Abstract: An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations.

Abstract: A method of forming and testing an interposer includes forming vias in a semiconductor material of a wafer having a front side and a back side. The method further includes disposing an electrically conductive layer on the front side of the wafer such that the layer is electrically connected to the vias. The method also includes forming electrically conductive pads on the front side of the wafer, wherein each electrically conductive pad is electrically connected to the electrically conductive layer. The method further includes forming electrically conductive bumps on the back side of the wafer, wherein each electrically conductive bump is electrically connected to at least one via. The method also includes testing electrical connectivity from a first bump to a second bump of the electrically conductive bumps.

Abstract: A processing system for processing an input signal to produce three-dimensional audio effects is disclosed. The processing system comprises: a cue sending path configured to extract a set of binaural cues from the input signal and further configured to send at least a portion of the extracted set of binaural cues to at least one directional loudspeaker for transmission; and an ambience sending path configured to send at least a part of the input signal comprising ambience sounds to at least one conventional loudspeaker for transmission.

Abstract: A semiconductor device comprising a first conductor, a semiconductor die, a second conductor, an encapsulant, a first body, and a second body is disclosed. The semiconductor die may be coupled to the first conductor and the second conductors. The encapsulant may be encapsulating the semiconductor die and may comprise an illumination surface where light emitted and detected by the semiconductor device substantially passes through. The first and second conductors and the first and second bodies are interconnected by the encapsulant. A portion of the encapsulant other than the illumination surface is exposed by a gap between the first and second bodies so as to absorb stress resulting from temperature-induced movement of the encapsulant.

Abstract: A listening device (120; 220; 320), such as a pair of headphones, is provided for wearing by a user. It contains two or more sound emitters for directing sound to each ear (2) of the user. At least one of the sound emitters (116; 216, 316) is positioned such that sound is emitted in a direction substantially perpendicular to the axis of the ear canal (10) of the ear, and towards the wall of the concha (6) of the ear (2).

Abstract: In one embodiment, a light-emitting device having a light source die, a substantially transparent encapsulant surrounding the light source die, and a second substantially transparent encapsulant at least partially covering the first substantially transparent encapsulant is disclosed. The second substantially transparent encapsulant may expose a portion of the first substantially transparent encapsulant. The second substantially transparent encapsulant may be less tacky, and may be hardened as compared to the first substantially transparent encapsulant. The second substantially transparent encapsulant may comprise a plurality of encapsulant islands that are distanced away from one another. In another embodiment, the light-emitting device may comprise a third substantially transparent encapsulant covering a portion of the first substantially transparent encapsulant that is exposed by the second substantially transparent encapsulant.

Abstract: A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness.

Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.

Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Abstract: The present invention relates to a medical monitoring system (100) that comprises at least one wearable monitoring device (10) and a wireless transceiver unit (34). The medical monitoring system (100) serving to provision for the monitoring of at least one mobile subject's physiological parameters that include body temperature or perspiration, analyze physiological parameter measurements embodied in the form of electrical signals, produce a medical alert signal in the event the physiological parameter measurements fall beyond predetermined threshold values and further serve to wirelessly transmit the medical alert signal and electrically embodied physiological parameter measurements to a remote monitoring station (32).

Abstract: A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.

Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.

Abstract: In one embodiment, a light-emitting device having a reflector, an emitter and an encapsulant is disclosed. The encapsulant may have a plurality of optical structures. Each of the plurality of optical structures may be configured to attenuate light transmitting towards a first direction by re-directing towards a second direction. In another embodiment, a flashlight having a roughened area with micro-optics is disclosed. Each of the micro-optics is configured to redirect light transmitting towards a direction forming an angle relative to a longitudinal axis to a point along the longitudinal axis. In yet another embodiment, a lighting-emitting device having roughened area to reduce light along a longitudinal axis is disclosed.

Abstract: An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device.

Abstract: An expanding dual disc gate valve that can be used in applications requiring double block and bleed type systems. A stem is positioned in the center of a valve body with a first and second gate arranged on opposite side of the stem with respect to each other. The first and second gates are slidingly engaged with the stem so that the stem controls their movement between an open and a closed position with respect to an inlet and an outlet of the valve body. As the gates approach the closed position they encounter a shoulder of the valve body preventing further downward movement, whereby further force from the stem wedges the first and second gates outward to create a sealing arrangement with a seat ring of the valve body.

Abstract: In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed.