Patents by Inventor Lily Zhao

Lily Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250127817
    Abstract: An application of Bone Marrow Mesenchyml Stem Cell Exosomes (BMSC-Exos) in treating Parkinson's disease (PD) is provided, wherein the BMSC-Exos are generated by stimulating BMSCs with a culture solution and extracted from the culture solution after passage; and the culture solution of the BMSCs is an ?-MEM culture solution containing FBS and PS. The BMSC-Exos can greatly improve a motor function of a model mouse with PD, protect dopaminergic neurons of the model mouse with PD, improve an olfactory function of the model mouse with PD, and also inhibit the activation of olfactory astrocytes of the model mouse with PD.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 24, 2025
    Applicant: NANTONG UNIVERSITY
    Inventors: Xiaosong GU, Cheng SUN, Fei DING, Leilei GONG, Meng CONG, Xiaomin WANG, Hualin SUN, Yu ZHANG, Lili ZHAO, Tianmei QIAN
  • Publication number: 20250127760
    Abstract: A composition and a use of the composition in the preparation of a medicament for treating eye diseases. The composition includes 0.5-1.5% by weight of a muscarinic acetylcholine receptor M3 agonist; 0.005-0.5% by weight of naphazoline, a pharmaceutically acceptable salt thereof or a combination thereof; and 0.1-1% by weight of ketorolac tromethamine. While enhancing the effect of a muscarinic acetylcholine receptor M3 agonist such as a pilocarpine active ingredient in treating presbyopia, the composition effectively significantly reduces or even eliminates side effects caused by the pilocarpine active ingredient.
    Type: Application
    Filed: December 27, 2022
    Publication date: April 24, 2025
    Inventors: Jidong LIU, Qiang YANG, Dan LI, Yang JIN, Lili ZHAO
  • Patent number: 12282187
    Abstract: A building control device includes a printed circuit board (PCB) assembly with a controller. A lighting assembly is operatively coupled to the PCB and is controlled by the controller. The lighting assembly includes a light guide that extends around a periphery of an interposing region. The light guide having a front face and one or more light sources optically coupled to the light guide such that light provided by the one or more light sources enters the light guide and is distributed to the front face of the light guide to provide a diffuse light output. A cover forms at least part of a front face of the building control device and includes a transparent region in registration with at least part of the front face of the light guide.
    Type: Grant
    Filed: September 13, 2023
    Date of Patent: April 22, 2025
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Chao Chen, Rick Han, Tonya Tang, Zhi Yi Sun, Qixiang Hu, Helen Yan, Kaixuan Qin, Lily Zhao, Harvey Ma
  • Patent number: 12251435
    Abstract: The present disclosure provides an engineered Hansenula fungus that efficiently expresses CA10 (Coxsackievirus A10) virus-like particles and uses thereof. The engineered fungus includes a recombinant vector carrying the P1 and 3CD genes of the CA10 virus optimized according to preferred codons of Hansenula. The present disclosure also provides a preparation method for CA10 virus-like particles and vaccines prepared therefrom.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: March 18, 2025
    Assignee: Beijing Minhai Biotechnology Co., Ltd.
    Inventors: Guoshun Li, Meirong Gu, Lin Guo, Wei Jian, Junjie Liu, Haifeng Xiao, Gaimei Zhang, Lili Zhao, Xuechao Xie, Lei Chen, Yingzhi Xu, Jiankai Liu
  • Publication number: 20250055297
    Abstract: This application provides an electronic device, including a battery, at least one charging interface, a PD controller, a battery charging controller, a first reverse charging link, at least one second reverse charging link, and a controller. The first reverse charging link is coupled to the battery charging controller. The battery charging controller includes a forward charging state and a reverse charging state. The charging interface is coupled to the battery through the first reverse charging link, and is further coupled to a power output end of the PD controller through the second reverse charging link. The PD controller is configured to obtain connection information of the charging interface. The connection information indicates a connection status of the charging interface and indicates a device type of an external device and/or the electronic device.
    Type: Application
    Filed: May 6, 2023
    Publication date: February 13, 2025
    Inventors: Tingwei Zhang, Feng Wang, Zhongming Li, Lilie Zhao
  • Publication number: 20240421119
    Abstract: Flexible under-bump metallization sizes and patterning, and related integrated circuit packages and fabrication methods are disclosed. First under-bump metallizations (UBMs) of a first, larger size and pitch are provided in the die and coupled to corresponding metal interconnects in the package substrate. One or more second UBMs of a second, reduced size UBMs can also be located in the core area of the die. This provides greater flexibility in the design and layout of the die, because different circuits within the die (e.g., I/O related circuits) may only require coupling to smaller size UBMs for performance requirements and thus can be more flexibility located in the die. Also, to further reduce pitch of the second, smaller size UBMs, one or more of the second, smaller size UBMs can be formed as oblong-shaped UBMs, which can still maintain a minimum separation based on metal interconnect pitch limitations in the package substrate.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 19, 2024
    Inventors: Yangyang Sun, Yue Li, Lily Zhao, Piyush Gupta, Xuefeng Zhang
  • Publication number: 20240421128
    Abstract: Disclosed is a semiconductor device. In an aspect, a semiconductor device includes: a first-tier passive device including a substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and one or more second-tier passive devices disposed over the first-tier passive device. Each one of the one or more second-tier passive devices includes: a substrate portion, a passive device portion, and a metallization portion disposed in a stacked configuration; and a set of through substrate vias (TSVs) passing through a corresponding substrate portion and electrically coupled to a corresponding metallization portion. The semiconductor device comprises a passive component including the passive device portion of the first-tier passive device electrically coupled to one or more passive device portions of the one or more second-tier passive devices through the metallization portions of the first-tier passive device and the one or more second-tier passive devices.
    Type: Application
    Filed: June 15, 2023
    Publication date: December 19, 2024
    Inventors: Yangyang SUN, Yi-Hang LIN, Dongming HE, Lily ZHAO, Ryan LANE
  • Publication number: 20240371806
    Abstract: Disclosed are techniques for integrated circuit device. In an aspect, an integrated circuit device includes a metallization structure that includes a top metal layer structure; a passivation layer on the metallization structure; a bump structure disposed on the first bump line structure; and a first polymer protection layer. The passivation layer may include one or more first openings. The first bump line structure may include one or more first extended portions respectively extending toward the top metal layer structure through the one or more first openings. The bump structure may be electrically coupled to the first bump line structure. The first polymer protection layer may be on the passivation layer, on a portion of the first bump line structure, and in contact with a side surface of the first bump line structure.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 7, 2024
    Inventors: Dongming HE, Jun CHEN, Yangyang SUN, Lily ZHAO, Ahmer SYED
  • Publication number: 20240372404
    Abstract: This application provides a wireless charging circuit and a device. The wireless charging circuit includes a power supply module, an inverter module, and a first coil component; the first coil component includes at least one coil; the power supply module is connected to the inverter module, and the inverter module is connected to the first coil component; the power supply module is configured to: output a direct current signal to the inverter module; and the inverter module is configured to: convert the direct current signal into an alternating current signal at a target resonant frequency, and output the alternating current signal to the first coil component, where the target resonant frequency is at an MHz level. In this application, a stylus can obtain electric energy from a power supply device without being clung to the power supply device.
    Type: Application
    Filed: August 26, 2022
    Publication date: November 7, 2024
    Inventors: Yuan WU, Wei ZHANG, Feng WANG, Chao WANG, Lilie ZHAO, Youjun ZHANG
  • Publication number: 20240371736
    Abstract: Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods are also disclosed. The cavity of the core (that has one or more core layers) of the substrate includes an embedded electrical device structure that an electrical device built upon another second component(s) to make the overall height of the electrical device structure compatible with the height of the cavity of the core. In this manner, the design criteria used to select thickness or height of the core for providing the desired stability in the substrate can be incompatible with the thickness or the height of the embedded electrical device.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 7, 2024
    Inventors: Omar James Bchir, Dongming He, Ryan Lane, Kuiwon Kang, Lily Zhao
  • Patent number: 12130970
    Abstract: This application discloses a wireless keyboard. The wireless keyboard includes a connection portion. The connection portion includes an accommodating cavity with an opening at an end and used for accommodating an electronic stylus. A wireless charging coil is arranged in the accommodating cavity. A charging interface and a wireless charging control module are arranged in the wireless keyboard. The wireless charging control module is connected to the charging interface and the wireless charging coil. The charging interface can receive a direct current signal. The wireless charging control module can convert, if it is detected that a direct current signal is inputted to the charging interface, the direct current signal into an alternating current signal and transmit the alternating current signal to the wireless charging coil. The wireless charging coil generates an alternating electromagnetic field in response to the alternating current signal, to wirelessly charge the electronic stylus.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: October 29, 2024
    Assignee: HONOR DEVICE CO., LTD.
    Inventors: Yuan Wu, Wei Zhang, Feng Wang, Chao Wang, Lilie Zhao, Wei Tong
  • Publication number: 20240355781
    Abstract: A device includes an integrated device. The integrated device includes a die that is at least partially encapsulated. The die includes a conductive pad. The device also includes a first passivation layer coupled to a first surface of the die. The device includes an offset interconnect extending along a surface of the first passivation layer and including a portion that extends through an opening in the first passivation layer to contact the conductive pad. The device includes a bump including a portion that extends through an opening in a second passivation layer to contact the offset interconnect. The bump is offset, in a direction along a surface of the second passive layer, from the conductive pad.
    Type: Application
    Filed: April 5, 2024
    Publication date: October 24, 2024
    Inventors: Yangyang SUN, Xuefeng ZHANG, Jun CHEN, Lily ZHAO
  • Patent number: 12113038
    Abstract: A thermal compression flip chip (TCFC) bump may be used for high performance products that benefit from a fine pitch. In one example, a new TCFC bump structure adds a metal pad underneath the TCFC copper pillar bump to cover the exposed aluminum bump pad. This new structure prevents the pad from corroding and reduces mechanical stress to the pad and underlying silicon dielectric layers enabling better quality and reliability and further bump size reduction. For example, a flip chip connection may include a substrate; a metal pad on a contact side of the substrate and a first passivation layer on the contact side of the substrate to protect the metal pad from corrosion.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 8, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Dongming He, Hung-Yuan Hsu, Yangyang Sun, Wei Hu, Wei Wang, Lily Zhao
  • Patent number: 12109746
    Abstract: A method for manufacturing an impeller with a number of impeller blades and a cover disc covering the impeller blades. Plastic is injected into an injection mold using a cascade injection molding process to form the impeller. The injection mold has a number of shut-off nozzles to feed the plastic at various joint positions and different opening times. The number of shut-off nozzles is determined as a function of the number of impeller blades.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: October 8, 2024
    Assignee: ebm-papst Mulfingen GmbH & Co. KG
    Inventors: Erhard Gruber, Martin Kleinschrodt, Lili Zhao
  • Publication number: 20240301063
    Abstract: The invention provided herein relates to methods and uses of a bispecific antibody, which specifically binds the surface antigen CD3 of immune cells and the BCMA antigen on the surface of tumor cells and which may bind to human CD3 with high affinity, induce T cell proliferation, and mediate tumor cell killing effects. The bispecific antibody may be used to mediate the T cell-specific killing of target cells in in vitro tests.
    Type: Application
    Filed: May 22, 2024
    Publication date: September 12, 2024
    Inventors: Qiang Li, Shixiang Jia, Lili Zhao, Guimin Zhang, Zhong Liu, Xinlu Ma, Yuan Yan, Zhenyu Li, Xingxia Hu, Yuhua Zhang, Bin Li
  • Patent number: 12085268
    Abstract: A heat sink, a separator, and a lighting device applying the same are provided. The heat sink comprises: a housing, formed around an axis, wherein the housing has a first open end and a second open end along the axis, and a holding cavity connecting the two open ends. The housing comprises a first portion and a second portion, both formed around the axis, wherein the first portion comprises several device mounting portions distributed around the axis. The second portion comprises an outer fin set disposed around the axis in an outer peripheral region, and an inner fin set disposed around the axis in an inner peripheral region; the first portion is closer to the first open end than the second portion is to the first open end, and the outer fin set extends toward the second open end; each fin extends toward the axis.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: September 10, 2024
    Assignees: Shanghai Sansi Electronic Engineering Co. Ltd., Shanghai Sansi Technology Co. Ltd., Jiashan Sansi Optoelectronic Technology Co. Ltd., Pujiang Sansi Optoelectronic Technology Co. Ltd.
    Inventors: Bishou Chen, Ming Chen, Shan Li, Qi Li, Lili Zhao
  • Publication number: 20240264360
    Abstract: A building control device includes a printed circuit board (PCB) assembly with a controller. A lighting assembly is operatively coupled to the PCB and is controlled by the controller. The lighting assembly includes a light guide that extends around a periphery of an interposing region. The light guide having a front face and one or more light sources optically coupled to the light guide such that light provided by the one or more light sources enters the light guide and is distributed to the front face of the light guide to provide a diffuse light output. A cover forms at least part of a front face of the building control device and includes a transparent region in registration with at least part of the front face of the light guide.
    Type: Application
    Filed: September 13, 2023
    Publication date: August 8, 2024
    Inventors: Chao Chen, Rick Han, Tonya Tang, Zhi Yi Sun, Qixiang Hu, Helen Yan, Kaixuan Qin, Lily Zhao, Harvey Ma
  • Publication number: 20240264394
    Abstract: A building control device includes a printed circuit board including control circuitry for controlling at least part of the building control device. An LCD display is operatively coupled to the printed circuit board and is controlled at least in part by the control circuitry of the printed circuit board. A plurality of LEDs are operatively coupled to the printed circuit board and are controlled at least in part by the control circuitry of the printed circuit board. An opaque plate defines an at least translucent arc-shaped region that extends around at least part of the LCD display. A light guide is situated behind the opaque plate and is configured to be illuminated by the plurality of LEDs such that light from the light guide is visible through the at least translucent arc-shaped region of the opaque plate.
    Type: Application
    Filed: September 13, 2023
    Publication date: August 8, 2024
    Inventors: Chao Chen, Tonya Tang, Rick Han, Lily Zhao, Qixiang Hu, Harvey Ma, Helen Yan
  • Patent number: 12030939
    Abstract: The invention provided herein relates to methods and uses of a bispecific antibody, which specifically binds the surface antigen CD3 of immune cells and the BCMA antigen on the surface of tumor cells and which may bind to human CD3 with high affinity, induce T cell proliferation, and mediate tumor cell killing effects. The bispecific antibody may be used to mediate the T cell-specific killing of target cells in in vitro tests.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 9, 2024
    Assignee: Shandong New Time Pharmaceutical Co., Ltd.
    Inventors: Qiang Li, Shixiang Jia, Lili Zhao, Guimin Zhang, Zhong Liu, Xinlu Ma, Yuan Yan, Zhenyu Li, Xingxia Hu, Yuhua Zhang, Bin Li
  • Publication number: 20240186825
    Abstract: This application provides a wireless charging system. The wireless charging system has the function of wirelessly charging an electronic stylus while receiving the electronic stylus. The wireless charging system includes a tablet computer, a wireless keyboard, and an electronic stylus. The wireless keyboard includes a keyboard body, a bracket for placing the tablet computer, and a connecting portion for movably connecting the keyboard body and the bracket. The tablet computer is provided with a first wireless charging sending device. The wireless keyboard is provided with a first wireless charging receiving device. The first wireless charging receiving device receives an electromagnetic signal sent by the first wireless charging sending device. The connecting portion includes a receiving cavity provided with an opening at an end and a second wireless charging sending device. The second wireless charging sending device is configured to wirelessly charge the electronic stylus received in the receiving cavity.
    Type: Application
    Filed: February 10, 2022
    Publication date: June 6, 2024
    Inventors: Yuan WU, Wei ZHANG, Feng WANG, Chao WANG, Lilie ZHAO, Youjun ZHANG