Abstract: A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: This invention provides a method for screening compounds against Flavivirus. More specifically, this invention provides a method for screening compounds against Flaviviruses by using a persistent virus-infected cell system, including (a) establishment of persistent virus-infected cell lines, (b) preparation of monoclonal antibody by using said persistent virus-infected cell lines, (c) incubation of tested compounds with said persistent virus-infected cell lines, (d) determination of the inhibition effect of tested compounds or vaccines on Flavivirus by sandwich ELISA using said monoclonal antibody.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A distributed software application comprises a plurality of software components within a plurality of executables. A manager component for the distributed software application performs a recovery of two or more software components, of the plurality of software components, in an ordered sequence based on one or more dependency relationships among the plurality of software components.

Abstract: A manager component of an apparatus in one example initializes a plurality of software components of a distributed software application, within one or more executables, in an ordered sequence based on one or more dependency relationships among the plurality of software components.

Abstract: An apparatus in one example comprises a substitute manager component that upon failure of a first manager component, obtains management responsibility for a distributed software application from the first manager component and queries one or more software components of the distributed software application for state information of the one or more software components. The substitute manager component employs the state information to determine whether one or more recovery actions are needed for the distributed software application to recover from the failure of the first manager component.

Abstract: An apparatus in one example comprises a manager component in communication with a distributed software application. The distributed software application comprises a plurality of software components that run within one or more executables. The manager component shuts down the plurality of software components in an ordered sequence based on one or more dependency relationships among the plurality of software components.

Abstract: A distributed software application comprises a plurality of software components within a plurality of executables. A manager component for the distributed software application handles: an addition of one or more first resources to the distributed software application on behalf of the distributed software application and/or a removal of one or more second resources from the distributed software application on behalf of the distributed software application.

Abstract: A heat dissipation module includes an air conveying device, a first member and a second member. The first member has at least one air inlet, and the second member is formed with a heat transfer enhancing structure on its surface and mounted on a heating element. The second member is coupled to the first member to form a cooling chamber having at least one air vent, and allows the heat transfer enhancing structure to be received therein. The air conveying device draws airflow into and out of the cooling chamber, and the heat transfer enhancing structure defines at least one passage along which the airflow propagates in the cooling chamber.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: A heat sink comprises a plurality of heat-dissipating units, and each heat-dissipating unit provides a base and a plurality of parallel fins disposed thereon, respectively. The fins of any two adjacent heat-dissipating units extend in different directions.

Abstract: A fastening device is used to tightly attach the heat sink on an electronic element. The fastening device includes an elastic arm, a first latch element and a second latch element. The elastic arm has a first axial part, a second axial part, and a press part. The first latch element is secured to one side of the socket for mounting the electronic element thereon and pivotally coupled to the first axial part, and the second latch element is pivotally coupled to the second axial part. As the elastic arm turns about the first latch element and crosses the heat sink, the second latch element is allowed to be fastened onto another side of the socket. Thus, the press part of the elastic arm would urge against the heat sink to enable the heat sink to be tightly attached on the electronic element.

Abstract: A heat dissipation module includes a fan and a heat sink. The shaft of the fan, made from materials with high thermal conductivity, has a first end and an opposite second end, with the first end penetrating a fan hub and connecting to a heating element. The heat sink is connected to the second end of the shaft.

Abstract: The invention discloses an annular heat-dissipating device formed by a plurality of fins combined together, all of which are arranged around a base, wherein one side of each of the plurality of fins is coupled to the base, respectively. The heat-dissipating device of the invention can greatly increase the heat-dissipating area so as to effectively dissipate heat generated from the electronic elements to the outside.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element is comprised of a heat conductive plate and a heat conductive block installed at the center thereof. The area of the lower surface of the heat conductive block is greater than that of the upper surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: The present invention provides a digital camera DIY wireless photo print device. The device comprises a billing box, a wireless image-receiving unit, a processor, a monitor, and a photo printer. Wherein, the processor includes a plurality of control and IrDA protocol-processing programs to control the other units that are connected to the processor. The billing box provides a variety of payment methods. The monitor displays the two-way communication between the device and the user, and also displays the status of the image file transmission. The wireless image-receiving unit receives the optic signal of the image file, processes the photo-electronic transformation, and outputs an image file data to the processor. The processor controls the photo printer to print and output the photo.

Abstract: A fastening device is used to tightly attach the heat sink on an electronic element. The fastening device includes an elastic arm, a first latch element and a second latch element. The elastic arm has a first axial part, a second axial part, and a press part. The first latch element is secured to one side of the socket for mounting the electronic element thereon and pivotally coupled to the first axial part, and the second latch element is pivotally coupled to the second axial part. As the elastic arm turns about the first latch element and crosses the heat sink, the second latch element is allowed to be fastened onto another side of the socket. Thus, the press part of the elastic arm would urge against the heat sink to enable the heat sink to be tightly attached on the electronic element.