Patents by Inventor Lejun Wang

Lejun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally degradable epoxy underfills for flip-chip applications
    Publication number: 20020013420
    Abstract: A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.
    Type: Application
    Filed: March 29, 2001
    Publication date: January 31, 2002
    Inventors: Lejun Wang, Haiying Li, Ching-Ping Wong
  • Reworkable epoxy underfill encapsulants
    Patent number: 6172141
    Abstract: A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: January 9, 2001
    Assignee: Georgia Tech Research Corporation
    Inventors: Ching-Ping Wong, Lejun Wang