Patents by Inventor Liang Peng

Liang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10030813
    Abstract: The present disclosure provides a target mounting fixture, including: a target fixing frame for fixing a target, the target fixing frame including a hoisting portion; a target carrier detachably connected to the target fixing frame; and a moving unit connected to the target carrier for moving the target carrier to move the target.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: July 24, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Deyong Wang, Tong Wang, Yang Xia, Sai Zhang, Qiong Yang, Xintao Bao, Beifan Ma, Deguo He, Quan Zhang, Mianen Chen, Liang Peng, Zengli Liu
  • Patent number: 10026201
    Abstract: An image classifying method includes the following operations: reducing an order of a color of a first image to generate a first order reduction image, wherein the first order reduction image includes several first image blocks; obtaining a second order reduction image from a database, wherein the second order reduction image includes several second image blocks; calculating several block color difference values between the first order reduction image and the second order reduction image respectively according to differences between a color value of each of the first image blocks and a color value of each of the second image blocks; and determining whether or not the first image belongs to a same category as the second order reduction image according to the block color difference values between the first order reduction image and the second order reduction image.
    Type: Grant
    Filed: March 26, 2017
    Date of Patent: July 17, 2018
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Shao-Liang Peng, Jia-Yu Juang, Wen-Ching Hu, Te-Yi Wu
  • Publication number: 20180150977
    Abstract: An image classifying method includes the following operations: reducing an order of a color of a first image to generate a first order reduction image, wherein the first order reduction image includes several first image blocks; obtaining a second order reduction image from a database, wherein the second order reduction image includes several second image blocks; calculating several block color difference values between the first order reduction image and the second order reduction image respectively according to differences between a color value of each of the first image blocks and a color value of each of the second image blocks; and determining whether or not the first image belongs to a same category as the second order reduction image according to the block color difference values between the first order reduction image and the second order reduction image.
    Type: Application
    Filed: March 26, 2017
    Publication date: May 31, 2018
    Inventors: Shao-Liang PENG, Jia-Yu JUANG, Wen-Ching HU, Te-Yi WU
  • Publication number: 20180137434
    Abstract: A character string recognition method includes: selecting a keyword database, which corresponds to content of a character string, from a number of keyword databases, wherein the selected keyword database comprises at least one prefix keyword, comparing the content of the character string with the at least one prefix keyword, when the content of the character string corresponds to one of the at least one prefix keyword, updating the content of the character string based on a definition of the prefix keyword which corresponds to the content of the character string, and when the content of the character string does not correspond to any of the at least one prefix keyword, selectively ending the character string recognition method, and outputting the content of the character string.
    Type: Application
    Filed: April 4, 2017
    Publication date: May 17, 2018
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chung-Chiang CHEN, Jia-Yu JUANG, Shao-Liang PENG, Te-Yi WU
  • Publication number: 20180133088
    Abstract: The application presents a multi-posture lower limb rehabilitation robot, which includes a robot base and a training bed. The training bed comprises two sets of leg mechanisms, a seat, a seat width adjustment mechanism, a mechanism for adjusting the gravity center of human body, a back cushion, a weight support system and a mechanism for adjusting the back cushion angle. The robot base comprises a mechanism for adjusting the bed angle. The mechanisms for adjusting the angles of bed and back cushion can be used together to provide paralysis patients with multiple training modes of lying, sitting, and standing postures. Each leg mechanism comprises hip, knee, and ankle joints, which are driven by electric motors; angle and force sensors are installed on each joint, and can be used to identify patients' motion intention to provide patients with active and assistant training.
    Type: Application
    Filed: March 20, 2015
    Publication date: May 17, 2018
    Inventors: Zengguang Hou, Weiqun Wang, Long Peng, Xu Liang, Liang Peng, Long Cheng, Xiaoliang Xie, Guibin Bian, Min Tan, Lincong Luo
  • Patent number: 9949929
    Abstract: A drug carrier and a manufacturing method thereof are provided. The drug carrier includes a hydrophilic group, a hydrophobic group and an organic dye. The hydrophilic group and the hydrophobic group are connected by the organic dye. A plurality of the drug carriers are self-assemblable in a polar solvent to form a nanomicelle. The hydrophilic groups are located at the outer region of the nanomicelle, and the hydrophobic groups are located at the inner region of the nanomicelle.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: April 24, 2018
    Assignee: NATIONAL TAIWAN UNIVERSITY HOSPITAL
    Inventors: Ming-Jium Shieh, Cheng-Liang Peng, Yuan-I Chen
  • Publication number: 20180106424
    Abstract: The present disclosure provides a target mounting fixture, including: a target fixing frame for fixing a target, the target fixing frame including a hoisting portion; a target carrier detachably connected to the target fixing frame; and a moving unit connected to the target carrier for moving the target carrier to move the target.
    Type: Application
    Filed: August 22, 2017
    Publication date: April 19, 2018
    Applicants: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Deyong WANG, Tong WANG, Yang XIA, Sai ZHANG, Qiong YANG, Xintao BAO, Beifan MA, Deguo HE, Quan ZHANG, Mianen CHEN, Liang PENG, Zengli LIU
  • Patent number: 9899309
    Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: February 20, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu
  • Patent number: 9898400
    Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: February 20, 2018
    Assignee: Rambus Inc.
    Inventors: Thomas A. Sheffler, Lawrence Lai, Liang Peng, Bohuslav Rychlik
  • Patent number: 9831191
    Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 28, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20170338173
    Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.
    Type: Application
    Filed: September 7, 2016
    Publication date: November 23, 2017
    Inventors: Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20170293552
    Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
    Type: Application
    Filed: April 25, 2017
    Publication date: October 12, 2017
    Inventors: Thomas A. Sheffler, Lawrence Lai, Liang Peng, Bohuslav Rychlik
  • Patent number: 9778024
    Abstract: Embodiments of the present invention disclose a target material thickness measuring apparatus including: a support; and a plurality of distance measuring units mounted on the support and arranged in a first direction, the plurality of distance measuring units being configured to respectively measure thicknesses of portions of a target material at a plurality of positions in the first direction. A plurality of thickness values of different portions of the target material along a straight line can be obtained at one time, for example, by performing a single measurement of thicknesses of the portions of the target material at the plurality of positions by means of the plurality of distance measuring units, thereby improving measurement efficiency.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: October 3, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Deyong Wang, Yefa Li, Liang Peng, Congqi Zheng, Daeyoung Choi
  • Publication number: 20170256481
    Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
    Type: Application
    Filed: March 30, 2016
    Publication date: September 7, 2017
    Inventors: Shih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu
  • Publication number: 20170243834
    Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.
    Type: Application
    Filed: May 9, 2016
    Publication date: August 24, 2017
    Inventors: Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu
  • Patent number: 9722098
    Abstract: A method of manufacturing a semiconductor device package includes disposing at least one die over a substrate, dispensing a liquid material on the die, and curing the liquid material so that the liquid material forms a protective layer attached to a portion of the die. The method further includes forming an encapsulant covering at least a portion of the substrate and a portion of the die, where the protective layer is exposed from the encapsulant in a cavity defined by the encapsulant. The method further includes removing the protective layer from the die, and disposing a cap over the cavity.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: August 1, 2017
    Assignee: ASE ELECTRONICS (M) SDN BHD
    Inventors: Kam Cheong Chung, Ahmad Zulmuhtasyim, Liang Peng Cheng, Lai Theng Chan
  • Publication number: 20170209327
    Abstract: The present invention discloses an upper limb rehabilitation robot system comprising a computer (8) and a rehabilitation robot (7), wherein the computer (8) is used for performing information interaction (11) with the rehabilitation robot (7), recording training information, sending control command to the rehabilitation robot (7), showing the virtual training environment, providing rehabilitation training visual feedback (14), and showing the control interface and rehabilitation training information; wherein the rehabilitation robot (7), acting as a system actuator, is connected to the computer (8) for receiving the control command from the computer (8) to complete the motion control and terminal force output, and sending sensor data to the computer (8) at the same time.
    Type: Application
    Filed: July 15, 2014
    Publication date: July 27, 2017
    Applicant: Institute of Automation Chinese Academy of Science Sciences
    Inventors: Zengguang Hou, Liang Peng, Weiqun Wang, Long Cheng, Guibin Bian, Xiaoliang Xie
  • Publication number: 20170171510
    Abstract: Disclosed are a method and device for leaving a video message, wherein the method includes: acquiring video message information of a calling terminal when a user determines to leave a video message, and sending the video message information and an identifier of a called terminal to the server, such that the server sends the video message information to the called terminal. According to the present disclosure, when a calling request sent by a calling party is not answered within preset time, a video message can be recorded, and is saved to the server, such that a called party can obtain the video message immediately when being online, and can immediately know a call subject according to the video message. Therefore, convenience is brought to both parties of a call, and the time cost is saved.
    Type: Application
    Filed: August 25, 2016
    Publication date: June 15, 2017
    Inventors: Jin ZHU, Xun XU, Liang PENG
  • Patent number: 9658953
    Abstract: A memory access command, column address and plurality of write data values are received within an integrated-circuit memory chip via external signaling links. In response to the memory access command, the integrated-circuit memory chip (i) decodes the column address to select address-specified sense amplifiers from among a plurality of sense amplifiers that constitute a sense amplifier bank, (ii) reads first data, constituted by a plurality of read data values, out of the address-specified sense amplifiers, and (iii) overwrites the first data within the address-specified sense amplifiers with second data constituted by one or more of the write data values and by one or more of the read data values.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: May 23, 2017
    Assignee: Rambus Inc.
    Inventors: Thomas Sheffler, Lawrence Lai, Liang Peng, Bohuslav Rychlik
  • Publication number: 20170014344
    Abstract: A drug carrier and a manufacturing method thereof are provided. The drug carrier includes a hydrophilic group, a hydrophobic group and an organic dye. The hydrophilic group and the hydrophobic group are connected by the organic dye. A plurality of the drug carriers are self-assemblable in a polar solvent to form a nanomicelle. The hydrophilic groups are located at the outer region of the nanomicelle, and the hydrophobic groups are located at the inner region of the nanomicelle.
    Type: Application
    Filed: December 3, 2015
    Publication date: January 19, 2017
    Inventors: Ming-Jium SHIEH, Cheng-Liang Peng, Yuan-I Chen