Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Abstract: A method for monitoring defects of a product implemented in an electronic device obtains product data in real time and determines whether a product is defective based on the product data; when the product is defective, outputting first warning information based on the number of defects of the product which satisfy a first preset condition; obtaining a rate of defects of the product every first preset time period, and outputting second warning information based on the rate of defects of the product when the rate of defects satisfies at least one of a second, third, and fourth preset conditions; when any warning information is output, analyzing distribution of the defects of the product; and predicting at least one cause of each defect of the product according to historical maintenance data of the product and a self-learning record of the electronic device.

Abstract: A fixing mechanism is applied to an interface card assembly and an electronic apparatus. The fixing mechanism includes a movable window and an operation component. The movable window is slidably disposed on a casing of the interface card assembly. The operation component has a fixed end and a free end opposite to each other. The fixed end is disposed on the movable window. The free end is detachably engaged with the casing to position the movable window. The movable window is positioned on one of a first region and a second region of the casing for respectively fixing interface cards with different sizes to the casing.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The chip structure includes a second etch stop layer over the first buffer layer. The chip structure includes a device element over the second etch stop layer.

Abstract: The present invention discloses a method comprising: A. acquiring the current I0 and I, and setting It1, It2, IR, Vmin, and Vmax. B. acquiring the speed V, and setting the speed VL and VH; C. a mowing motor runs in a low-speed mode, and a self-propelled motor runs at the speed VH; D. when encountering grassy areas, if I0<I<It1, keeping unchanged; if I?It1 and lasting for T1, skipping to E; if I=IR, skipping to G; E. the mowing motor switches to the high-speed mode; F. the mowing motor switches to the low-speed mode, V is switched to VH; G the mowing motor switches to the high-speed mode, V is adjusted to VL; H. the mowing motor stops, the self-propelled motors stop, then retreat and work along the original path, after attempting for M times, if the self-propelled motors stop again, bypassing and skipping to C to continue working.

Abstract: The invention relates to anti-EGF like domain multiple 6 antibody (anti-EGFL6 antibody) and cancer detection (or diagnosis) and treatment using the anti-EGFL6 antibody. The present invention creates anti-EGFL6 antibodies, particularly, a single-chain antibody fragments (scFv) and humanized antibody, which have ability in binding to EGFL6 and in inhibiting angiogenesis and cancer cell growth.

Abstract: A compound compound having the structure: or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable solvate of said compound or pharmaceutically acceptable salt, wherein A, A? and A? are independently O, C?O, C—R? or N—R?, where R? and R? may independently be H, amino, —NR7COR6, COR6, —CONR7R8, C1-C6 alkyl, or hydroxy(C1-C6 alkyl), and R? may be present or absent, and is present where the rules of valency permit, and where not more than one of A, A? and A? is O or C?O; R0 and R are independently H, Br, Cl, F, or C1-C6 alkyl; R1 is H, C1-C6 alkyl, or hydroxy(C1-C6 alkyl); R2 is selected from the group consisting of H, C1-C6 alkyl, C1-C6 alkoxy, hydroxy(C1-C6 alkyl), phenyl(C1-C6 alkyl), formyl, heteroaryl, heterocyclic, —COR6, —OCOR6, —COOR6, —NR7COR6, —CONR7R8, and —(CH2)n—W, where W is cyano, hydroxy, C3-C8 cycloalkyl, —SO2NR7R8, and —SO2—R9, where R9 is C1-C6 alkyl, C3-C8 cycloalkyl, heteroaryl, or heterocyclic; wherein each of said alkyl, cycloalkyl, heterocyclic, or heteroaryl ma

Abstract: A supporting device is adapted to be mounted on a rack and includes a longitudinal portion, a first mounting portion, and an elastic member. The first mounting portion and the elastic member are both provided on the longitudinal portion. The elastic member is configured to be in one of a locking state and a non-locking state. The elastic member is provided with a second mounting portion. When the first mounting portion is mounted on the rack and the elastic member is in the non-locking state, the second mounting portion is not mounted on the rack. When the first mounting portion is mounted on the rack and the elastic member is in the locking state, the second mounting portion is mounted on the rack.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the first conductive line. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap. The semiconductor device structure includes a second conductive line over the conductive via structure and the first photosensitive dielectric layer. The semiconductor device structure includes a second protection cap over the second conductive line. The semiconductor device structure includes a second photosensitive dielectric layer over the first photosensitive dielectric layer, the second conductive line, and the second protection cap.

Abstract: A touch panel includes a substrate, a peripheral circuit layer, and a touch sensing electrode layer. The substrate has a visible region and a border region surrounding the visible region. The peripheral circuit layer is disposed on the substrate and located in the border region, and has at least one concave portion, in which the concave portion is located on a surface of the peripheral circuit layer facing away from the substrate. The touch sensing electrode layer is disposed in the visible region and partially extends to the border region to at least cover the concave portion, in which the touch sensing electrode layer has at least one entering portion extending into the concave portion.

Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

Abstract: A service indication method includes: acquiring service indication information, the service indication information including at least one of support information about a service and preference information about the service, the service including at least one of an emergency service and a voice service; and performing a relevant operation on the service in accordance with the acquired service indication information.

Abstract: A fingerprint sensing device and an operation method thereof are provided. The fingerprint sensing device includes a driver integrated chip and a fingerprint sensor. The driver integrated chip is coupled to a host processor. The fingerprint sensor is coupled to the driver integrated chip and the host processor. The fingerprint sensor obtains a fingerprint image during a period when the host processor is in the sleep mode. The driver integrated chip performs a fingerprint verification on the fingerprint image, and the driver integrated chip determines to wake up the host processor according to whether the fingerprint image passes the fingerprint verification.

Abstract: In one exemplary aspect, a method for semiconductor manufacturing comprises forming first and second silicon nitride features on sidewall surfaces of a contact hole, where the contact hole is disposed in a dielectric layer and above a source/drain (S/D) feature. The method further comprises forming a contact plug in the contact hole, the contact plug being electrically coupled to the S/D feature, removing a top portion of the contact plug to create a recess in the contact hole, forming a hard mask layer in the recess, and removing the first and second silicon nitride features via selective etching to form first and second air gaps, respectively.

Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

Abstract: An equipment management method based on radio frequency identification comprises binding a first electronic tag and second electronic tags, reading the first electronic tag in a search mode, obtaining an abnormality list of one or more abnormal tags in the second electronic tags according to the first electronic tag, reading one of the second electronic tags in the search mode, and outputting an error signal when the read second electronic tag matches up to the abnormality list. The first electronic tag is set on a test machine, the second electronic tag are respectively set on test elements, and the test elements are disposed in the test machine.

Abstract: A method of generating content information that matches at least one stored keyword is described. At least one keyword associated with content information is stored. At least one previously searched keyword in a search record is matched with the at least one stored keyword associated with the content information. First-category mapping data is generated based on a first mapping between the matched at least one stored keyword and the at least one previously searched keyword. Second-category mapping data is generated based on the content information and the at least one stored keyword. A received target keyword is determined to be included in the first-category mapping data. In response to the received target keyword, which is included in the first-category mapping data, circuitry of a terminal searches for the content information associated with the target keyword in the second-category mapping data and displays the content information.

Abstract: A computer-implemented technique uses a machine-trained model to convert input information provided by a user into a natural language expression and a semantic vector. The semantic vector provides a distributed representation of the natural language expression. The technique then uses the generated semantic vector to find a target data record having a target semantic vector that is within a prescribed distance to the generated semantic vector. The technique then outputs at least a target natural language expression that is associated with the target data record. The target data record is produced in an offline process that converts one or more attribute values in an existing structured data record into the target semantic vector and the target natural language expression. Also described herein is a technique for training the machine-trained model and for updating existing collections of data records using the machine-trained model.

Abstract: The present disclosure provides a neural network-based method for calibration and localization of an indoor inspection robot. The method includes the following steps: presetting positions for N label signal sources capable of transmitting radio frequency (RF) signals; computing an actual path of the robot according to numbers of signal labels received at different moments; computing positional information moved by the robot at a tth moment, and computing a predicted path at the tth moment according to the positional information; establishing an odometry error model with the neural network and training the odometry error model; and inputting the predicted path at the tth moment to a well-trained odometry error model to obtain an optimized predicted path. The present disclosure maximizes the localization accuracy for the indoor robot by minimizing the error of the odometer with the odometry calibration method.