Abstract: A method for efficient, high quality rendering of a surface patch. The method tests a surface patch for flatness, and if the surface patch is not flat, the method divides the surface patch into a left surface patch and a right surface patch. Otherwise if the surface patch is flat, the method converts the surface patch into triangles. This method can be implemented to operate recursively, thereby ensuring that all portions of the patch are eventually converted into triangles when the portions become small enough to satisfy the flatness condition. A patch tests as flat only if all curves which form the patch do not deviate from straight lines by more than a predetermined tolerance. The division is efficiently performed by determining (i) left patch control points for a first portion of all curves along one axis of the surface patch, and (ii) right patch control points for a second portion of all curves along said axis of the surface patch.

Abstract: A highly integrated, single chip computer system having not only a central-processing unit (CPU) but also specialized coprocessors. The specialized coprocessors, for example, enable the single chip computer system to be reasonably sized, yet perform high quality video (e.g., MPEG-2) and graphics operations (e.g., three-dimensional graphics). The single chip computer system offers improved performance of video and graphics operations, resource scheduling and security. The improved security offered by the single chip computer system enables program code or data stored external to the single chip computer system to be encrypted so as to hinder unauthorized access, while internal to the single chip computer system the program code or data is decrypted. The single chip computer system is particularly suitable for video game consoles having high quality graphics and/or video, digital video disk (DVD) players, and set-top boxes.

Abstract: A computer system module includes a central processing unit (CPU), a floating-point accelerator (FPA), a read/write buffer (RWB), cache memory, a clock generator, buffers, and reset logic. The signal composition of the module includes: Configuration Buffer Enable (CfgEn); Page Write (PgWrt); Block Match (BlkMtch); Byte Write Mask (WrMsk); and Test Enable (TestEn). The layout of the various components on a printed circuit board (PCB) minimizes transmission line effects, such as transmission line delay (t.sub.D) and signal reflections, by keeping trace lengths as short as possible, and no line terminations are required. A heat sink (heat spreader) is provided for critical semiconductor devices, such as the CPU and the FPA. The heat sink includes a broad flat section and a button protruding from a surface thereof. An unpackaged device is mounted to the button, with a thermally and electrically conductive adhesive, and is inserted through a hole in the PCB.