Patents by Inventor Lei Wei

Lei Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11815315
    Abstract: A flexible heat dissipation device includes an evaporator, a vapor tube, a liquid tube and a condenser. The evaporator has at least one vapor chamber. A capillary structure and a working fluid are received in the vapor chamber. Two ends of the vapor tube is respectively in communication with one end of the evaporator and the condenser. Two ends of the liquid tube are respectively in communication with the evaporator and the condenser, whereby the evaporator, the vapor tube, the condenser and the liquid tube form a loop for the working fluid to flow through. At least one bellows section is disposed on one or both of the vapor tube and the liquid tube. The bellows section has multiple waved stripes. More than one of the heights, widths and pitches of the multiple waved stripes are equal to or unequal to each other.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: November 14, 2023
    Assignee: Asia Vital Components (China) Co., Ltd.
    Inventors: Han-Min Liu, Xiao-Xiang Zhou, Shi-Lei Wei
  • Publication number: 20230351639
    Abstract: Disclosed are a point cloud encoding and decoding method, an encoder and a decoder. The method comprises: acquiring geometric information and attribute information of an input point cloud; determining a maximum allowable value of a sampling period when the input point cloud is subjected to level-of-detail (LOD) division; determining a preset value of the sampling period on the basis of the maximum allowable value of the sampling period; processing the input point cloud according to the preset value of the sampling period and the geometric information, so as to obtain at least one refinement layer and at least one detail layer; and encoding the attribute information by using the at least one refinement layer and the at least one detail layer, so as to generate a code stream, and writing the preset value of the sampling period into the code stream.
    Type: Application
    Filed: June 28, 2023
    Publication date: November 2, 2023
    Inventors: SHUAI WAN, LEI WEI, FUZHENG YANG
  • Publication number: 20230317800
    Abstract: Memory circuitry comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above a conductor tier. The insulative tiers and the conductive tiers of the laterally-spaced memory blocks extend from a memory-array region into a stair-step region. Strings of memory cells comprise operative channel-material strings that extend through the insulative tiers and the conductive tiers in individual of the laterally-spaced memory blocks in the memory-array region. The operative channel-material strings directly electrically couple with conductor material of the conductor tier. The individual laterally-spaced memory blocks comprise an intermediate region between the operative channel-material strings and the stair-step region. A dummy through-array-via (TAV) extends through the insulative tiers and the conductive tiers in the intermediate region in the individual laterally-spaced memory blocks.
    Type: Application
    Filed: April 4, 2022
    Publication date: October 5, 2023
    Applicant: Micron Technology, Inc.
    Inventors: Dhirendra Dhananjay Vaidya, Lei Wei, Gurpreet Lugani, Sumeet C. Pandey
  • Patent number: 11778837
    Abstract: A memory system may include separate amounts or types of resistive material that may be deposited over memory cells and conductive vias using separate resistive layers in the access lines. A first resistive material layer may be deposited over the memory cells prior to performing an array termination etch used to deposit the conductive via. The array termination etch may remove the first resistive material over the portion of the array used to deposit the conductive via. A second resistive material layer may be deposited after the etch has occurred and the conductive via has been formed. The second resistive material layer may be deposited over the conductive via.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: October 3, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Lei Wei, Pengyuan Zheng, Kevin Lee Baker, Efe Sinan Ege, Adam Thomas Barton, Rajasekhar Venigalla
  • Publication number: 20230252684
    Abstract: Provided is a method for predicting attribute information, a coder, a decoder, and a storage medium. The coder determines a current Morton code corresponding to a point to be predicted in a point cloud to be coded, determines a target Morton code corresponding to the point to be predicted based on the current Morton code and according to a preset neighbor information table, judges whether a neighbor point of the point to be predicted exists in the point cloud to be coded according to the target Morton code, and performs prediction to obtain a predicted attribute value of the point to be predicted according to attribute reconstruction information of the neighbor point in response to that the neighbor point exists in the point cloud to be coded.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Inventors: SHUAI WAN, LEI WEI, FUZHENG YANG, JUNYAN HUO, YANZHUO MA, LIHUI YANG
  • Publication number: 20230237705
    Abstract: A method for level partition of a point cloud includes: decoding a point cloud bitstream, the point cloud bitstream including geometry information and attribute information of the point cloud; determining a maximum permissible value of a first syntax element in the point cloud bitstream; parsing the point cloud bitstream to determine a value of the first syntax element according to the maximum permissible value; determining, according to the value of the first syntax element, a number of levels of detail (LODs) in a process of decoding the attribute information; and decoding the attribute information according to the number of the LODs and the geometry information, to determine a reconstructed point cloud of the point cloud.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Inventors: Shuai WAN, Lei WEI, Fuzheng YANG, Xiaobin DING
  • Patent number: 11704840
    Abstract: Provided is a method for predicting attribute information, a coder, a decoder, and a storage medium. The coder determines a current Morton code corresponding to a point to be predicted in a point cloud to be coded, determines a target Morton code corresponding to the point to be predicted based on the current Morton code and according to a preset neighbor information table, judges whether a neighbor point of the point to be predicted exists in the point cloud to be coded according to the target Morton code, and performs prediction to obtain a predicted attribute value of the point to be predicted according to attribute reconstruction information of the neighbor point in response to that the neighbor point exists in the point cloud to be coded.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: July 18, 2023
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Shuai Wan, Lei Wei, Fuzheng Yang, Junyan Huo, Yanzhuo Ma, Lihui Yang
  • Publication number: 20230225137
    Abstract: Methods, systems, and devices for efficient fabrication of memory structures are described. A multi-deck memory device may be fabricated using a sequence of fabrication steps that include depositing a first metal layer, depositing a cell layer on the first metal layer to form memory cells of the first memory deck, and depositing a second metal layer on the cell layer. The second metal layer may be deposited using a single deposition process rather than using multiple deposition processes. A second memory deck may be formed on the second metal layer such that stacked memory cells from the first and second deck share the use of the second metal layer. Using a single deposition process for the second metal layer may decrease the quantity of fabrication steps used to fabricate the multi-deck memory array and reduce or eliminate the exposure of the cell material to metal etchants.
    Type: Application
    Filed: March 21, 2023
    Publication date: July 13, 2023
    Inventors: Don Koun Lee, Kevin Lee Baker, Lei Wei
  • Patent number: 11663745
    Abstract: Provided is a method for predicting attribute information, a coder, a decoder, and a storage medium. The coder determines a current Morton code corresponding to a point to be predicted in a point cloud to be coded, determines a target Morton code corresponding to the point to be predicted based on the current Morton code and according to a preset neighbor information table, judges whether a neighbor point of the point to be predicted exists in the point cloud to be coded according to the target Morton code, and performs prediction to obtain a predicted attribute value of the point to be predicted according to attribute reconstruction information of the neighbor point in response to that the neighbor point exists in the point cloud to be coded.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: May 30, 2023
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Shuai Wan, Lei Wei, Fuzheng Yang, Junyan Huo, Yanzhuo Ma, Lihui Yang
  • Patent number: 11626452
    Abstract: Methods, systems, and devices for efficient fabrication of memory structures are described. A multi-deck memory device may be fabricated using a sequence of fabrication steps that include depositing a first metal layer, depositing a cell layer on the first metal layer to form memory cells of the first memory deck, and depositing a second metal layer on the cell layer. The second metal layer may be deposited using a single deposition process rather than using multiple deposition processes. A second memory deck may be formed on the second metal layer such that stacked memory cells from the first and second deck share the use of the second metal layer. Using a single deposition process for the second metal layer may decrease the quantity of fabrication steps used to fabricate the multi-deck memory array and reduce or eliminate the exposure of the cell material to metal etchants.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 11, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Don Koun Lee, Kevin Lee Baker, Lei Wei
  • Patent number: 11616098
    Abstract: An example apparatus includes a three-dimensional (3D) memory array including a sense line and a plurality of vertical stacks. Each respective on of the vertical stacks includes a different respective portion of the sense line, a first memory cell coupled to that portion of the sense line, a second memory cell coupled to that portion of the sense line, a first access line coupled to the first memory cell and a second access line coupled to the second memory cell. The first and second access lines are perpendicular to the sense line.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: March 28, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Lingming Yang, Karthik Sarpatwari, Fabio Pellizzer, Nevil N. Gajera, Lei Wei
  • Publication number: 20230083258
    Abstract: A bilateral teleoperation system includes: a primary-end operation platform and a secondary-end operation platform. The primary-end operation platform includes: a primary-end support, primary-end mechanical arms, a mechanical hand control assembly, and a first controller, a root end of the primary-end mechanical arm being arranged on the primary-end support, and a tail end of the primary-end mechanical arm being connected to the mechanical hand control assembly.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 16, 2023
    Inventors: Kun XIONG, Longfei Zhao, Dongsheng Zhang, Lei Wei, Cheng Zhou, Haitao Wang, Wangwei Lee, Ke Chen, Bidan Huang, Yi Ren
  • Publication number: 20230075924
    Abstract: A manipulator is provided. The manipulator includes at least two mechanical fingers. Each of the at least two mechanical fingers includes a first finger segment, a second finger segment, and a third finger segment, a bottom portion of the third finger segment of the respective mechanical finger is movably connected to a top portion of the second finger segment of the respective mechanical finger, and a bottom portion of the second finger segment of the respective mechanical finger is movably connected to a top portion of the first finger segment of the respective mechanical finger. The manipulator further includes a finger driving assembly for each of the at least two mechanical fingers. The finger driving assembly for each of the at least two mechanical fingers includes a plurality of motors that are configured to drive a different one of the finger segments of the respective mechanical finger.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 9, 2023
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Dongsheng ZHANG, Chufan GUO, Kun XIONG, Lei WEI
  • Patent number: 11600666
    Abstract: Some embodiments include an arrangement having a memory tier with memory cells on opposing sides of a coupling region. First sense/access lines are under the memory cells, and are electrically connected with the memory cells. A conductive interconnect is within the coupling region. A second sense/access line extends across the memory cells, and across the conductive interconnect. The second sense/access line has a first region having a second conductive material over a first conductive material, and has a second region having only the second conductive material. The first region is over the memory cells, and is electrically connected with the memory cells. The second region is over the conductive interconnect and is electrically coupled with the conductive interconnect. An additional tier is under the memory tier, and includes CMOS circuitry coupled with the conductive interconnect. Some embodiments include methods of forming multitier arrangements.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: March 7, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Lei Wei, Hongqi Li
  • Publication number: 20230026300
    Abstract: A hand exoskeleton includes at least one mechanical finger and a mechanical palm; and the mechanical finger includes a finger section, a rod assembly and a motor, the finger section includes a first finger section and a second finger section, and the rod assembly includes a first rod assembly and a second rod assembly. The motor capable of controlling the hand exoskeleton is arranged in the hand exoskeleton, and motion constraint on the finger section is realized by constraining a rod through the motor in the movement process of the hand exoskeleton, so that motion limitation on the hand exoskeleton is realized.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Inventors: Dongsheng ZHANG, Chuanzheng NI, Xianyu SONG, Kun XIONG, Lei WEI, Zhengyou ZHANG
  • Publication number: 20230010791
    Abstract: The present disclosure relates to systems, methods, and non-transitory computer-readable media that utilize pre-signed key rotation transaction requests for initiating transactions to rotate one or more cryptographic keys of a user account of a distributed digital ledger transaction network. For example, in one or more embodiments, the disclosed systems initiate a transaction to delegate a permission for rotating one or more cryptographic keys of a first user account to a second user account. Using the second user account, the disclosed systems generate and store a pre-signed key rotation transaction request. By retrieving the pre-signed key rotation transaction request from storage, the disclosed systems can initiate a key rotation transaction that exchanges the active cryptographic key of the first user account to a modified cryptographic key.
    Type: Application
    Filed: September 16, 2022
    Publication date: January 12, 2023
    Inventors: Lei Wei, Riyaz Faizullabhoy, Nassim Eddequiouaq
  • Publication number: 20220406847
    Abstract: A memory system may include separate amounts or types of resistive material that may be deposited over memory cells and conductive vias using separate resistive layers in the access lines. A first resistive material layer may be deposited over the memory cells prior to performing an array termination etch used to deposit the conductive via. The array termination etch may remove the first resistive material over the portion of the array used to deposit the conductive via. A second resistive material layer may be deposited after the etch has occurred and the conductive via has been formed. The second resistive material layer may be deposited over the conductive via.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 22, 2022
    Inventors: Lei Wei, Pengyuan Zheng, Kevin Lee Baker, Efe Sinan Ege, Adam Thomas Barton, Rajasekhar Venigalla
  • Publication number: 20220345695
    Abstract: A method for intra prediction includes: enabling intra prediction, and determining occupancy information of a first number of neighboring nodes of a coded node; determining occupancy information of a second number of neighboring nodes of the coded node based on a position association between at least one neighboring node of the coded node and a child node of the coded node, where the first number is greater than the second number; and determining an occupancy prediction result of the child node of the coded node based on the occupancy information of the second number of neighboring nodes. An encoder for implementing the above method is also provided.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 27, 2022
    Inventors: Shuai WAN, Fuzheng YANG, Zhecheng WANG, Lei WEI
  • Patent number: 11483132
    Abstract: The present disclosure relates to systems, methods, and non-transitory computer-readable media that utilize pre-signed key rotation transaction requests for initiating transactions to rotate one or more cryptographic keys of a user account of a distributed digital ledger transaction network. For example, in one or more embodiments, the disclosed systems initiate a transaction to delegate a permission for rotating one or more cryptographic keys of a first user account to a second user account. Using the second user account, the disclosed systems generate and store a pre-signed key rotation transaction request. By retrieving the pre-signed key rotation transaction request from storage, the disclosed systems can initiate a key rotation transaction that exchanges the active cryptographic key of the first user account to a modified cryptographic key.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: October 25, 2022
    Assignee: Meta Platforms, Inc.
    Inventors: Lei Wei, Riyaz Faizullabhoy, Nassim Eddequiouaq
  • Publication number: 20220337884
    Abstract: An intra prediction method and a decoder are provided. The method includes the following. Coordinate information of a current node and a current level corresponding to the current node are determined. A current quantity is determined based on the current level, where the current quantity is positively correlated with the current level. Current neighbour nodes are determined based on the coordinate information of the current node, where the current neighbour nodes are neighbour nodes of the current quantity among neighbour nodes of a parent node of the current node. Intra prediction is performed on the current node based on the coordinate information of the current node and the current neighbour nodes.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 20, 2022
    Inventors: Shuai WAN, Fuzheng YANG, Lei WEI, Zhecheng WANG