Abstract: The present invention relates to a polymer composition suitable for the manufacture of an electrical insulation layer for cables having superior mechanical and electrical properties and being environmentally friendly, to a cable comprising said polymer composition as well as to the use of the polymer composition as an electrical insulation layer in cables.

Abstract: An oscillator, including a resonance circuit, a cross coupled current source circuit, and a positive feedback circuit coupled between the current source circuit and the resonance circuit, where the resonance circuit is configured to generate a differential oscillation signal having a first oscillation frequency, the positive feedback circuit is configured to receive the differential oscillation signal, and amplify a gain of the differential oscillation signal to obtain a differential output oscillation signal, and the current source circuit is configured to provide an adjustable bias current for the resonance circuit and the positive feedback circuit.

Abstract: A wire grid polarizer includes a base substrate, a wire grid pattern, a first stitch line extending in a first direction, and a second stitch line extending in a second direction which crosses the first direction, and including a first portion and a second portion which are discontinuous from each other, in which the wire grid pattern is evenly formed on all of the base substrate except where the first and second stitch lines exist, and the first and second stitch lines are where the wire grid pattern is unevenly formed.

Abstract: A method of building an insulation system around a naked conductor section of a power cable. The insulation system includes an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer. The method includes: a) placing the naked conductor section in a mold, and b) molding an insulation system around the naked conductor section, wherein the molding of the insulation system involves injecting a first semiconducting compound into a first mold cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mold cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mold cavity to form an outer semiconducting layer around the insulation layer.

Abstract: A flexible display device includes: a display panel to generate an image; and a window member on the display panel, the window member including: a base film; and a polymer layer including a first part and a plurality of second parts having lower hardness than that of the first part.

Abstract: Provided is a wire grid polarizing plate. The wire grid polarizing plate comprises a light-transmitting substrate and wire grid patterns which are disposed on the light-transmitting substrate, and which are arranged to transmit first polarized light and to reflect second polarized light polarized in a direction perpendicular to that of the first polarized light, the wire grid patterns comprising target patterns comprising conductive structures shaped as closed curves, at least one of the conductive structures surrounding another one of the conductive structures with a gap therebetween.

Abstract: An oscillator, including a resonance circuit, a cross coupled current source circuit, and a positive feedback circuit coupled between the current source circuit and the resonance circuit, where the resonance circuit is configured to generate a differential oscillation signal having a first oscillation frequency, the positive feedback circuit is configured to receive the differential oscillation signal, and amplify a gain of the differential oscillation signal to obtain a differential output oscillation signal, and the current source circuit is configured to provide an adjustable bias current for the resonance circuit and the positive feedback circuit.

Abstract: A wire grid polarizer includes a base substrate, a wire grid pattern, a first stitch line extending in a first direction, and a second stitch line extending in a second direction which crosses the first direction, and including a first portion and a second portion which are discontinuous from each other, in which the wire grid pattern is evenly formed on all of the base substrate except where the first and second stitch lines exist, and the first and second stitch lines are where the wire grid pattern is unevenly formed.

Abstract: An imprint lithography method includes forming a first imprint pattern on a substrate in a first area and a third area, wherein the third area is spaced apart from the first area, forming a first resist pattern on the substrate on a second area, wherein the second area is adjacent the first and third areas, forming a first pattern in the first and third areas by etching an element under the first imprint pattern using the first imprint pattern and the first resist pattern as an etch barrier, forming a second imprint pattern on the substrate in a second area, forming a second resist pattern on the substrate on the first area and the third area, and forming a second pattern in the second area by etching an element under the second imprint pattern using the second imprint pattern and the second resist pattern as an etch barrier.

Abstract: Provided is a wire grid polarizing plate. The wire grid polarizing plate comprises a light-transmitting substrate and wire grid patterns which are disposed on the light-transmitting substrate, and which are arranged to transmit first polarized light and to reflect second polarized light polarized in a direction perpendicular to that of the first polarized light, the wire grid patterns comprising target patterns comprising conductive structures shaped as closed curves, at least one of the conductive structures surrounding another one of the conductive structures with a gap therebetween.

Abstract: A method of building an insulation system around a naked conductor section of a power cable. The insulation system includes an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer. The method includes: a) placing the naked conductor section in a mold, and b) molding an insulation system around the naked conductor section, wherein the molding of the insulation system involves injecting a first semiconducting compound into a first mold cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mold cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mold cavity to form an outer semiconducting layer around the insulation layer.