Abstract: A heat dissipating system includes an enclosure, which includes a rear plate and a side plate. A heat sink is mounted on the side plate. A power supply unit is mounted on the rear plate. A first fan is mounted in an inner room of the power supply unit. The power supply unit includes a bottom wall which defines a plurality of first vent holes and a rear wall which defines a plurality of second vent holes. The first fan is aligned to the plurality of second vent holes. The bottom wall is located above the heat sink. The first fan is adapted to rotate to drive air flowing in the power supply unit via the plurality of first vent holes from the heat sink, and following out of the power supply unit via the plurality of second vent holes.

Abstract: A cooling device for cooling an electronic component is disclosed. The cooling device comprises a cooler comprising a base, a plurality of first fins and a plurality of second fins. The plurality of first fins extends substantially perpendicular from the base, and the plurality of second fins are secured to the base. Each of the plurality of second fins is between adjacent two of the plurality of first fins. Each of the plurality of second fins comprises a plurality of body portions and a plurality of connecting pieces. Each of the plurality of connecting pieces connects adjacent two of the plurality of body portions.

Abstract: A packing apparatus includes a case for receiving a plurality of electronic devices and a plurality of mounting members placed in the case. Each mounting member defines a receiving space. A shock-absorbing member is located in the receiving space and divides the receiving space into two mounting spaces. A shock-absorbing block is located in each mounting space. A slot is defined between the shock-absorbing block and the shock-absorbing member. A side of the shock-absorbing block towards the shock-absorbing member defines an oblique plane as a cushioning surface, and the oblique plane abuts the shock-absorbing member when the shock-absorbing member is bent.

Abstract: A heat sink apparatus includes a fin module, a base, a first heat pipe, and a second heat pipe. The base includes an upper surface and a lower surface. The first heat pipe includes a first connection portion having a first end and a second end. The first end is connected to a first receiving portion. The second end is connected to a first body. The first receiving portion is in contact with the upper surface. The first body extends through the fin module in a first direction. The second heat pipe includes a second connection portion having a first end connected to a second receiving portion and a second end connected to a second body. The second receiving portion is in contact with the upper surface. The second body extends through the fin module in a second direction substantially opposite to the first direction.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: A computing device includes a first motherboard and a second motherboard perpendicularly attached to the first motherboard. The first motherboard includes a first CPU module and a plurality of first peripheral component interconnect (PCI) sockets. The second motherboard includes a second CPU module and a plurality of second PCI sockets. The plurality of first PCI sockets is located perpendicularly to both motherboards. The plurality of second PCI sockets includes at least one PCI socket that is obliquely oriented relative to the first motherboard.

Abstract: An expansion card mounting apparatus including an enclosure, the enclosure including a support plate and a flange, the enclosure defining a slot, the support plate and the flange located above the slot; a mounting plate, the mounting plate including a mounting plate body and a bent portion extending from the mounting plate body; the mounting plate body securing an expansion card and covering the slot; the bent portion located on the support plate; a securing element, the securing element pressing the bent portion; and a pressing member, the pressing member including a resilient arm and a securing portion extending from the resilient arm; the resilient arm including a first and a second ends, the first end resisting the expansion card; the second end resisting on the securing element; and the securing portion engaging with the flange to enable the pressing member sandwiched between the securing element and the flange.

Abstract: A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.

Abstract: A heat dissipation assembly includes a heat sink and a fan. The heat sink includes a plurality of fins. The plurality of fins is parallel with each other. Each of the plurality of fins includes two side faces. Each side face is waved. An air channel is located between two adjacent side faces of two adjacent fins. The air channel includes a plurality of wide portions and a plurality of narrow portions interlaced with the plurality of wide portions. The fan is located on a side of the air channel. The fan is adapted to drive air flowing fast in the plurality of narrow portions of the air channel and flowing slow in the plurality of wide portions of the air channel.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: A fan module includes a fan, a temperature sensor, and a shield. The temperature sensor includes a cable. The shield is mounted on the fan. The shield includes a clip. The clip includes two elastic pieces. A restricting slot and a receiving space are located between the two elastic pieces. The cable has an outer diameter which is wider than the restricting slot but narrower than the receiving space. The two elastic pieces can be elastically deformed to expand the restricting slot so that the cable can be placed in the receiving channel via the restricting slot.

Abstract: A packing apparatus includes a case for receiving a plurality of electronic devices and a plurality of mounting members placed in the case. Each mounting member defines a receiving space. A shock-absorbing member is located in the receiving space and divides the receiving space into two mounting spaces. A shock-absorbing block is located in each mounting space. A slot is defined between the shock-absorbing block and the shock-absorbing member. A side of the shock-absorbing block towards the shock-absorbing member defines an oblique plane as a cushioning surface, and the oblique plane abuts the shock-absorbing member when the shock-absorbing member is bent.

Abstract: An electronic device enclosure includes a plate, a securing member, a fan module, and a security apparatus. The plate defines an air vent area and a first through hole. The first through hole is located above the air vent area. The securing member is mounted on an inner side of the plate. The securing member is located above the air vent area. The securing member defines an engaging hole and a second through hole, which is in alignment with the first through hole. The fan module includes a clasp. The fan module is aligned to the air vent area. The clasp engages in the engaging hole to mount the fan module on the securing hole. The security apparatus includes a locking piece and a cord. The locking piece is mounted in the first through hole and the second through hole, and the cord is configured to fasten to an unmovable object.

Abstract: A mounting apparatus for mounting a data storage device, includes a drive bracket and a slider mounted on the data storage device. The drive bracket includes a side piece in which a sliding groove is located. The sliding groove includes a first end and a second end. The second end is adjacent to an edge of the side piece. The first end is located on the side piece. A guiding surface is located at the first end. The guiding surface inclines from an inner surface of the side piece to an outer surface of the side piece. The slider slides in the sliding groove from the second end to the first end. The slider abuts the guiding surface. The guiding surface retains the slider at the first end.

Abstract: A connector assembly includes a first connector with a positioning portion and a second connector with a latch. A blocking portion is located on a second side of the first connector. The latch defines an oblique latching plane, the positioning portion defines an oblique sliding plane, and the blocking portion defines an oblique blocking plane. If the latch is aligned with the positioning portion and is slid towards the first connector, the oblique direction of the second latching plane is substantially the same as the oblique positioning plane. If the latch is aligned with the blocking portion and is slid towards the first connector, an acute angle is defined between the oblique direction of the second latching plane and the oblique direction of the blocking plane.

Abstract: An electronic device includes a cage and a fan module. The cage includes a mounting plate defining a ventilation hole. A positioning portion is located in the ventilation hole. A restriction is located on an inner surface of the positioning portion. The height of the restriction is such as to strictly require the fan module to be in the correct orientation when it is fitted to the electronic device.

Abstract: A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.