Abstract: Disclosed is a method of planarizing a diamond film which generally includes orifices in the surface. The method includes first polishing the diamond film surface to reduce the surface roughness. Next, a filler material is applied to the surface of the film to fill the orifices in the film. Finally, the film is polished to remove excess filler material and expose the diamond film surface. Also disclosed are planarized diamond films diamond substrate having a polished surface of both diamond and filler material and a variation in thickness of less than 8 percent.

Abstract: An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other, the conductors being interconnected so as to form at least two electrical planes, the conductors of the electrical planes being substantially interdigitated on each interconnection layer, portions of each plane appearing on both layers. The interconnection medium advantageously is employed as a multichip module.

Abstract: A precisely aligned optical fiber switch assembly. A base member has a vee groove for supporting a fixed optical fiber and a second optical fiber in optical alignment with the fixed fiber. The groove contains sections of different dimensions that receive and align sheathed portions of the fibers and groove sections that receive and align unsheathed portions of the fibers. First aligning means on the base member longitudinally position the fixed and second fibers in the groove. Covering means mate with the base member for covering at least part of the sheathed portions of the fibers. Aligning means position the covering means precisely with respect to the base member.

Abstract: A precisely aligned optical fiber switch assembly. A base member has a vee groove for supporting a fixed optical fiber and a second optical fiber in optical alignment with the fixed fiber. The groove contains sections of different dimensions that receive and align sheathed portions of the fibers and groove sections that receive and align unsheathed portions of the fibers. First aligning means on the base member longitudinally position the fixed and second fibers in the groove. Covering means mate with the base member for covering at least part of the sheathed portions of the fibers. Aligning means position the covering means precisely with respect to the base member.

Abstract: The standard silicon wafer of a conventional wafer-scale-integrated assembly is doped to render it highly conductive. Additionally, a conductive layer is formed on the bottom of the wafer. The bottom-side layer forms an easily accessible ground plane of the assembly. Moreover, this layer and the conductive silicon constitute one plate of an advantageous wafer-size decoupling capacitor. A nearly continuous power layer and a relatively thick layer of silicon dioxide on the top side of the assembly form the other elements of the decoupling capacitor. Additionally, the nearly continuous power layer constitutes an effective a-c ground plane for overlying signal lines.

Abstract: A package for a semiconductor chip includes as an integral part thereof a frame-shaped multilayer ceramic capacitor. The chip is mounted within the capacitor structure. Conductive portions of the capacitor serve as the terminals and plates of the capacitor and as planar power and ground members for interconnecting an external power supply to the chip. By means of these planar members, power is distributed to the chip in a low-impedance, substantially transient-free manner without utilizing any of the multiple signal leds emanating from the package. Moreover, the signal leads are separated from the ground plane by a low-dielectric-constant material. As a result, the signal leads are minimally loaded and are characterized by a relatively constant impedance selected to optimize signal transfer to and from the chip.