Abstract: An additive formulation for a lithium ion battery is provided, which includes an ionic conductor and a compound having a maleimide structure. An electrode slurry composition is also provided, which includes an active material, a conductive additive, an adhesive, and an additive formulation containing an ionic conductor and a compound having a maleimide structure modified by a compound having a barbituric acid structure.

Abstract: A liquid crystal display panel and a liquid crystal display device containing the same are disclosed. The liquid crystal display panel of the present invention comprises: a first substrate with a pixel electrode region and a non-pixel electrode region; a second substrate opposite to the first substrate; a first alignment layer disposed on the pixel electrode region and the non-pixel electrode region; and a liquid crystal layer disposed between the first substrate and the second substrate. Herein, the first alignment layer on the pixel electrode region has a first thickness, that on the non-pixel electrode region has a second thickness, and the first thickness is larger than the second thickness.

Abstract: An electrode structure of a lithium ion battery includes a current collector, at least one energy active layer, and at least one power active layer. The energy active layer is formed on the current collector and the power active layer is formed on the energy active layer. The energy active layer includes a first lithium-containing compound and multiple first conductive particles. The power active layer includes a second lithium-containing compound and multiple second conductive particles. The first lithium-containing compound includes lithium manganese cobalt nickel oxide (LiMnxCoyNizO2), where 0<x, y, z<1. The second lithium-containing compound includes lithium manganese oxide (LiMn2O4). A weight ratio of the first conductive particles to the energy active layer is greater than a weight ratio of the second conductive particles to the power active layer. A lithium ion diffusion coefficient of the second lithium-containing compound is greater than that of the first lithium-containing compound.

Abstract: The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050.

Abstract: The invention provides a dielectric material with low dielectric loss. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: A liquid crystal display panel and a liquid crystal display device containing the same are disclosed. The liquid crystal display panel of the present invention comprises: a first substrate with a pixel electrode region and a non-pixel electrode region; a second substrate opposite to the first substrate; a first alignment layer disposed on the pixel electrode region and the non-pixel electrode region; and a liquid crystal layer disposed between the first substrate and the second substrate. Herein, the first alignment layer on the pixel electrode region has a first thickness, that on the non-pixel electrode region has a second thickness, and the first thickness is larger than the second thickness.

Abstract: A liquid crystal display panel and a liquid crystal display device containing the same are disclosed. The liquid crystal display panel of the present invention comprises: a first substrate with a pixel electrode, a data line, and a scan line formed thereon; a second substrate opposite to the first substrate; a first alignment layer disposed on the first substrate, the pixel electrode, the data line and the scan line; and a liquid crystal layer disposed between the first substrate and the second substrate, wherein the first alignment layer disposed on the pixel electrode has a first thickness, the first alignment layer disposed on at least one of the scan line and the data line has a second thickness, and the first thickness is greater than the second thickness.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: An electrode structure of a lithium ion battery includes a current collector, at least one energy type active layer, and at least one power type active layer. The energy type active layer and the power type active layer are formed on the current collector. The energy type active layer includes a first lithium-containing compound and multiple first conductive particles. The power type active layer includes a second lithium-containing compound and multiple second conductive particles. The first and second lithium-containing compounds are lithium-containing complex transitional metal oxides. Compositions of the first and second lithium-containing compounds include at least one of Ni, Co and Mn. A lithium ion diffusion coefficient of the second lithium-containing compound is greater than that of the first lithium-containing compound. A specific capacity of the first lithium-containing compound is greater than that of the second lithium-containing compound.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: The present invention presents an effective Cycle-count Accurate Transaction level (CCA-TLM) full bus modeling and simulation technique. Using the two-phase arbiter and master-slave models, an FSM-based Composite Master-Slave-pair and Arbiter Transaction (CMSAT) model is proposed for efficient and accurate dynamic simulations. This approach is particularly effective for bus architecture exploration and contention analysis of complex Multi-Processor System-on-Chip (MPSoC) designs.

Abstract: The present invention discloses a cycle-count-accurate (CCA) processor modeling, which can achieve high simulation speeds while maintaining timing accuracy of the system simulation. The CCA processor modeling includes a pipeline subsystem model and a cache subsystem model with accurate cycle with accurate cycle count information and guarantees accurate timing and functional behaviors on processor interface. The CCA processor modeling further includes a branch predictor and a bus interface (BIF) to predict the branch of pipeline execution behavior (PEB) and to simulate the data accesses between the processor and the external components via an external bus, respectively. The experimental results show that the CCA processor modeling performs 50 times faster than the corresponding Cycle-accurate (CA) model while providing the same cycle count information as the target RTL model.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A halogen-free varnish includes epoxy resin, composite curing agent, condensed phosphate, and filler. The composite curing agent includes Benzoxazine (BZ) resin and amino triazine novolac (ATN) resin. The filler has aluminium hydroxide and silica. Glass fabric is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low moisture absorption.