Patents by Inventor Liang Liu

Liang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DATA TRANSMISSION METHOD, TERMINAL AND NETWORK SIDE DEVICE
    Publication number: 20230319941
    Abstract: A data transmission method includes: a terminal in an RRC inactive state transmits a data packet and an RRC resume request to a first base station or the CU of the first base station or the DU of the first base station; receive an RRC release message transmitted by the first base station or the CU of the first base station or the DU of the first base station.
    Type: Application
    Filed: July 30, 2021
    Publication date: October 5, 2023
    Applicants: CHINA MOBILE COMMUNICATION CO., LTD RESEARCH INSTITUTE, CHINA MOBILE COMMUNICATIONS GROUP CO., LTD.
    Inventors: Liang LIU, Ningyu CHEN, Xingyu HAN, Nan HU
  • SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20230307497
    Abstract: A semiconductor device comprises: a SiC epitaxial layer and a first recess. The SiC epitaxial layer has: a p-type well region; a heavily doped n-type region on a surface of the p-type well region; and a heavily doped p-type region below the heavily doped n-type region and within the p-type well region. The first recess is formed in the heavily doped p-type region and the heavily doped n-type region, wherein a depth of the first recess exceeds a depth of the heavily doped n-type region.
    Type: Application
    Filed: January 18, 2023
    Publication date: September 28, 2023
    Inventors: YUAN LIANG LIU, YI CHEN LEE, YEN CHANG CHEN
  • HANDOVER METHOD, PROCESSING METHOD, DEVICES, NETWORK DEVICE AND CORE NETWORK DEVICE
    Publication number: 20230300681
    Abstract: A handover method, a processing method, a handover device, a processing device, a network device and a core network device are provided. The handover method includes: transmitting a handover request message to a second network device, the handover request message carrying relevant information of a first MBS; and receiving a handover request acknowledgement message transmitted by the second network device, the handover request acknowledgement message carrying access control-related information of the first MBS.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 21, 2023
    Inventors: Liang LIU, Nan LI, Xiaodong XU, Nan HU, Xiaoman LIU
  • APPARATUS AND METHOD FOR SELECTING HIGH QUALITY IMAGES FROM RAW IMAGES AUTOMATICALLY
    Publication number: 20230298158
    Abstract: A method for selecting good quality images from raw images of a patterned substrate. The method includes obtaining a plurality of raw images (e.g., SEM images) of a patterned substrate; determining a raw image quality metric (e.g., an image score, an average slope, distance between contours) based on data associated with one or more gauges or one or more contours of one or more features within each image of the plurality of raw images, the raw image quality metric being indicative of a raw image quality; and selecting, based on the raw image quality metric, a sub-set of raw images from the plurality of raw images. The sub-set of raw images can be provided for performing more accurate measurements of the one or more features within an image.
    Type: Application
    Filed: July 20, 2021
    Publication date: September 21, 2023
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jiao HUANG, Jinze WANG, Hongfei SHI, Mu FENG, Qian ZHAO, Alvin Jianjiang WANG, Yan-Jun XIAO, Liang LIU
  • Methods, devices and computer readable medium for authentication in communication
    Patent number: 11765583
    Abstract: Embodiments of the disclosure provide a method, device and computer readable medium for authentication. According to embodiments of the present disclosure, only the first terminal device in a group of terminal devices which requests to connect to a network needs to finish the whole authentication. Upon the first terminal device successfully accesses to the network, the remaining terminal devices in the same group can ignore the authentication. In this way, time for authentication is reduced and the calculation efforts related to authentication is reduced for a large number for terminal devices.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: September 19, 2023
    Assignee: Nokia Technologies Oy
    Inventors: Liang Liu, Yang Liu
  • MULTI-LAYER PRINTED CIRCUIT BOARD
    Publication number: 20230292437
    Abstract: A multi-layer printed circuit board includes a base-layer metal, multiple middle metal layers and a top-layer metal. The middle metal layers are stacked on the base-layer metal sequentially. The top-layer metal is disposed on the middle metal layers. The base-layer metal, each middle metal layer and the top-layer metal are formed with multiple through holes respectively. Part of the middle metal layers are separately formed with multiple hole groups corresponding to the through holes. Each hole group includes multiple passing holes. The passing holes jointly surround a corresponding one of the through holes to form multiple connecting channels. Therefore, the multi-layer printed circuit board may reduce the cooling speed of the through holes to avoid an excessively low temperature of a pad to affect the soldering efficiency with keeping the high-frequency transmission and the signal isolation.
    Type: Application
    Filed: May 31, 2022
    Publication date: September 14, 2023
    Inventor: Yu-Liang LIU
  • SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER
    Publication number: 20230275097
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor wafer. The semiconductor wafer comprises a handle wafer. A first oxide layer is disposed over the handle wafer. A device layer is disposed over the first oxide layer. A second oxide layer is disposed between the first oxide layer and the device layer, wherein the first oxide layer has a first etch rate for an etch process and the second oxide layer has a second etch rate for the etch process, and wherein the second etch rate is greater than the first etch rate.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 31, 2023
    Inventors: Kuan-Liang Liu, Yeur-Luen Tu
  • Apparatus for bond wave propagation control
    Patent number: 11742321
    Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Apparatuses and methods including dice latches in a semiconductor device
    Patent number: 11727967
    Abstract: Apparatuses and methods including dice latches in a semiconductor device are disclosed. Example dice latches have a circuit arrangement that include a reduced number of circuits, such as transistors, and provides a compact layout. Operation of example dice latches and other dice latches may be controlled by separately provided control signals for loading and latching of data, and in some examples, for a reset operation. Example layouts include circuit elements aligned along a direction with at least one other circuit element offset from the other aligned circuit elements.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: August 15, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yoshiro Riho, Hiroshi Akamatsu, Jian Long, Kevin G. Werhane, Liang Liu, Yoshinori Fujiwara
  • Package structure for chemical system
    Patent number: 11719665
    Abstract: The present application provides a package structure for a chemical system, which comprises an inner glue frame and a first outer glue frame. The inner glue frame forms an accommodating space for accommodating a chemical system. The first outer glue frame is further disposed outside the inner glue frame and used for isolating the ambient environment and thus avoiding the influence of the ambient environment on the chemical system. A second outer glue frame is further disposed for avoiding damages such as side bumps and falls of the chemical system or contact with foreign metals. Thereby, the performance of the chemical system can be maintained.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: August 8, 2023
    Assignees: Prologium Holding Inc., Prologium Technology Co., Ltd.
    Inventors: Szu-Nan Yang, Chin-Liang Liu, Meng-Hung Wu, Wen-Xin Fei
  • Transistor structure
    Patent number: 11721587
    Abstract: A transistor structure includes a source region and a drain region disposed in a substrate, extending along a first direction. A polysilicon layer is disposed over the substrate, extending along a second direction perpendicular to the first direction, wherein the polysilicon layer includes a first edge region, a channel region and a second edge region formed as a gate region between the source region and the drain region. The polysilicon layer has at least a first opening pattern at the first edge region having a first portion overlapping the gate region; and at least a second opening pattern at the second edge region having a second portion overlapping the gate region.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: August 8, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shih-Yin Hsiao, Ching-Chung Yang, Kuan-Liang Liu
  • SYSTEMS, METHODS, AND PRODUCTS FOR DETERMINING PRINTING PROBABILITY OF ASSIST FEATURE AND ITS APPLICATION
    Publication number: 20230244152
    Abstract: A method for determining a likelihood that an assist feature of a mask pattern will print on a substrate. The method includes obtaining (i) a plurality of images of a pattern printed on a substrate and (ii) variance data the plurality of images of the pattern; determining, based on the variance data, a model configured to generate variance data associated with the mask pattern; and determining, based on model-generated variance data for a given mask pattern and a resist image or etch image associated with the given mask pattern, the likelihood that an assist feature of the given mask pattern will be printed on the substrate. The likelihood can be applied to adjust one or more parameters related to a patterning process or a patterning apparatus to reduce the likelihood that the assist feature will print on the substrate.
    Type: Application
    Filed: June 17, 2021
    Publication date: August 3, 2023
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jen-Shiang WANG, Pengcheng YANG, Jiao HUANG, Yen-Wen LU, Liang LIU, Chen ZHANG
  • Water quality prediction
    Patent number: 11715001
    Abstract: This disclosure provides a computer-implemented method. The method may comprise estimating a value range of a water body parameter based on measured data for a water quality indicator of a first set of time-spatial points and measured data for the water quality indicator of a second set of time-spatial points; and determining an optimal value of the water body parameter from the estimated value range by comparing the measured data for the water quality indicator of the second set and simulated data for the water quality indicator of the second set, wherein the simulated data for the water quality indicator of the second set is obtained based on a fluid dynamic model using the measured data for the water quality indicator of the first set as an input of the fluid dynamic model and using a value in the estimated value range as a parameter of the fluid dynamic model.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 1, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jin Dong, Liang Liu, Zhuo Liu, Junmei Qu, Hong Zhou Sha, Wei Zhuang
  • Method of forming semiconductor-on-insulator (SOI) substrate
    Patent number: 11710656
    Abstract: The present disclosure, in some embodiments, relates to a method of forming a semiconductor structure. The method includes forming a plurality of bulk micro defects within a handle substrate. Sizes of the plurality of bulk micro defects are increased to form a plurality of bulk macro defects (BMDs) within the handle substrate. Some of the plurality of BMDs are removed from within a first denuded region and a second denuded region arranged along opposing surfaces of the handle substrate. An insulating layer is formed onto the handle substrate. A device layer comprising a semiconductor material is formed onto the insulating layer. The first denuded region and the second denuded region vertically surround a central region of the handle substrate that has a higher concentration of the plurality of BMDs than both the first denuded region and the second denuded region.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: July 25, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ta Wu, Kuan-Liang Liu
  • APPARATUSES AND METHODS INCLUDING DICE LATCHES IN A SEMICONDUCTOR DEVICE
    Publication number: 20230223059
    Abstract: Apparatuses and methods including dice latches in a semiconductor device are disclosed. Example dice latches have a circuit arrangement that include a reduced number of circuits, such as transistors, and provides a compact layout. Operation of example dice latches and other dice latches may be controlled by separately provided control signals for loading and latching of data, and in some examples, for a reset operation. Example layouts include circuit elements aligned along a direction with at least one other circuit element offset from the other aligned circuit elements.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Yoshiro Riho, Hiroshi Akamatsu, Jian Long, Kevin G. Werhane, Liang Liu, Yoshinori Fujiwara
  • ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20230216116
    Abstract: Provided are an electronic device and a manufacturing method therefor. The electronic device includes a first housing, a second housing, a cover plate, and a cell. The first housing includes a bottom plate and a first enclosure wall annularly disposed on a side of the bottom plate. The second housing includes a top plate and a second enclosure wall annularly disposed on a side of the top plate. The second enclosure wall is sleeved on an outer side wall of the first enclosure wall. The top plate is provided with an exit hole. The cover plate plugs the exit hole. One of a positive tab or a negative tab of the cell is connected to a part of the cover plate facing the exit hole. The other one of the positive tab or the negative tab is sandwiched between the first enclosure wall and the second enclosure wall.
    Type: Application
    Filed: September 3, 2020
    Publication date: July 6, 2023
    Inventors: Liang liang LIU, Yuan ZHU, Jianhua LIU, Jincheng LIU
  • SINUSOIDAL CORRUGATED TUBE-TYPE SPIRAL WOUNDED HEAT EXCHANGER SUITABLE FOR FLNG
    Publication number: 20230204296
    Abstract: A sinusoidal corrugated tube-type spiral wounded heat exchanger suitable for FLNG, wherein a top of an outer cylinder has a shell-side refrigerant inlet and a bottom thereof has a shell-side refrigerant outlet; a sinusoidal corrugated tube-type liquid distributor is below the shell-side refrigerant inlet, a first sinusoidal corrugated winding tube bundle and a second sinusoidal corrugated winding tube bundle, which are heat exchanger tubes with a sinusoidal wave shape, are inside the outer cylinder, and peaks and troughs of the first sinusoidal corrugated winding tube bundle and the second sinusoidal corrugated winding tube bundle are in staggered correspondence one by one from top to bottom; a sinusoidal corrugated tube-type liquid distributor includes a one-into-two-type tube, a two-into-four-type tube, two sinusoidal corrugated tube-type liquid distribution tubes from top to bottom.
    Type: Application
    Filed: May 14, 2021
    Publication date: June 29, 2023
    Applicant: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)
    Inventors: Hui HAN, Yuxing LI, Jianlu ZHU, Chongzheng SUN, Cuiwei LIU, Qihui HU, Wuchang WANG, Xinran YU, Liang LIU, Guocong WANG, Hui ZHOU
  • Internal supporting part structure for plastic tank
    Patent number: 11685254
    Abstract: An internal support part structure for a plastic tank includes a support rod and end surface components disposed at two ends of the support rod. The support rod is made of a first material. An outer surface of the end surface component is covered by a second material. An outer edge of the end surface component has a regular or irregular shape. The structure resolves a problem that a second material wrapping a first material and connected to an inner wall of a plastic tank may be easily pulled off the inner wall. When a fuel tank is impacted, the support rod of the structure breaks first, to protect the surface of the fuel tank from damage.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 27, 2023
    Assignee: YAPP AUTOMOTIVE SYSTEMS CO., LTD.
    Inventors: Lin Jiang, Liang Liu, Hao Lv, Weidong Su, Anyu Wang, Gang Zhou, Yuewen He, Wenjuan Dou
  • Handover method, information exchange method, device and computer readable storage medium
    Patent number: 11689972
    Abstract: A handover method, information exchange method, device and computer readable storage medium are provided. In some embodiments, a first network device may acquire multi-connectivity capability information of a candidate second network device during a handover process, so that the first network device may select, based on the multi-connectivity capability information, a candidate second network device capable of providing an multi-connectivity service as a second network device.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: June 27, 2023
    Assignees: China Mobile Communication Co., Ltd Research Institute, China Mobile Communications Group Co., Ltd.
    Inventors: Fang Xie, Zhuo Chen, Liang Liu, Na Li
  • FGF21 variant, fusion protein and application thereof
    Patent number: 11679143
    Abstract: A fibroblast growth factor 21 (FGF21) variant, further to a FGF21 variant fusion protein, a protein multimer, and use thereof can significantly improve the binding ability with the target and can be used to treat metabolic diseases.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 20, 2023
    Assignee: SUNSHINE LAKE PHARMA CO., LTD.
    Inventors: Chao Chen, Shushan Lin, Yu Li, Xiaofeng Chen, Wenjia Li, Liang Liu, Zheng Fu