Abstract: An optical fiber distribution panel assembly wherein a panel holding fiber connector blocks is pivotably mounted to a base member about a horizontal axis. Fibers exiting an optical switching module supported on the base member are routed up the sides of the panel and terminated at appropriate ones of the fiber connector blocks. Excess slack fiber is coiled and placed on fiber takeup saddles secured to a panel overlying the connector block field. A cover panel overlies the saddle-holding panel to complete the assembly.

Abstract: A high density optical connecting block 100 is mounted in a relatively thin, flat panel 10, and is constructed as an array of identical cells 110 that are linked together as a one-piece unit. The cells have a front-to-back depth that is greater than ten millimeters for imparting flexural rigidity to the panel. The array includes at least twelve cells that are arranged in two or more rows and two or more columns. Each cell has a front side that is shaped to receive and interlock with a duplex optical connector 50, and a back side that is shaped to receive and interlock with two simplex optical plugs 20. The duplex connector is a unifying structure that yokes a pair of simplex optical plugs 20-1, 20-2 into a duplex configuration.

Abstract: An ESD protection structure that when connected between an input/output pad on a semiconductor substrate and a reference voltage source, will protect internal circuits formed on the semiconductor substrate from over stress due to excessively high voltages of an ESD voltage source. The ESD protection structure has a uniform discharge current to prevent damage to the ESD protection device thus allowing increased protection to the internal circuits. The ESD protection device has at least one source region that is the emitters of parasitic transistors connected to the reference voltage source and at least one drain region that is the collectors of the parasitic transistors connected to the junction of the input/output pad and the internal circuitry. The ESD protection device further has at least one gate electrode formed above a channel region. The channel region is the region is between each of the source regions and the drain regions. The gate electrodes are connected to the reference voltage source.

Abstract: A high density optical connecting block 100 is mounted in a relatively thin, flat panel 10, and is constructed as an array of identical cells 110 that are linked together as a one-piece unit. The cells have a front-to-back depth that is greater than ten millimeters for imparting flexural rigidity to the panel. The array includes at least twelve cells that are arranged in two or more rows and two or more columns. Each cell has a front side that is shaped to receive and interlock with a duplex optical connector 50, and a back side that is shaped to receive and interlock with two simplex optical plugs 20. The duplex connector is a unifying structure that yokes a pair of simplex optical plugs 20-1, 20-2 into a duplex configuration.

Abstract: Apparatus for routing cables in a distribution frame. The apparatus includes a planar panel having takeup spools mounted thereon for the storage of excess lengths of cable. A hollow cylindrical member is mounted for pivoting movement about a pivot axis, where the longitudinal axis of the cylindrical member is parallel to the pivot axis. The cylindrical member has a longitudinally extending gap in its wall. Cables are routed to the panel, are selectively wound on selected ones of the spools to provide slack management, are routed into the cylindrical member, and are routed out of the cylindrical member through the gap.

Abstract: A U-shaped metal member for securing a circuit component to a circuit board in place of conventional screws and nuts. The element is inserted through aligned holes of the component and the board and is wave soldered to the board for permanent securement.

Abstract: A tool for extracting a press fit pin from a pin field in a backplane of an electronic system. The tool includes a shaft having first and second ends, with a chuck mounted to the first end and an abutment mounted to the second end. The chuck has a plurality of jaws adapted to grip the pin therebetween and a weight is slidably mounted on the shaft between the chuck and the abutment. After a pin is held by the chuck, the weight is slid along the shaft to contact the abutment and the kinetic energy imparted by the weight to the shaft acts to pull the pin out of the backplane.

Abstract: An assembly for improving the shielding of an electronic system from electromagnetic interference radiation and electrostatic discharge includes a U-shaped conductive bracket as part of the face plate assembly secured to an edge of a circuit card. A conductive latch member is pivotably mounted on the bracket and extends through open slots in the bracket. A conductive gasket is provided on one side of each bracket to engage the opposite side of the bracket of an adjacent face plate assembly. Other conductive gaskets slidingly engage the latch member and seal the slots in the bracket.

Abstract: An assembly for improving the shielding of an electronic system from electromagnetic interference radiation and electrostatic discharge includes a U-shaped conductive bracket as part of the face plate assembly secured to an edge of a circuit card. A conductive latch member is pivotably mounted on the bracket and extends through open slots in the bracket. A conductive gasket is provided on one side of each bracket to engage the opposite side of the bracket of an adjacent face plate assembly. Other conductive gaskets slidingly engage the latch member and seal the slots in the bracket.

Abstract: A lockable latch and switch actuator assembly for a circuit card includes a spring clip having a slot cooperating with a tab on a latch handle to lock the latch in its closed position. A release portion on the spring clip may be pushed to release the tab from the slot and unlock the latch. The other end of the spring clip is formed with an actuating portion which engages the actuator of a proximity switch mounted to the circuit card when the latch is in its locked position. This actuating portion is spring loaded so that when the latch is released from the locked position, the latch is pushed to an ajar position from which it can be moved to its fully open position.

Abstract: An ESD protection structure that when connected between an input/output pad on a semiconductor substrate and a reference voltage source, will protect internal circuits formed on the semiconductor substrate from over stress due to excessively high voltages of an ESD voltage source. The ESD protection structure has a uniform discharge current to prevent damage to the ESD protection device thus allowing increased protection to the internal circuits. The ESD protection device has at least one source region that is the emitters of parasitic transistors connected to the reference voltage source and at least one drain region that is the collectors of the parasitic transistors connected to the junction of the input/output pad and the internal circuitry. The ESD protection device further has at least one gate electrode formed above a channel region. The channel region is the region is between each of the source regions and the drain regions. The gate electrodes are connected to the reference voltage source.

Abstract: A conductive tubular member surrounding an optical fiber and its connector termination. When the fiber connector termination engages a complementary connector extending through an opening in a conductive faceplate of an electronics system, the tubular member engages the securement nut holding the connector to the faceplate to function as a waveguide which attenuates radiation leaking from non-conductive gaps in the faceplate and connector. In addition, the tubular member functions as a ground path for electrostatic discharges.

Abstract: An electronic system having circuit cards insertable into a shelf unit, with shielding between adjacent circuit cards, is provided with a guide fin assembly having protruding guide fins between adjacent circuit card faceplates to limit cumulative tolerance build up between inserted circuit cards.

Abstract: Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.

Abstract: Methods are disclosed for depositing an in situ polysilicon layer on the back of a semiconductor wafer to reduce the temperature at the edge of the wafer during rapid thermal annealing (RTA). The reduced temperature results in decreased boron penetration at the edge of the wafer and a more uniform silicide resistance and threshold voltage across the wafer.

Abstract: The present invention relates to a process for preparing pyromellitic dianhydride via an oxidation in gas phase under normal pressure. The process is characterized in that a catalyst system is used, which catalyst system comprises a catalyst which is a mixture of vanadium and tungsten oxides; a catalyst support comprising rutile and at least one material selected from the group consisting of tungsten carbide, silicon carbide and a mixture thereof; and a cocatalyst comprising oxides of manganese, antimony, bismuth, phosphorus, copper, aluminum, titanium or a mixture thereof, an oxide of an element of the VIIIB group of the periodic table, and an oxide of an alkali metal and/or alkaline earth metal. In this process, pyromellitic dianhydride is produced from a feedstream containing 1,2,4,5-tetraalkylbenzene in a gas flow rate of 4,000.about.12,000 hr.sup.-1 via a selective oxidation at 300.about.450.degree. C. in the presence of air which acts as an oxidant.

Abstract: An outdoor electronics enclosure which provides both weather protection and heat dissipation. The plastic enclosure is divided into two compartments. The first compartment has apertures in its exterior walls and contains an inner metal heat radiating box containing active electronic components. The second compartment is weathertight and contains passive components.

Abstract: A modular house includes a floor assembly, a peripheral wall assembly and a roof assembly. The floor assembly includes an annular frame unit adapted to be received fittingly within a rectangular cavity of the ground, and a floor unit fitted within the frame unit. The frame unit includes two U-shaped frames which abut against each other side by side and which has an annular floor slot unit formed in the inner peripheral surface thereof, and an annular groove formed in the top surface thereof. The floor unit includes two rectangular floor halves having outer peripheries which are engaged within the floor slot unit of the frame unit. Four vertical corner pillars stand on the corners of the floor assembly and have lower ends retained in the annular groove of the frame unit so as to define four wall spaces, in each of which at least one rail, a heating insulating plate unit and a sound absorbing plate unit are provided.