Abstract: An array substrate and a manufacturing method thereof, and display panel are disclosed. The array substrate includes a substrate, a thin film transistor disposed on the substrate and a common electrode disposed on a side of the thin film transistor away from the substrate. The common electrode includes a first hollowed-out portion. An active layer of the thin film transistor includes a source electrode region, a drain electrode region and a channel region. An orthographic projection of the first hollowed-out portion on the substrate at least covers an orthographic projection of the channel region on the substrate.

Abstract: An OLED substrate and a packaging method and a display apparatus thereof are provided. The method for packaging the OLED substrate includes: forming a functional layer having a slit on a substrate where a pixel defining layer and an OLED device are formed, the slit corresponding to a pattern location of the pixel defining layer; etching the pixel defining layer by using the functional layer as a mask to obtain the pixel defining layer having a groove; and forming a packaging thin film on the pixel defining layer having the groove and the functional layer to obtain a thin-film packaging layer sinking into the groove.

Abstract: The present disclosure provides an OLED panel comprising: a first substrate; an OLED device on the first substrate; an optical detecting device configured to detect a luminance of the OLED device; and a processor configured to generate a control signal according to brightness information of the OLED device detected by the optical detecting device so as to adjust brightness of the OLED device.

Abstract: A reflective light modulation device, a projector and an AR/VR display are provided. The reflective light modulation device includes a light source, a polarization beam splitting layer which transmits and reflects light of the light source to form two beams of linearly polarized light perpendicular to each other, a first modulation reflective layer disposed in a propagation direction of a beam of linearly polarized light transmitted by the polarization beam splitting layer, and a second modulation reflective layer disposed in a propagation direction of another beam of the linearly polarized light reflected by the polarization beam splitting layer, wherein the first modulation reflective layer and the second modulation reflective layer perform a modulation synchronously.

Abstract: An anti-reflection structure, a display device and a fabrication method for the anti-reflection structure are provided. The anti-reflection structure comprises a substrate, a first microstructure and a second microstructure. The first microstructure comprises a plurality of first microstructure units periodically arranged on the substrate, a second microstructure is filled between the first microstructures so as to cover the substrate, and the anti-reflection structure has a flat surface. The refractive indices of the first microstructure and the second microstructure are different and are configured such that overall, the reflectivity of the anti-reflection structure to light of a predetermined wavelength is lower than the reflectivity of the substrate to light of the predetermined wavelength.

Abstract: This disclosure relates to a field-effect transistor and a production method thereof, an array substrate and a production method thereof, and a display panel. The production method comprises: forming an active layer on a substrate; forming a gate electrode insulating layer on the active layer to define a gate electrode area as well as a source electrode area and a drain electrode area located on two sides of the gate electrode area on the active layer; applying a gate electrode layer to cover surfaces of the active layer and the gate electrode insulating layer; patterning the gate electrode layer to form a first contact electrode, a second contact electrode, and a gate electrode, wherein the first contact electrode is located on the source electrode area, the second contact electrode is located on the drain electrode area, and the gate electrode is located on the gate electrode insulating layer.

Abstract: A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a re-distribution layer on the wafer for each of the chips; forming each individual chip and the re-distribution layer connected to the chip by cutting; fixing the chip and the re-distribution layer connected thereto to a second panel level substrate; and encapsulating the chip to form an encapsulating layer. A chip encapsulating structure is prepared by the above described chip encapsulating method.

Abstract: The present disclosure provides a storage element, a storage device, a method for manufacturing the same and a driving method. The method for manufacturing the storage element includes: providing a substrate; preparing a thin film transistor on the substrate; and preparing a storage functional pattern by using a phase change material, in which the storage functional pattern is connected to a drain electrode of the thin film transistor.

Abstract: The present disclosure provides a pixel unit, a display panel, and a display device, which relates to the field of display technology. The pixel unit includes: a base substrate; a reflective layer, disposed on a side of the base substrate; a resonant layer, disposed on a side of the reflective layer away from the base substrate; a transflective layer, disposed on a side of the resonant layer away from the base substrate; and a scattering layer, disposed on a side of the transflective layer away from the base substrate.

Abstract: The present disclosure discloses a pixel structure, including a reflective layer, a reflective electrode, a flexible electrode and a bottom electrode sequentially disposed along a direction of incident light. An optical resonant cavity is formed between the reflective layer and the reflective electrode, the reflective layer and the flexible electrode are connected to each other; and a first voltage is loaded between the reflective electrode and the flexible electrode, and a second voltage is loaded between the flexible electrode and the bottom electrode; depending on at least one of changes of the first voltage and the second voltage, the flexible electrode deforms along the direction of incident light, and drives the reflective layer to move along the direction of incident light. The present disclosure also discloses a display substrate and a control method thereof and a display device.

Abstract: A display panel, a display device and a display method are provided. The display panel includes a base substrate, a pixel array and a light conversion layer. The pixel array is arranged on the base substrate and includes a plurality of pixel units, and the light conversion layer is arranged on a display side of the pixel array. Each of the plurality of pixel units includes an optical resonant structure, and the optical resonant structure includes a first reflection layer, a second reflection layer and a dielectric layer. The first reflection layer is arranged on the base substrate, the second reflection layer is arranged on the first reflection layer and is parallel to the first reflection layer, and the dielectric layer is arranged between the first reflection layer and the second reflection layer.

Abstract: The present disclosure provides a touch panel, a manufacturing method thereof and a touch display device. In one embodiment, the method comprises the following steps: 1) forming touch lines, comprising: forming in the same layer gate lines and a plurality of first touch lines, each first touch line being arranged intermittently in a direction of data lines and not electrically connected with the gate lines, and forming in the same layer a plurality of first connection lines and electrodes which are not in the same layer as the gate lines and the touch electrodes, each first connection line being used for connecting in series with an intermittent first touch line, each touch line comprising a first touch line and a plurality of first connection lines; and 2) forming touch electrodes, each touch electrode being electrically connected with one or more first touch lines, one or more is second touch lines, or one or more third touch lines.

Abstract: A display substrate and a manufacturing method thereof, as well as a display device are provided. The display substrate includes a base substrate, a color filter layer, a touch electrode layer and a bridging layer. The touch electrode layer includes first and second touch electrodes intercrossing and insulated from each other, the first touch electrode includes a plurality of first touch sub-electrodes arranged in an extension direction of the first touch electrode. The plurality of first touch sub-electrodes are electrically connected with one another by a bridging line in the bridging layer. Vias for electrically conducting the first touch sub-electrodes and the bridging line are provided in the color filter layer. Since the color filter layer serves as an insulating layer between the touch electrode layer and the bridging layer, it is possible to omit the step of providing individual insulating layer, thereby reducing the number of masks.

Abstract: Disclosed are an exposure device and an exposure method thereof. The exposure device includes a stage for placing thereon a substrate to be exposed, a mask arranged above the stage and comprising periodical patterns, an exposure light source arranged above the stage and configured to transmit light at a preset wavelength, and a transparent body configured to move horizontally in a preset direction in an exposure area between the mask and the stage while the exposure light source is exposing in operation. The transparent body is so structured that there is a change in light journey of greater than 2p2/? at each exposure position in the exposure area while an exposure light source is exposing in operation, where p represents a space between periodical patterns in the mask, and ? represents a preset wavelength of light emitted by the exposure light source.

Abstract: The present disclosure relates to a manufacturing method for a metal grating, a metal grating, and a display device. In this manufacturing method, after forming a plurality of parallel grating strips by means of an adhesive film layer, a metal thin film with a uniform thickness is formed over the plurality of grating strips and gaps between the grating strips. Furthermore, a metal grating is formed by performing topping treatments on both of an upper surface and a lower surface of the resulting structure.

Abstract: The present disclosure proposes a manufacturing method for a metal grating, a metal grating, and a display device. The manufacturing method comprises: forming a metal layer, an antireflective layer and a deep UV photoresist layer sequentially on a base substrate; etching the deep UV photoresist layer by a photolithography process, so as to form a grating mask pattern; etching the antireflective layer by a dry etching process with the help of the grating mask pattern, so as to form an etch mask pattern identical to the grating mask pattern; peeling off the grating mask pattern; etching the metal layer by a dry etching process with the help of the etch mask pattern, so as to form metal grating strips; and removing the etch mask pattern, thus forming a metal grating.

Abstract: The present disclosure relates to a manufacturing method for a light adjusting structure, a light adjusting structure, a backlight module and a display device. The manufacturing method includes: providing a light guide plate; forming a substrate having a plurality of micro structures; and placing the micro structures upside down on a light exit surface of the light guide plate; heating the light guide plate; adhering the tips of the micro structures to the light guide plate; cooling the light guide plate; and forming a first reflective layer on the side surface of each micro structure.

Abstract: The present disclosure provides an array substrate, an in-cell touch panel and a display device. The array substrate includes a display region and a non-display region. Gate lines, data lines, thin-film transistors and pixel electrodes are arranged at the display region, and each thin-film transistor includes a gate electrode, a gate insulation layer, an active layer, a source electrode and a drain electrode. First signal lines and second signal lines are arranged at the non-display region, and the first signal lines are located at a layer different from the second signal lines and intersect with the second signal lines. The first signal lines are arranged at a layer and made of a material identical to the gate lines. The gate insulation layer and at least one thickening layer are provided between the first signal lines and the second signal lines at overlapping regions of the first signal lines and the second signal lines.

Abstract: A display substrate, a manufacture method thereof and a display panel are provided. The display substrate includes: a first substrate; a plurality of pixel units included in the first substrate, each of the pixel units at least including a first sub-pixel unit, a second sub-pixel unit and a third sub-pixel unit; a medium film laminated layer arranged on the first substrate, the medium film laminated layer at least covering the first sub-pixel unit and the second sub-pixel unit; the medium film laminated layer is configured to eliminate blue light in a first wavelength range passing the medium film laminated layer, the medium film laminated layer includes at least one first medium film layer and at least one second medium film layer which are laminated alternately, and a refractive index of the first medium film layer is greater than a refractive index of the second medium film layer.

Abstract: A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a re-distribution layer on the wafer for each of the chips; forming each individual chip and the re-distribution layer connected to the chip by cutting; fixing the chip and the re-distribution layer connected thereto to a second panel level substrate; and encapsulating the chip to form an encapsulating layer. A chip encapsulating structure is prepared by the above described chip encapsulating method.