Abstract: A method of preparing PAN-based carbon fibers relates to the technical field of materials. The method includes: S1. acrylonitrile, a second monomer and an unsaturated UV-sensitive cross-linking agent are mixed, an initiator is then added and a reaction is performed to obtain a meltable PAN-based copolymer; S2. the meltable PAN-based copolymer and a flow modifier are mixed to obtain a mixture, the mixture is extruded and pelletized, and then melt spinning is performed to obtain nascent fibers, the nascent fibers are stretched and annealed to obtain a PAN-based carbon fiber precursor; S3. ultraviolet irradiation is performed on the PAN-based carbon fiber precursor; S4. the PAN-based carbon fiber precursor after ultraviolet irradiation is pre-oxidized and carbonized to obtain PAN-based carbon fibers.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Abstract: A method for directly preparing a foamed polylactic acid (PLA) product from a PLA melt includes PLA melt preparation, feeding, and two-stage extrusion. In the two-stage extrusion, a pressure at an outlet of a first-stage twin-screw extruder is 15 MPa to 17 MPa, a PLA melt is fed at a rate of 250 kg/h, a foaming additive is fed at a rate of 7.5 kg/h to 10 kg/h, and a foaming gas is fed at a rate of 2.8 L/h to 7.5 L/h. The method can ensure both foamability and quality of a material and reduce more than ? of energy consumption; and an obtained product has an adjustable foaming rate of 3 to 25, a crystallinity of 40.3% to 48.5%, a tensile strength of 8.7 MPa to 19.6 MPa, and an apparent density of 0.05 g/cm3 to 0.4 g/cm3.

Abstract: A preparation method of a high-rate foamed polylactic acid (PLA) sheet includes first-stage extrusion, second-stage extrusion, and foamed sheet extrusion. The method requires the following raw materials in parts by mass: 88 to 94 parts of PLA, 1 to 2 parts of a nucleating agent, 2 to 5 parts of a foaming agent, and 2 to 5 parts of an additive. The new method effectively solves the problems of low foaming rate, low strength, and the like in the industrial production using carbon dioxide, and a prepared PLA sheet with high foaming rate and excellent surface performance can be used in the fields of food packaging, disposable fully-degradable lunch boxes, and the like.

Abstract: A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Abstract: The present invention relates to a polishing liquid for CMP and preparation method thereof. 100 parts by weight of the polishing liquid comprises: 0.1 to 50 parts of abrasive, 0.001 to 0.4 part of surfactant, 0.001 to 0.6 part of film former, and 0.05 to 10 parts of pH regulator, and 0.01 to 4 parts of polishing accelerator, and deionized water in balance; and the pH value of the polishing liquid is 9.5 to 12.5. When a GaAs wafer is polished with the polishing liquid of the present invention, various performance indexes such as polishing removal rate, surface roughness and TTV of the polished wafer are excellent, and the polishing liquid is easy to be washed away, does not corrode equipment, and does not introduce harmful metal ions. The polishing liquid of the present invention can be used continuously and circularly for a long period of 6 to 10 hours, which greatly saves resources and reduces the use cost of the polishing liquid.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

Abstract: A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

Abstract: The present invention provides a fire retardant antiflux fiber, the fiber is composed of the following components: cellulose 60˜80% by mass, silicon fire retardant (calculated as silicon dioxide) 15˜36% by mass, tourmaline 0.1˜5%. The present invention also provides a process of producing fire retardant antiflux fiber, in the adding step, the silicon fire retardant is added into the cellulose xanthate in the xanthation step or the viscose which was prepared after the xanthation step, the level of adding the silicon fire retardant is 19˜30%, calculated as silicon dioxide. The fire retardant antiflux fiber of the present invention has high fire retardant antiflux effect, high fiber strength and excellent negative ion generating efficacy. At the same time, the viscose also maintains excellent filtering performance in the procedure using above production process, reducing the production standstill caused by the viscose blocking up filter screen, improving production efficiency.

Abstract: The present invention provides a fire retardant antiflux fiber, the fiber is composed of the following components: cellulose 60˜80% by mass, silicon fire retardant (calculated as silicon dioxide) 15˜36% by mass, tourmaline 0.1˜5%. The present invention also provides a process of producing fire retardant antiflux fiber, in the adding step, the silicon fire retardant is added into the cellulose sulfonate in the sulfidizing step or the viscose which was prepared after the sulfidizing step, the level of adding the silicon fire retardant is 19˜30%, calculated as silicon dioxide. The fire retardant antiflux fiber of the present invention has high fire retardant antiflux effect, high fiber strength and excellent negative ion generating efficacy. At the same time, the viscose also maintains excellent filtering performance in the procedure using above production process, reducing the production standstill caused by the viscose blocking up filter screen, improving production efficiency.

Abstract: An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from the active component site. The fluid flow barrier can be a recess that resists fluid flow thereinto because of surface tension of the fluid when it meets-the recess edge. The fluid flow barrier can include a boundary that diverts fluid flow due to the angle of the recess edge as the fluid approaches it. An embodiment also includes a packaging system that includes the article and at least one passive component. An embodiment also includes a method of assembling the article or the packaging system.