Abstract: A video taking device comprises a video camera, an auxiliary controller and a main controller, wherein the video camera is electrically connected with the auxiliary controller and the main controller and the auxiliary controller is electrically connected with the main controller. The video camera is configured to film to generate a video stream. The auxiliary controller is configured to determine whether there is a target existing in the video stream, and to generate a switch instruction when the target exists in the video stream. The main controller is configured to switch into a first operation mode from a first standby mode and instruct the auxiliary controller to be in a second standby mode when receiving the switch instruction, and to obtain the video stream from the video camera for recognizing appearance of the target.

Abstract: A backlight module includes a light guiding unit having a light input surface and a light-emitting unit having light-emitting elements disposed along a first direction and adjacent to the light input surface. A second direction is from the light input surface to the light-emitting unit. A first protruding portion of the light guiding unit includes a sharp protrusion tip at the bottom surface and a part of the light input surface. A curved convex connecting surface of the light input surface connects to the first protruding portion to form a turning portion which is disposed between the connecting surface and the first protruding portion, and is at its intermediate portion and outwardly protrudes toward the light-emitting elements along the second direction. The light-emitting elements are across from the connecting surface and generally positioned above the first protruding portion in the third direction.

Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.

Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.

Abstract: An electronic apparatus having a display device including a display panel and a light source. The display panel includes a first substrate and a second substrate disposed oppositely, and a display medium layer disposed therebetween. The light source is disposed adjacent to the display panel. The display panel includes several display units, including a first display unit and a second display unit when light passes through the display medium layer. The second display unit is farther from the light source than the first display unit. It is designed that the second haze value is greater than the first haze value.

Abstract: The disclosure provides a high permeable porous substrate. The high permeable porous substrate includes a porous substrate body and a plurality of channels. The plurality of channels penetrate the first surface of the porous substrate body and do not penetrate the second surface of the porous substrate body. In addition, a solid oxide fuel cell supported by the high permeable porous substrate is also provided.

Abstract: A high volumetric energy and power density supercapacitor is provided. This supercapacitor includes a coin cell, a spring lamination, a working electrode, a counter electrode, a separator, and an ionic liquid electrolyte. The working and counter electrodes are N-P doping porous graphene coated on Al substrate. The ionic liquid electrolyte is EMI-FSI. The method of producing N-P doping porous graphene includes following steps: S1: Graphite oxide is quickly transferred into the furnace, which had been held at 300° C. and the porous graphene can be produced. S2: The porous graphene and red phosphorus are put together in the evacuated tube furnace and heated to 700° C. for 1 hr. S3: Heated to 800° C. for 30 min in a mixed argon and ammoniac atmosphere and then the N-P doping porous graphene can be made. The capacitance of the supercapacitor is 105 F/g and the volumetric power density is 1.19 kW/L.

Abstract: A portable flame electric generation device having metal-supported solid oxide fuel cells includes a furnace, a heat shield structure, a plurality of metal-supported solid oxide fuel cells and a housing structure. Each of the metal-supported solid oxide fuel cells includes a porous metal substrate, a first anode layer, a second anode layer, an anode isolation layer, an electrolyte layer, a cathode isolation layer, a cathode interface layer and a cathode current-collecting layer. The metal-supported solid oxide fuel cell is capable of quickly starting up and withstanding thermal shocks, and also liquefied fuel cartridges are applied as heating and fuel sources for transforming the CO and H2 fuels into electricity via electrochemical reactions.

Abstract: A method of cleaning a wafer in semiconductor fabrication is provided. The method includes cleaning a wafer using a wafer scrubber. The method further includes moving the wafer scrubber into an agitated cleaning fluid. The method also includes creating a contact between the wafer scrubber and a cleaning stage in the agitated cleaning fluid. In addition, the method includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning fluid.

Abstract: An electronic device includes a first substrate, a first conductive layer, a plurality of first electrode pads, a plurality of first light-emitting units, a plurality of first signal pads and a conductive structure. The first conductive layer is disposed on the first substrate. The first electrode pads are disposed on the first conductive layer. The first light-emitting units overlap and are disposed on the first electrode pads. The first light-emitting units are electrically connected to the first electrode pads respectively. The first signal pads are disposed on the first conductive layer and electrically connected to the first conductive layer. The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure.

Abstract: A tube joint structure for industrial-style furniture rack includes a tube body. The tube body is assembled by two or more half-configured housings including a first housing and a second housing. The first housing and the second housing are respectively formed by stamping two metal pieces. Two recessed portions are formed on opposite sides of the first housing and the second housing, respectively. The recessed portion of the first housing and the recessed portion of the second housing enclose an accommodating space. The tube body has at least two tube openings communicating with the accommodating space.

Abstract: A silver particles manufacturing method comprises following steps: providing a silver containing compound; providing an organic solution; adding the silver containing compound into the organic solution, to perform ultrasonic vibrations or a heating process until the silver containing compound is dissolved completely into the organic solution, to form a silver ion solution; performing the ultrasonic vibrations or the heating process, and then let the solution settle down for a period, to form a silver particles synthesized solution; and placing the silver particles synthesized solution into a centrifuge to perform centrifugation and separation, to obtain ?m-scale silver particles and nm-scale silver particles. The silver particles manufacturing method has the advantages of low pollution, low cost, high yield, and mass production.

Abstract: A water circulation system for air conditioning system and a control method thereof, wherein the water circulation loop comprises: a main loop provided with air-conditioning indoor units, air-conditioning outdoor units and an actuator, and a bypass branch connected between upstream and downstream of the air-conditioning outdoor units and provided with a bypass valve; the control method comprises: S100, starting the water circulation system after receiving a start command; S200, executing a PID control step after initialization and a first preset time period of the water circulation system; S300, executing a feed forward control step when the operating states of the air-conditioning indoor units and/or the air-conditioning outdoor units are changed, and going back to execute the PID control step after a second preset time period; and S400, executing a shutdown step of the water circulation system after receiving a shutdown command.

Abstract: A light-emitting module is provided. The light-emitting module includes a light-emitting structure and a carrying substrate. The light-emitting structure includes a plurality of light-emitting elements and a first positioning mark. The carrying substrate includes a second positioning mark. The light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction.

Abstract: An electronic device and a tiling electronic apparatus are disclosed and include a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.

Abstract: An electronic apparatus includes a first display panel and a second display panel. The first display panel includes first light-emitting elements, a first edge, and a first left region. The second display panel includes second light-emitting elements, a second edge adjacent to the first edge, and a first right region. The difference between the average brightness of the first light-emitting elements located in the first left region of the first display panel and the average brightness of the second light-emitting elements located in the first right region of the second display panel is from 0% to 20%.

Abstract: A display apparatus includes a fixing frame, a first display device, and a second display device. The first display device is disposed on the fixing frame, and includes an upper electrical connector. The second display device is disposed on the fixing frame and the first display device, and includes a lower electrical connector electrically connected to the upper electrical connector.

Abstract: An electronic device includes a substrate, a plurality of metal pads, and a plurality of light emitting diodes. The metal pads are disposed on the substrate and form an array. Each of the light emitting diodes is electrically connected to at least two of the metal pads. The metal pads include a plurality of dummy metal pads electrically isolated to the light emitting diodes.

Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.