Patents by Inventor Liang Liu

Liang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11685254
    Abstract: An internal support part structure for a plastic tank includes a support rod and end surface components disposed at two ends of the support rod. The support rod is made of a first material. An outer surface of the end surface component is covered by a second material. An outer edge of the end surface component has a regular or irregular shape. The structure resolves a problem that a second material wrapping a first material and connected to an inner wall of a plastic tank may be easily pulled off the inner wall. When a fuel tank is impacted, the support rod of the structure breaks first, to protect the surface of the fuel tank from damage.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 27, 2023
    Assignee: YAPP AUTOMOTIVE SYSTEMS CO., LTD.
    Inventors: Lin Jiang, Liang Liu, Hao Lv, Weidong Su, Anyu Wang, Gang Zhou, Yuewen He, Wenjuan Dou
  • Patent number: 11679143
    Abstract: A fibroblast growth factor 21 (FGF21) variant, further to a FGF21 variant fusion protein, a protein multimer, and use thereof can significantly improve the binding ability with the target and can be used to treat metabolic diseases.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 20, 2023
    Assignee: SUNSHINE LAKE PHARMA CO., LTD.
    Inventors: Chao Chen, Shushan Lin, Yu Li, Xiaofeng Chen, Wenjia Li, Liang Liu, Zheng Fu
  • Patent number: 11683398
    Abstract: The embodiments of the present invention provide a method, apparatus for cross-protocol opportunistic routing, an electronic device, and a storage medium, the method includes: when there is a first data packet in a low-power wireless network, simulating the first data packet to generate a second data packet including to-be-transmitted data in the first data packet; obtaining identification information of a destination node in the first data packet, and selecting a low-power node with the lowest delay to the destination node in the low-power wireless network, except the first low-power node, as a forwarding low-power node based on the identification information of the destination node; sending the generated second data packet to the forwarding low-power node, so that the forwarding low-power node forwards the to-be-transmitted data to the destination node.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: June 20, 2023
    Assignee: BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Xiaolong Zheng, Dan Xia, Liang Liu, Huadong Ma
  • Patent number: 11676969
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor wafer. The semiconductor wafer comprises a handle wafer. A first oxide layer is disposed over the handle wafer. A device layer is disposed over the first oxide layer. A second oxide layer is disposed between the first oxide layer and the device layer, wherein the first oxide layer has a first etch rate for an etch process and the second oxide layer has a second etch rate for the etch process, and wherein the second etch rate is greater than the first etch rate.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: June 13, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Liang Liu, Yeur-Luen Tu
  • Patent number: 11664886
    Abstract: A routing method and apparatus for SDN-based LEO satellite network are disclosed. The LEO satellite network includes a control plane and a data plane. The control plane includes a central controller and a plurality of local controllers. The data plane includes a plurality of LEO satellite nodes and user terminals connecting to the LEO satellite nodes. The control plane may be located on the earth, and thus the centralized management and control of the data plane are placed on the earth. A local controllers monitors LEO satellite nodes in a subnet or subnets of the local controller. The distance between a local controller and a LEO satellite node is much smaller than the distance between a GEO satellite node and the LEO satellite node, and thus the time delay and the traffic loss of communication are reduced.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: May 30, 2023
    Assignee: Beijing University of Posts and Telecommunications
    Inventors: Liang Liu, Huadong Ma, Pengrui Duan, Dan Xia
  • Patent number: 11618314
    Abstract: A support for connecting the upper and lower surfaces inside a fuel tank includes a connecting column. Each of the upper and lower sides of the connecting column is provided with an end surface. The end surface is coated with plastic. The connecting column is provided with a notch, and the number of the connecting column is at least one. The connecting column is configured in an I-shape, an H-shape, an M-shape, a W-shape or other shapes. The shape of the notch is V-shaped, U-shaped, semicircular or irregular. The notch is provided on a left side or a right side of the connecting column or in a middle of the connecting column.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 4, 2023
    Assignee: YAPP AUTOMOTIVE SYSTEMS CO., LTD.
    Inventors: Liang Liu, Weidong Su, Wenjuan Dou, Lin Jiang
  • Publication number: 20230094387
    Abstract: An ultrasonic-assisted heat press machine, includes a frame, a material tank, an extruder, an ultrasonic wave generator, and a heater. The material tank is disposed on the frame and includes a cavity for accommodating an oil-bearing raw material. The extruder is extended in the cavity. The ultrasonic wave generator is disposed on the frame and adjacent to the material tank. The heater is disposed on the frame and adjacent to the material tank. The heater is configured to produce heat to heat the cavity and the ultrasonic wave generator, and regulate the working frequency of the ultrasonic wave generator. When in use, the heater, the extruder, and the ultrasonic wave generator cooperate to separate oil from the oil-bearing raw material in the material tank.
    Type: Application
    Filed: May 19, 2022
    Publication date: March 30, 2023
    Inventors: Chao HE, Hui ZHANG, Liang LIU, Youzhou JIAO, Mingming LAN, Gang LI, Xiaohui PAN, Xinxin LIU, Yawei WANG, Guizhuan XU, Xiaoran MA, Huan ZHANG
  • Patent number: 11613784
    Abstract: The present invention provides methods of detecting ultraviolet radiation (UVR)-induced skin damage in a subject. The method includes the steps of: a) obtaining a skin sample from the subject; b) analyzing expression levels in the skin sample of UVR-induced differentially expressed genes (DEGs) listed in Table 8 or a subset thereof; and c) comparing the expression levels of the UVR-induced DEGs to a control skin sample; wherein, when the expression levels of the UVR-induced DEGs in the skin sample is above or below the level of each of the UVR-induced DEGs in the control sample, the subject is identified as likely being afflicted with UVR-induced skin damage. Also provided are methods for measuring the effectiveness of a test agent in reducing ultraviolet radiation (UVR)-induced damage.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: March 28, 2023
    Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Liang Liu, Yao Shen
  • Publication number: 20230072951
    Abstract: Provided are a cell reselection method and a device. The method includes: receiving, from a network device, a frequency priority and one of following: a frequency priority reason corresponding to the frequency priority, or information on whether to apply the frequency priority, or information on a condition to apply the frequency priority, or index information of the frequency priority.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 9, 2023
    Inventors: Xiaoran ZHANG, Nan HU, Xiaodong XU, Liang LIU
  • Publication number: 20230067605
    Abstract: A deep reinforcement learning (DRL)-based intelligent job batching method and apparatus, and an electronic device are provided. The method includes: obtaining static features and a dynamic feature of each job, where the static features of the job include a delivery date, a specification and a process requirement of the job, and the dynamic feature of the job includes a receiving moment; and inputting the static features and the dynamic feature of each job into a job batching module, and using a Markov decision process (MDP) by the job batching module to combine jobs with similar features in a to-be-batched job set into an identical batch, so as to minimize a total quantity of batches obtained finally and a difference in features of jobs in each batch. The DRL-based intelligent job batching method and apparatus can learn a stable batching strategy and provide a stable and efficient job batching solution.
    Type: Application
    Filed: November 25, 2021
    Publication date: March 2, 2023
    Applicant: Beijing University of Posts and Telecommunications
    Inventors: Liang LIU, Xiaolong ZHENG, Huadong MA, Chengling JIANG, Zihui LUO
  • Patent number: 11591274
    Abstract: Disclosed herein are compositions including cells of defined sets of microbial species (for example, 3, 16, 18, 19, 21, or 22 microbial species). Also disclosed are methods of using the microbial compositions that include contacting soil, plants, plant parts, or seeds with the composition. The microbial compositions are also used in methods of degrading biological materials, such as chitin-containing biological materials.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 28, 2023
    Assignee: AMVAC Chemical Corporation
    Inventors: Frederic Kendirgi, Xing Liang Liu, D. Ry Wagner, Sung-Yong H. Yoon
  • Publication number: 20230024008
    Abstract: Latch circuits with improved single event upset immunity and related systems, apparatuses, and methods are disclosed. An apparatus includes a fuse, a first driver circuit, and a second driver circuit. The fuse is configured to store a bit of information. The first driver circuit includes a first input terminal electrically connected to the fuse and a first output terminal electrically connected to a first latch input terminal. The second driver circuit includes a second input terminal electrically connected to the fuse and a second output terminal electrically connected to a second latch input terminal. The second latch input terminal is electrically isolated from the first latch input terminal by the first driver circuit and the second driver circuit.
    Type: Application
    Filed: October 3, 2022
    Publication date: January 26, 2023
    Inventor: Liang Liu
  • Patent number: 11550529
    Abstract: A vehicle dual-system compatible control method includes: building a first system and a second system respectively on two independent processors, the first system communicating with a display screen, an audio output unit and a touch screen; obtaining, by the first system, touch coordinates on the touch screen, and determining a type of an application currently being executed; sending, by the first system, a video signal to the display screen, and outputting an audio output signal to the audio output unit when an application in the first system is executed; sending, by the second system, a video signal to the display screen, outputting an audio output signal to the audio output unit through data interfaces of the first system, and obtaining touch coordinates of an application in the second system when the application in the second system is executed.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: January 10, 2023
    Assignee: FAURECIA CLARION ELECTRONICS (FOSHAN) LIMITED COMPANY
    Inventors: Baosheng Cui, Chao Luo, Zhichu Yang, Weijian Xuan, Liang Liu, Longjun He
  • Patent number: 11545443
    Abstract: A method for forming a hybrid-bonding structure is provided. The method includes forming a first dielectric layer over a first semiconductor substrate. The first semiconductor substrate includes a conductive structure. The method also includes partially removing the first dielectric layer to form a first dielectric dummy pattern, a second dielectric dummy pattern and a third dielectric dummy pattern and an opening through the first dielectric layer. The first dielectric dummy pattern, the second dielectric dummy pattern and the third dielectric dummy pattern are surrounded by the opening. In addition, the method includes forming a first conductive line in the opening. The first conductive line is in contact with the conductive structure.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: January 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Ming Wu, Kuan-Liang Liu, Pao-Tung Chen
  • Patent number: 11537433
    Abstract: A system, computer program product, and method to deriving a cost model and dynamic adjustment of the derived model responsive to dynamic modification of one or more of the resources in a hybrid shared resource environment. Resources and corresponding configuration information are collected while monitoring runtime utilization of resource performance. As changes to the resources are discovered, the changes are subject to an assessment. A hybrid cost model is derived and configured to account for the one or more resources. The derived hybrid cost model is leveraged to conduct a multi-dimensional resource evaluation of the assessed changed configuration information. Responsive to the multi-dimensional evaluation, a generated resource utilization optimization of the one or more resources is selectively implemented.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: December 27, 2022
    Assignee: Kyndryl, Inc.
    Inventors: Sai Zeng, Braulio Gabriel Dumba, Matthew Staffelbach, Liang Liu, Emrah Zarifoglu, Umar Mohamed Iyoob, Manish Mahesh Modh
  • Publication number: 20220406819
    Abstract: A method includes: receiving a composite substrate including a first region and a second region, the composite substrate comprising a semiconductor substrate and an insulator layer over the semiconductor substrate; bonding a silicon layer to the composite substrate; depositing a capping layer over the silicon layer; forming a trench through the capping layer, the silicon layer and the insulator layer, the trench exposing a surface of the semiconductor substrate in the first region; growing an initial epitaxial layer in the trench; removing the capping layer to form an epitaxial layer from the silicon layer and the initial epitaxial layer; forming a transistor layer over the epitaxial layer, the transistor layer including a first transistor and a second transistor in the first region and the second region, respectively; and forming an interconnect layer over the transistor layer and electrically coupling the first transistor to the second transistor.
    Type: Application
    Filed: June 21, 2021
    Publication date: December 22, 2022
    Inventors: YUNG-CHIH TSAI, CHIH-PING CHAO, CHUN-HUNG CHEN, SHAOQIANG ZHANG, KUAN-LIANG LIU, CHUN-PEI WU, ALEXANDER KALNITSKY
  • Patent number: 11532642
    Abstract: The present disclosure relates an integrated chip. The integrated chip includes a polysilicon layer arranged on an upper surface of a base substrate. A dielectric layer is arranged over the polysilicon layer, and an active semiconductor layer is arranged over the dielectric layer. A semiconductor material is arranged vertically on the upper surface of the base substrate and laterally beside the active semiconductor layer.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Eugene I-Chun Chen, Kuan-Liang Liu, Szu-Yu Wang, Chia-Shiung Tsai, Ru-Liang Lee, Chih-Ping Chao, Alexander Kalnitsky
  • Publication number: 20220398865
    Abstract: Provided are a device and method for human parsing. The method includes receiving at least one piece of image data and ground truth values for human parsing, generating a height distribution map and a width distribution map for the image data, acquiring attention maps and scaled feature maps for each of a height and a width of the image data using the distribution maps, calculating a distribution loss rate by concatenating the scaled feature maps, acquiring an improved feature map on the basis of the calculated distribution loss rate, and performing human parsing on an object included in the image data using the improved feature map.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 15, 2022
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Won Jun HWANG, Kun Liang LIU
  • Publication number: 20220370060
    Abstract: The present invention provides a supporting hook structure, comprising a sleeve, a fixing rod, a first limit unit, a hook and a fixing device. The fixing rod is connected to the side surface of the sleeve. The hook body is connected to one end of the sleeve. The first limit unit is arranged on the side surface of the sleeve and adjacent to the hook body. The first limit unit makes the hook body rotates with the axis direction of the sleeve as a rotation axis. The fixing device is connected to the other end of the sleeve to fix the rotating position of the hook body. Through the above, the hook part enters the proximal thigh from a surgical entrance and the hook part rotates to make the hook part abut against the proximal femur to complete the positioning and fixation of the femur hook structure to the femur.
    Type: Application
    Filed: August 16, 2021
    Publication date: November 24, 2022
    Inventors: YAN-SHEN LIN, JIANN-JONG LIAU, YU-LIANG LIU, TEH-YANG LIN, WEN-CHUAN CHEN
  • Publication number: 20220359273
    Abstract: Various embodiments of the present application are directed towards a method for forming a semiconductor-on-insulator (SOI) substrate with a thick device layer and a thick insulator layer. In some embodiments, the method includes forming an insulator layer covering a handle substrate, and epitaxially forming a device layer on a sacrificial substrate. The sacrificial substrate is bonded to a handle substrate, such that the device layer and the insulator layer are between the sacrificial and handle substrates, and the sacrificial substrate is removed. The removal includes performing an etch into the sacrificial substrate until the device layer is reached. Because the device layer is formed by epitaxy and transferred to the handle substrate, the device layer may be formed with a large thickness. Further, because the epitaxy is not affected by the thickness of the insulator layer, the insulator layer may be formed with a large thickness.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 10, 2022
    Inventors: Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih-Pei Chou, Yu-Hung Cheng, Yeur-Luen Tu