. The framework can be used to configure various parameters of the sampling, including a number of users to be sampled, a set of events to be sampled, a sampling rate for the events, etc. After the configuration is determined, the server transmits a configuration file to the client device, which performs the sampling based on the configuration in the configuration file.

Abstract: A microfluidic device and method is provided for concentrating particles in a fluid sample. The microfluidic device has a chamber, wherein the chamber has a filtering unit defining a first compartment and a second compartment, the first compartment being in fluid communication with the second compartment and being for receiving a fluid sample containing particles, the filtering unit being configured to selectively retain particles of the fluid sample based on a size of the particles, at a sub-region of the first compartment as the fluid sample flows from the first compartment to the second compartment; and an acoustic transducer configured to generate acoustic waves in the sub-region to disperse the particles.

Abstract: A sensor is provided for detecting and characterizing particles in a fluid. The sensor has a microfluidic channel for receiving the fluid sample, an acoustic transducer module configured to generate a standing wave for concentrating the particles in a region of the microfluidic channel; an optical detection module configured to detect optical signals scattered by the particles upon illuminating the region of the fluid sample with a light source; and a data processing module configured to characterize the particles of the fluid sample based on the optical signals using a classifier.

Abstract: A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.