Abstract: A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least one first channel (18) is defined in the top surface. The fin assembly has a first bottom surface (32). At least one second channel (38) is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion (324) is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.

Abstract: A heat dissipating system includes a chassis (10), and a fan (50). The chassis includes a rear plate (14). The rear plate has an inner surface. The fan is secured to the rear plate inside the chassis. A distance is formed between the fan and the inner surface of the rear plate.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.