Abstract: A light combining/projecting system for outputting light beams of the same polarization includes a light-emitting module, a dichroic mirror, a reflective mirror module, a PBS module, an image-displaying module, and a light-combining module. The PBS module has a first, a second, and a third PBS respectively and integratedly arranged on three sides of the dichroic mirror. The image-displaying module has a first, a second, and a third image-displaying panel respectively arranged beside the first, the second, and the third PBS. The reflective mirror module has a first, a second, and a third reflective mirror under the first, the second, and the third PBS. The dichroic mirror is arranged at a corner position between the second and the third PBS. The light-combining module, the PBS module, the image-displaying module, the reflective mirror module, and the dichroic mirror are all mated together for generating light beams of the same polarization.

Abstract: A holding device (40) used for helping fasten an interface card (10) in a peripheral component interconnect (PCI) connector (20) includes a top wall (42), at least a pair of opposite sidewalls (44) for clamping the two sides of the PCI connector, and at least a pair of holding portions (48) for fastening the interface card. Wherein the sidewalls connect with the top wall, and the holding portions connect with the top wall.

Abstract: A liquid crystal display device is disclosed, which comprises an upper substrate, a lower substrate, and a liquid crystal layer. The lower substrate has several pixel electrodes, metal lines, and switch elements thereon. Each switch element comprises a source electrode, a drain electrode, a gate electrode, and an opening between the source electrode and the drain electrode. A passivation layer covering the surface of the source electrode and the drain electrode forms two inclined planes separately on two sides. The two inclined planes face each other and are locating on a kink or step of the source electrode and drain electrode. The inclined planes also contact each other at the upper side of the opening. The inclinations of the inclined planes to the lower substrate are in a range from 5 to 50 degrees.

Abstract: A method for measuring a cell gap of a liquid crystal panel, comprises providing a detection device, holding the liquid crystal panel vertically, heating the liquid crystal panel to a detection temperature between 50° C. to 70° C., and measuring the cell gap of the liquid crystal panel with the detection device.

Abstract: An apparatus for detecting non-uniform cell gap in a liquid crystal display panel is disclosed, which comprises a first plate, an axle, and a cell gap detecting unit. A surface of the first plate has at least one holding mechanism for fixing at least one the liquid crystal display panel onto the first plate. The axle connects to the first plate and is used to rotate the first plate. The cell gap detecting unit detects the cell gap in the liquid crystal display panel.

Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.

Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.

Abstract: A method for desmearing pulse-type D.C. plasma and an apparatus for the method, the apparatus has a vacuum chamber for a vacuum pumping system to make the chamber a vacuum state. An electrode holder is provided in the vacuum chamber for a plurality of electrode plates separately mounted thereon in a line. The electrode plates use a pulse-type D.C. power supply as a source of energy for excitation of plasma. An electrode plate to be processed is located between every two electrode plates in a state of floating. A gas inlet system is provided in order that the aforesaid vacuum pumping and excitation of plasma can cooperatively make uniform distribution of reaction gas in the vacuum chamber to shorten the process flow and the operation time of desmearing in the holes of a printed circuit board and to lower the cost of equipment.

Abstract: A method of manufacturing resin articles with naturally formed patterns is provided. The method uses organic matter, such as portions of a fern like the "Sphaeropteris lepifera", and a resin, to be molded together and then machined into a desired shape. The inner surfaces of the upper mold section and the lower mold section are covered by aluminum foil sheets and enclose a portion of a fern, such as the "Sphaeropteris lepifera" therein. A resin is injected into the mold through an opening in one foil sheet and the mold is heated to an appropriate temperature. Subsequently, the mold is cooled by room temperature air and dried by a drying machine. The resin is removed from the mold and machined into a particular shape in accordance with a predetermined design. The shaped molded resin is smoothed by grinding or filling in uneven portions with resin. After smoothing, the molded resin is polished to provide a naturally-formed pattern on the surface thereof.