Patents by Inventor Liang Shih

Liang Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • Publication number: 20240116757
    Abstract: Disclosed herein are systems (e.g., moving bed redox systems) and methods for supplying thermal energy to an endothermic chemical process.
    Type: Application
    Filed: February 8, 2022
    Publication date: April 11, 2024
    Inventors: Liang-Shih FAN, Dikai XU, Dawei WANG, Qiaochu ZHANG, Andrew TONG
  • Publication number: 20240100872
    Abstract: A transfer-printing method of UV-digital stacked-thickness printing, which comprising following steps of: ink jetting a UV-ink on a carrier with low-adhesive-strength to the carrier to output a color-ink-layer with a mirrored-pattern and fully curing the color-ink-layer through UV-light-irradiation; ink jetting on the color-ink-layer to output a transparent-ink-layer with the same mirrored-pattern processed with gray-scale or binary-conversion, the transparent-ink-layer is divided into a plurality of regions, an inkjet-head ink jets back and forth within one region for multiple times and after ink jets the last time, cures the region through UV-light-irradiation with a low-irradiation-intensity, then the inkjet head moves forward to next region and ink jets back and forth within that region for multiple times; and pressing and transferring the transparent-ink-layer on the carrier onto a workpiece.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 28, 2024
    Inventors: Chen-Chien TSAI, Liang SHIH
  • Publication number: 20240084455
    Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.
    Type: Application
    Filed: February 8, 2023
    Publication date: March 14, 2024
    Inventors: Che Wei YANG, Chih Cheng SHIH, Kuo Liang LU, Yu JIANG, Sheng-Chan LI, Kuo-Ming WU, Sheng-Chau CHEN, Chung-Yi YU, Cheng-Yuan TSAI
  • Publication number: 20240079267
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Cheng SHIH, Tze-Liang LEE, Jen-Hung WANG, Yu-Kai LIN, Su-Jen SUNG
  • Publication number: 20240023229
    Abstract: An arrayed RF system includes an expandable mother circuit carrier and sub-modules implemented with RF packaged radiation structures. The sub-modules are embedded onto the mother circuit carrier through plug-in interfaces to form a replaceable and expandable co-structural structure. The mother circuit carrier receives and up-converts an input intermediate-frequency signal, thereby generating first high-frequency signals. The sub-modules are horizontally embedded on the mother circuit carrier, arranged into a one-dimensional or two-dimensional array, and electrically connected to the mother circuit carrier. The RF packaged radiation structures respectively receive first high-frequency signals, thereby emitting first RF signals. The RF packaged radiation structures receive second RF signals, thereby generating second high-frequency signals. The mother circuit carrier down-converts the second high-frequency signals, thereby generating an output intermediate-frequency signal.
    Type: Application
    Filed: September 14, 2022
    Publication date: January 18, 2024
    Inventors: HSI-TSENG CHOU, CHIH-TA YEN, QIAN-XIN AN, WEI-FENG CHEN, CHENG-LIANG SHIH
  • Publication number: 20240022007
    Abstract: An integrated antenna device comprises a curved-surface transmitting array and an array antenna. The curved-surface transmitting army has a plurality of focuses to homogenize its radiation gains. The array antenna is arranged between the curved-surface transmitting array and the plurality of focuses. According to the control of an active RF module of the array antenna, the array antenna emits the first-order beam and performs beam scanning. The curved-surface transmitting array is used to focus the first-order beam to produce a second-order beam with high gain. The generation of the beamforming feed excitation weight of the active RF module makes the integrated antenna device have a beam scanning mechanism. The array antenna can be formed by feeder antennas A DSP dynamic groups the feeder antennas to form subarrays, the subarrays can generate different first-order beams for multi-point communications. The first-order beams can be scanned in an interleaved fashion.
    Type: Application
    Filed: October 13, 2022
    Publication date: January 18, 2024
    Inventors: HSI-TSENG CHOU, CHIH-TA YEN, QIAN-XIN AN, WEI-FENG CHEN, CHENG-LIANG SHIH
  • Patent number: 11826700
    Abstract: Systems and methods use bimetallic alloy particles for converting hydrogen sulfide (H2S) to hydrogen (H2) and sulfur (S), typically during multiple operations. In a first operation, metal alloy composite particles can be converted to a composite metal sulfide. In a second operation, composite metal sulfide from the first operation can be regenerated back to the metal alloy composite particle using an inert gas stream. Pure, or substantially pure, sulfur can also be generated during the second operation.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: November 28, 2023
    Assignee: OHIO STATE INNOVATION FOUNDATION
    Inventors: Liang-Shih Fan, Sourabh G. Nadgouda, Kalyani V. Jangam
  • Publication number: 20230357005
    Abstract: An exemplary reactor system may include a first reactor, a second reactor, a third reactor, and a fourth reactor. The first reactor may be in parallel with the second reactor and the third reactor. The second reactor and third reactor may be in series. The fourth reactor may be configured to receive reduced oxygen carriers from the other reactors, generate oxidized oxygen carriers, and provide the oxidized oxygen carriers back to the other reactors. Carbonaceous feedstock may be used within one or more reactors.
    Type: Application
    Filed: May 4, 2023
    Publication date: November 9, 2023
    Inventors: Liang-Shih Fan, Rushikesh K. Joshi, Eric J. Falascino, Dawei Wang
  • Patent number: 11780031
    Abstract: A method for laser processing a packaging box is provided, which includes feeding a paper material printed with a pattern on the front side thereof to a cutting machine by back feeding using an automatic paper feeder; performing edge finding on the rear side of the paper material, and forming indentations on the rear side of the paper material corresponding to where the pattern is on the front side; conveying the paper material to a laser cutting machine to perform registration marking on the rear side of the paper material before laser cutting; and finally performing laser cutting based on the registration markings to obtain a packaging box with the pattern printed on the front side and the indentations formed on the rear side.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: October 10, 2023
    Assignee: GREAT COMPUTER CORP.
    Inventors: Liang Shih, Heng-Kuan Lin, Chia-Liang Lu
  • Patent number: 11767275
    Abstract: Systems and methods include providing a gaseous alkane input stream and metal sulfide (MSx) particles that can react with an alkane in the gaseous alkane input stream to generate an alkene, a reduced metal sulfide (MSx?1) particle, and at least one of: hydrogen sulfide (H2S) and at least one sulfur containing compound selected from: S2, CS, and CS2. A product stream can be collected that includes the alkene and at least one of: hydrogen sulfide (H2S) and the at least one sulfur containing compound. A reduced metal sulfide (MSx?1) particle reacts with sulfur in a sulfur stream and can generate the metal sulfide (MSx) particle and hydrogen (H2).
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: September 26, 2023
    Assignee: OHIO STATE INNOVATION FOUNDATION
    Inventors: Liang-Shih Fan, Deven Baser, Sourabh Nadgouda, Anuj Joshi, Pinak Mohapatra
  • Publication number: 20230271274
    Abstract: A laser engraving machine having dual quick release mirror holders is provided. The laser engraving machine comprises a machine station, a first mirror holder and a second mirror holder. The machine station has a working platform, a rail and a first laser tube. The first mirror holder is disposed on the rail and receives the laser light emitted from the first laser tube for carrying out a laser processing on the working platform when moves back and forth on the rail. The second mirror holder is composed of a second laser tube assembled on an output module, wherein the output module has a first binding portion and a second binding portion. The first binding portion detachably attaches to the rail for the second mirror holder to move on the rail. The second binding portion detachably attaches to the first mirror holder.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Liang SHIH, Tien-Chuan HUANG
  • Publication number: 20230241679
    Abstract: Reactor configurations may include one or more staged inlets and/or one or more staged outlets for gaseous and solid feedstocks. In one embodiment of the present disclosure, a reactor design for gas-solid reaction with one or more additional outlet for gas and/or solid phase is provided. In yet another embodiment, the design for a gas-solid reactor with one side inlet and two outlets for gas phase is described. In one embodiment, a reactor design with pairs of inlet and outlet for both gas and solid phase is provided. In another embodiment, a reactor design with one or more side inlets but only one outlet for gas phase is provided. In yet another embodiment, a reactor design with two inlets at the top/bottom of reactor and two side outlets for gaseous phase is described. In yet another embodiment, a reactor design with one or more side inlets and outlets for both gas and solid phases is provided.
    Type: Application
    Filed: June 29, 2021
    Publication date: August 3, 2023
    Inventors: Liang-Shih Fan, Andrew Tong, Liang Zeng, Yitao Zhang, Frank Kong, Yu-Yen Chen
  • Patent number: 11710958
    Abstract: A power system includes multiple power units (PUs), each including a circuit breaker (CB), a local controller (LC) and an intelligent electronic device (IED). For any one of the PUs, the IED, when determining that the CB has mechanically failed, outputs a disconnect message via a network to the IED(s) of the remaining PU(s). For each of the remaining PU(s), based on the disconnect message, the IED thereof, when determining that the corresponding CB is a relevant CB, outputs a trip control signal that indicates to trip for receipt by the corresponding LC, so that the LC causes the CB to switch to an open state.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: July 25, 2023
    Assignee: TAIWAN POWER COMPANY
    Inventor: Chi-Liang Shih
  • Publication number: 20230113165
    Abstract: Exemplary chemical looping systems include at least one type of active solid particles and inert solid particles that may be provided between various reactors in exemplary systems. Certain chemical looping systems may include a reducer reactor in fluid communication with a combustor reactor. Some chemical looping systems may additionally include an oxidizer reactor in fluid communication with the combustor reactor and the reducer reactor. Generally, active solid particles are capable of cycling between a reduction reaction and an oxidation reaction. Generally, inert solid particles are not reactants in either the reduction reaction or the oxidation reaction.
    Type: Application
    Filed: September 10, 2020
    Publication date: April 13, 2023
    Inventors: Liang-Shih Fan, Fanhe Kong, Vedant Shah
  • Publication number: 20230081569
    Abstract: Systems and methods use bimetallic alloy particles for converting hydrogen sulfide (H2S) to hydrogen (H2) and sulfur (S), typically during multiple operations. In a first operation, metal alloy composite particles can be converted to a composite metal sulfide. In a second operation, composite metal sulfide from the first operation can be regenerated back to the metal alloy composite particle using an inert gas stream. Pure, or substantially pure, sulfur can also be generated during the second operation.
    Type: Application
    Filed: August 3, 2022
    Publication date: March 16, 2023
    Inventors: Liang-Shih Fan, Sourabh G. Nadgouda, Kalyani V. Jangam
  • Publication number: 20230082767
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 16, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • Publication number: 20230009840
    Abstract: Systems and methods include providing a gaseous alkane input stream and metal sulfide (MSx) particles that can react with an alkane in the gaseous alkane input stream to generate an alkene, a reduced metal sulfide (MSx-1) particle, and at least one of: hydrogen sulfide (H2S) and at least one sulfur containing compound selected from: S2, CS, and CS2. A product stream can be collected that includes the alkene and at least one of: hydrogen sulfide (H2S) and the at least one sulfur containing compound. A reduced metal sulfide (MSx-1) particle reacts with sulfur in a sulfur stream and can generate the metal sulfide (MSx) particle and hydrogen (H2).
    Type: Application
    Filed: September 26, 2022
    Publication date: January 12, 2023
    Inventors: Liang-Shih Fan, Deven Baser, Sourabh Nadgouda, Anuj Joshi, Pinak Mohapatra
  • Patent number: 11532568
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: December 20, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • Publication number: 20220331736
    Abstract: Exemplary reactor systems may include multiple reactors in fluid communication. Oxygen carrier particles comprising a support material and metal oxide can be provided to a first reactor along with flue gas comprising carbon dioxide (CO2). An output of the first reactor is free or substantially free of carbon dioxide (CO2). The oxygen carrier particles can then be provided to one or more reactors in the system along with a hydrocarbon stream and, in some instances, an oxidizing stream. Outlets from these one or more reactors may include hydrogen gas (H2), carbon monoxide (CO), and/or other species, depending upon the content of the hydrocarbon streams and the oxidizing streams.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 20, 2022
    Inventors: Liang-Shih Fan, Deven Baser, Vedant Shah, Zhuo Cheng