Patents by Inventor Li Huang

Li Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230299712
    Abstract: This invention relates to an innovative lap joint plate with solar panel, which includes at least a lap joint plate and a solar chip set as main components combined together. Said lap joint plate is provided with at least one flat portion and a plurality of protruding portions, said flat portion is arranged between adjacent two protruding portions, the height of said protruding portions are all higher than said flat portion. Said solar chip set is arranged above said flat portion. The present invention can effectively prevent the solar chip set from being damaged by the bending and twisting of the lap joint plate by using the flexible solar chip set. Alternatively, a glass plate can be added to the outermost layer (and the bottom layer) of the solar chip set, the hardness of the glass plate is used to support and protect the solar chip set, so that the solar chip set can be prevented from being damaged by the deformation and stretching of the lap joint plate.
    Type: Application
    Filed: November 14, 2022
    Publication date: September 21, 2023
    Inventor: MING-LI HUANG
  • Publication number: 20230296616
    Abstract: Provided is an arginine fluorescent probe, comprising a polypeptide B that responds to arginine and a fluorescent protein A that expresses arginine; the fluorescent protein A is inserted into the polypeptide B, B is divided into an upper structural part and a lower structural part, B1 and B2, and a probe structure represented by the formula B1-A-B2 is formed; optimized mutants are likewise obtained by truncation and site-directed mutagenesis at different positions, and specific binding of the polypeptide B and arginine leads to a change in the fluorescence signal of the fluorescent protein A; and the polypeptide B is an arginine binding protein or a mutant thereof.
    Type: Application
    Filed: February 9, 2021
    Publication date: September 21, 2023
    Applicant: East China University of Science and Technology
    Inventors: Yi Yang, Yuzheng Zhao, Rui Li, Yejun Zou, Li Huang, Xie Li, Kun Jiang
  • Publication number: 20230296617
    Abstract: Disclosed is a tryptophan optical probe, a preparation method therefor and the use thereof. Disclosed is an optical probe, comprising a tryptophan-sensitive polypeptide or a functional variant thereof and an optically active polypeptide or a functional variant thereof, wherein the optically active polypeptide or the functional variant thereof is located in the sequence of the tryptophan-sensitive polypeptide or the functional variant thereof. Furthermore, disclosed are a method for preparing the above-mentioned probe and the use thereof in the detection of tryptophan.
    Type: Application
    Filed: February 9, 2021
    Publication date: September 21, 2023
    Applicant: East China University of Science and Technology
    Inventors: Yi Yang, Yuzheng Zhao, Chenxia Zhang, Li Huang, Yejun Zou, Xie Li, Shuning Liu
  • Publication number: 20230290809
    Abstract: A method of forming a semiconductor device includes: forming a passivation layer over a conductive pad that is disposed over a substrate; and forming an inductive component over the passivation layer, including: forming a first insulation layer and a first magnetic layer successively over the passivation layer; forming a first polymer layer over the first magnetic layer; forming a first conductive feature over the first polymer layer; forming a second polymer layer over the first polymer layer and the first conductive feature; patterning the second polymer layer, where after the patterning, a first sidewall of the second polymer layer includes multiple segments, where an extension of a first segment of the multiple segments intersects the second polymer layer; and after patterning the second polymer layer, forming a second insulation layer and a second magnetic layer successively over the second polymer layer.
    Type: Application
    Filed: May 31, 2022
    Publication date: September 14, 2023
    Inventors: Mei-Chi Lee, Chi-Cheng Chen, Wei-Li Huang, Kai Tzeng, Chun Yi Wu, Ming-Da Cheng
  • Publication number: 20230290032
    Abstract: This application relates to a physical special effect rendering method performed by a computer device. The method includes: obtaining physical special effect data of physical special effect particles emitted by a particle emission plug-in in a previous frame; obtaining a first target instance obtained by instantiating a scene management class; invoking, through the first target instance, a scene manager of a particle simulation tool to calculate motion state information of the physical special effect particles in a current frame based on the physical special effect data in the previous frame; and updating the physical special effect data in the previous frame based on the motion state information of the current frame to render a physical special effect in the current frame.
    Type: Application
    Filed: May 16, 2023
    Publication date: September 14, 2023
    Inventors: Chendi Wei, Li Huang
  • Publication number: 20230284324
    Abstract: A communication configuration method and apparatus are provided. The method is applied to an electronic device, the electronic device includes at least two Subscriber Identity Module (SIM) cards, where the first SIM card of the electronic device is used to provide mobile data service communication, and the second SIM card is registered with an IP Multimedia Subsystem (IMS) service. The method includes: in a case that the electronic device is used as a Session Initiation Protocol (SIP) client, configuring that the second SIM card communicates with a SIP server by using a User Datagram Protocol (UDP) transmission mode, or configuring that the second SIM card communicates with the SIP server by using a Transmission Control Protocol (TCP) transmission mode, and after determining that the second SIM card has completed sending of a SIP request and receiving of a SIP response, interrupting an established TCP socket.
    Type: Application
    Filed: May 10, 2023
    Publication date: September 7, 2023
    Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Li HUANG
  • Patent number: 11749711
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: September 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku, Chen-Shien Chen
  • Patent number: 11740196
    Abstract: A new multifunctional biomass suspension deflagration test-bed is provided, which includes a closed combustion chamber. An integrated temperature and pressure sensor is arranged in the combustion chamber, and a high-speed camera and a laser concentration-measuring instrument are arranged outside the combustion chamber, which can monitor suspension deflagration. A bottom of the combustion chamber is provided with a hollow mushroom-shaped dispersion nozzle with a tray. A nozzle body is provided with a gas main-flow channel at a center thereof and gas deflected-flow channels arranged around the gas main-flow channel. A mushroom-shaped baffle plate is arranged above the nozzle body. The gas main-flow channel extends upward to the mushroom-shaped baffle plate. A vent hole is formed in a portion of the mushroom-shaped baffle plate which is corresponding to the gas main-flow channel. Each gas deflected-flow channel is inclined outward from bottom to top and directed to the mushroom-shaped baffle plate.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: August 29, 2023
    Assignee: Henan Agricultural University
    Inventors: Shengyong Liu, Jiong Wang, Jie Lu, Xinping Liu, Libin Jie, Dongdong Wei, Hongge Tao, Chunyao Qing, Li Huang, Aili He, Zhenzhong Wang, Changzhong Ren, Haigang Wang, Baoguo Guo, Lei Peng, Miaosen Wang
  • Publication number: 20230268272
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The first etch stop layer and the first buffer layer are made of different materials. The chip structure includes a second etch stop layer over the first buffer layer. The second etch stop layer and the first buffer layer are made of different materials. The chip structure includes a device element over the second etch stop layer.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Inventors: Ping-En CHENG, Wei-Li HUANG, Kun-Ming TSAI, Shih-Hao LIN
  • Publication number: 20230251884
    Abstract: System and method are described for copying and pasting files and folders between a client and a virtual desktop via clipboard redirection. A virtual desktop session can be established by the client on the virtual desktop. The user can copy a file or folder to the virtual desktop clipboard and a path corresponding to the file or folder can be stored in the virtual desktop clipboard in a path list. When the user ungrabs the agent or switches focus out of the virtual desktop to the client, the path list can be transferred to the client device and set into the client clipboard. Subsequently, a request can be received in the client device to paste the copied file or folder to a target location in the client device. In response to the request, the client device can retrieve the contents of the copied file or folder from the agent and the contents can be placed in the target location to complete the paste operation.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 10, 2023
    Inventors: Qi Sun, Feng Yan, Li Huang, Bo Liu, Kun Shi
  • Publication number: 20230238422
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chun-Yi WU, Kuang-Yi WU, Hon-Lin HUANG, Chih-Hung SU, Chin-Yu KU, Chen-Shien CHEN
  • Publication number: 20230237959
    Abstract: The present disclosure relates to a drive circuit, including: a first module, generating display data based on image information; a second module, generating a display signal based on the display data and a plurality of clock signals; a third module, outputting a constant current based on the display signal; and a fourth module, configured to provide a reference current to the third module, wherein the fourth module includes: a reference voltage generation module, a bias module, a current generation module, and a pre-charging module. Any two adjacent clock signals of the plurality of clock signals differ by M complete clock cycles, where 0?M<1. This circuit can realize relatively high image display accuracy with relatively low system power consumption and chip cost, and meanwhile realize effective low grayscale compensation for image.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 27, 2023
    Inventors: Yongsheng Tang, Li Huang, Shixiong Lu
  • Publication number: 20230236616
    Abstract: The present disclosure relates to a constant current source calibration circuit, a constant current source drive circuit, a drive chip, and an electronic device. The current calibration circuit includes a resistor and a calibration circuit connected to the resistor for adjusting a voltage drop across two ends of the resistor; and a selector or a switch connected to the two ends of the resistor, and configured to select one end of the resistor to be connected to a constant current source output channel and the corresponding other end to be supplied with a first bias voltage VD. Since the first bias voltage VD is a fixed constant, the voltage drop across the two ends of the resistor is adjusted.
    Type: Application
    Filed: January 3, 2023
    Publication date: July 27, 2023
    Applicant: CHENGDU LIPPXIN MICROELECTRONIC CO., LTD.
    Inventors: Yongsheng TANG, Li Huang, Shixiong Lu
  • Publication number: 20230229463
    Abstract: A function execution method and electronic device are provided. The method includes: receiving a first input by a user in a case that at least one first identifier is displayed in a system status bar on a screen. The at least one first identifier includes at least one of the following: an identifier of an unread message, an identifier of prompt information, or an identifier of a system function. The prompt information is used for prompting the user of an application running in a background. The first input is an input by the user on a target identifier in the at least one first identifier. The method further includes: in response to the first input, in a case that an input parameter of the first input matches a first preset input parameter, performing a target operation corresponding to both the target identifier and the first preset input parameter.
    Type: Application
    Filed: March 23, 2023
    Publication date: July 20, 2023
    Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Li HUANG
  • Publication number: 20230206603
    Abstract: The present disclosure discloses a high-precision point cloud completion method based on deep learning and a device thereof, which comprises the following steps: introducing dynamic kernel convolution PAConv into a feature extraction module, learning a weight coefficient according to the positional relationship between each point and its neighboring points, and adaptively constructing the convolution kernel in combination with the weight matrix. A spatial attention mechanism is added to a feature fusion module, which facilitates a decoder to better learn the relationship among various features, and thus better represent the feature information. A discriminator module comprises global and local attention discriminator modules, which use multi-layer full connection to classify and determine whether the generated results conform to the real point cloud distribution globally and locally, respectively, so as to optimize the generated results.
    Type: Application
    Filed: January 9, 2023
    Publication date: June 29, 2023
    Applicant: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Dengyin ZHANG, Yingying FENG, Li HUANG, Weidan YAN
  • Publication number: 20230203506
    Abstract: An optical probe, comprising a lactic acid-sensitive polypeptide or a functional variant thereof and an optically active polypeptide or a functional variant thereof; the optically active polypeptide or the functional variant thereof is located in the sequence of the lactic acid-sensitive polypeptide or the functional variant thereof. A preparation method for the described probe and an application thereof in the detection of lactic acid.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 29, 2023
    Applicant: East China University of Science and Technology
    Inventors: Yi Yang, Yuzheng Zhao, Xie Li, Xiuze Zhang, Li Huang
  • Publication number: 20230184190
    Abstract: Disclosed is a combustion system design method based on a target heat release rate, which belongs to the technical field of diesel engine combustion chamber design. The method includes: obtaining an ideal heat release rate based on Sabathe-Miller cycle; simulating the ideal heat release rate based on a double-Wiebe function and obtaining the target heat release rate; constructing a mapping relation among the heat release rate, piston geometric parameters and fuel injection parameters, which includes target start of combustion being an function of fuel injection timing and ignition delay, premixed combustion parameters being functions of throat radius, injection pressure and nozzle diameter, and diffusion combustion being a function of piston pit depth; solving target piston geometric parameters and target fuel injection parameters based on the mapping relation; and then designing a combustion system.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 15, 2023
    Inventors: Long LIU, Yan PENG, Changfu HAN, Haicheng QI, Li HUANG, Wenzheng ZHANG
  • Patent number: 11675351
    Abstract: An autonomous mobile device (AMD) builds up electrostatic charges from moving and generates heat from the operation of internal components. In addition to possible user discomfort, electrostatic discharges may damage sensors and electronics. Electrostatic charges are dissipated from the AMD using an electrostatic dissipation structure and conductive wheels. A conductive path between a chassis ground, the electrostatic dissipation structure, and the conductive wheels improves the dissipation of electrostatic charges. Electrostatic charges are also dissipated from components by mounting the components using conductive materials. Sensors may be affixed to a support structure that is affected by thermal expansion. Thermal expansion may distort precise positioning of sensors, reducing accuracy of sensor data. An elastomeric foam may be used to mount sensors to a support structure, allowing for thermal expansion without distorting the positioning of the sensors.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: June 13, 2023
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Christopher Wells Fitzhugh, Li Huang, Catherine May Farmer, Duc Hongle Ngo, Eric Foxlin, Gregory Turner Witmer, Babak Hashemizadeh, Marcel Colman Eric Stieber
  • Patent number: 11670590
    Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The chip structure includes a second etch stop layer over the first buffer layer. The chip structure includes a device element over the second etch stop layer.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: June 6, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ping-En Cheng, Wei-Li Huang, Kun-Ming Tsai, Shih-Hao Lin
  • Publication number: 20230154788
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the end portion. The first protection cap and the first conductive line are made of different conductive materials, and the first protection cap exposes a peripheral region of a top surface of the end portion. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 18, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Wei-Li HUANG, Sheng-Pin YANG, Chi-Cheng CHEN, Hon-Lin HUANG, Chin-Yu KU, Chen-Shien CHEN