Abstract: Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.

Abstract: A Ni—Al2O3@Al2O3—SiO2 catalyst with coated structure is provided. The catalyst has a specific surface area of 98 m2/g to 245 m2/g, and a pore volume of 0.25 cm3/g to 1.1 cm3/g. A mass ratio of an Al2O3 carrier to active component Ni in the catalyst is Al2O3:Ni=100:4˜26, a mass ratio of the Al2O3 carrier to an Al2O3—SiO2 coating layer is Al2O3:Al2O3—SiO2=100:0.1˜3, and a molar ratio of Al to Si in the Al2O3—SiO2 coating layer is 0.01 to 1. Ni particles are distributed on a surface of the Al2O3 carrier in an amorphous or highly dispersed state and have a grain size less than or equal to 8 nm, and the coating layer is filled among the Ni particles.

Abstract: A package that includes a substrate comprising a cavity, a first integrated device coupled to the substrate through a first plurality of pillar interconnects and a first plurality of solder interconnects, a second integrated device coupled to the substrate through a second plurality of pillar interconnects and a second plurality of solder interconnects, and a plurality of wire bonds coupled to the first integrated device and the second integrated device, wherein the plurality of wire bonds is located over the cavity of the substrate.

Abstract: Disclosed are examples of integrated circuit (IC) structures and techniques to fabricate IC structures. Each IC package may include a die (e.g., a flip-chip (FC) die) and one or more die interconnects to electrically couple the die to a substrate. The die interconnect may include a pillar, a wetting barrier on the pillar, and a solder cap on the wetting barrier. The wetting barrier may be wider than the pillar such that during solder reflow, solder wetting of sidewall of the pillar is minimized or prevented all together. The die interconnect may also include a low wetting layer formed on the wetting barrier, which can further mitigate solder wetting problems.

Abstract: The present invention provides a Hansenula engineering fungus that efficiently expresses CA10 virus-like particles and use thereof. The engineering fungus comprises a recombinant vector carrying P1 and 3CD genes of the CA10 virus, and the starting strain of the engineering fungus is uracil auxotroph. The Hansenula AU-0501, P1 and 3CD genes are optimized according to preferred codons of Hansenula. The present invention also provides a preparation method of CA10 virus-like particles, comprising: culturing engineering fungi, expressing CA10 virus-like particles, and separating and purifying virus-like particles by ultrafiltration and three-step chromatography.

Abstract: A method for manufacturing an impeller with a number of impeller blades and a cover disc covering the impeller blades. Plastic is injected into an injection mold using a cascade injection molding process to form the impeller. The injection mold has a number of shut-off nozzles to feed the plastic at various joint positions and different opening times. The number of shut-off nozzles is determined as a function of the number of impeller blades.

Abstract: The present invention provides a multi-targeting fusion protein that blocks the growth of vascular endothelial cells and activates T cells, which comprises (i) a vascular endothelial cell growth inhibitory domain; (ii) an immunoglobulin Fc domain; and (iii) CD80 extracellular domain (ECD). The present invention also provides a polynucleotide encoding the multi-targeting fusion protein, a vector containing the polynucleotide, a host cell comprising the polynucleotide or the vector, and pharmaceutical composition comprising the multi-targeting fusion protein and an anti-PD-1 antibody. The multi-targeting fusion protein and pharmaceutical composition of the present invention can treat or prevent cancerous diseases in individuals.

Abstract: Disclosed is a graphene electrochemical transfer method assisted by multiple supporting films, comprising: (1) growing graphene on a substrate, and then spin-coating a thin layer of photoresist on a surface of the graphene as a first film; (2) spin-coating n layers of thick, tough, and selectively dissolvable polymer films on the surface of the first film as an top film; (3) dissociating the multi-layer composite film and the graphene from the surface of the substrate by an electrochemical process, and dissolving the thick polymer films which is the top film with a first solvent; (4) after cleaning, transferring the thin first film and the graphene to a target substrate, and finally dissolving the thin first film away with a second solvent to complete the transfer process. This transfer process is fast, stable, and capable of transferring a large-size graphene, which may promote the large-scale application of graphene.

Abstract: Provided is a tetravalent, homodimer-type bispecific antibody molecule that targets both immune effector cell antigen CD3 and tumor-related antigen CD19. The bispecific antibody molecule comprises first and second single-chain Fv and Fc fragments in sequence from the N-terminus to the C-terminus, wherein the first single-chain Fv can specifically bind to CD19, the second single-chain Fv can specifically bind to CD3, the first and second single-chains Fv are connected by means of a linker peptide, the second single-chain Fv and Fc fragments are directly connected to each other or connected by means of a linker peptide; and the Fc fragment does not have effector functions such as CDC, ADCC, and ADCP.

Abstract: Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: Cationic polymers are provided for delivering anionic active agents, preferably in the form or nanoparticles and other nanostructures. The polymer can be a polycation homopolymer or a copolymer containing a polycation block. The polycations and polycation containing polymers can contain dicarboxylic acid ester units and units of (?-amino acid)-?,?-alkylene diester units. The nanoparticles can contain high loadings of anionic active agents, with sustained release of the active agents. Methods of making the polycations and polycation containing polymers are provided. Methods of making the nanoparticles and formulating them for administration to an individual in need thereof are also provided.

Abstract: A thermal compression flip chip (TCFC) bump may be used for high performance products that benefit from a fine pitch. In one example, a new TCFC bump structure adds a metal pad underneath the TCFC copper pillar bump to cover the exposed aluminum bump pad. This new structure prevents the pad from corroding and reduces mechanical stress to the pad and underlying silicon dielectric layers enabling better quality and reliability and further bump size reduction. For example, a flip chip connection may include a substrate; a metal pad on a contact side of the substrate and a first passivation layer on the contact side of the substrate to protect the metal pad from corrosion.

Abstract: A method and device for processing promotion information and a system are provided. The method includes that: agreement information and exposure requirements of all promotion information within a preset period are acquired (101); directional delivered targets are determined according to the agreement information and the exposure requirements, and the directional delivered targets are split into multiple non-intersected delivered target sets (102); the promotion information is delivered to users corresponding to the corresponding delivered target sets according to the exposure requirements (103); statistics about social propagation amounts of to the delivered promotion information is made in real time in a delivery process (104); and exposure parameters are corrected according to the social propagation amounts (105), so that delivery of the promotion information is regulated in real time. By the method, the effectiveness and accuracy of delivering the promotion information may be improved.

Abstract: Disclosed is a graphene electrochemical transfer method assisted by multiple supporting films, comprising: (1) growing graphene on a substrate, and then spin-coating a thin layer of photoresist on a surface of the graphene as a first film; (2) spin-coating n layers of thick, tough, and selectively dissolvable polymer films on the surface of the first film as an top film; (3) dissociating the multi-layer composite film and the graphene from the surface of the substrate by an electrochemical process, and dissolving the thick polymer films which is the top film with a first solvent; (4) after cleaning, transferring the thin first film and the graphene to a target substrate, and finally dissolving the thin first film away with a second solvent to complete the transfer process. This transfer process is fast, stable, and capable of transferring a large-size graphene, which may promote the large-scale application of graphene.

Abstract: A system for detecting a motion event based on images. The system acquires a first image and a comparison image, and generates a first edge image and a comparison edge image based on the first image and the comparison image. The system also determines the difference between the first edge image and the comparison edge image. The system indicates a motion event if the difference between the first edge image and the comparison edge image meets or exceeds a threshold.

Abstract: A moving object detection method and apparatus are disclosed. The method may include: obtaining a first image and a second image of a scene; determining a difference of the first image and the second image; performing a binarization operation on the difference of the first image and the second image, to generate a binary image; determining the number of pixels whose values are nonzero in each column of the binary image, to generate a column pixel histogram; and determining whether a moving object is present in the scene based on the column pixel histogram.

Abstract: A system for detecting a motion event based on images. The system acquires a first image and a comparison image, and generates a first edge image and a comparison edge image based on the first image and the comparison image. The system also determines the difference between the first edge image and the comparison edge image. The system indicates a motion event if the difference between the first edge image and the comparison edge image meets or exceeds a threshold.

Abstract: Cationic polymers are provided for delivering anionic active agents, preferably in the form or nanoparticles and other nanostructures. The polymer can be a polycation homopolymer or a copolymer containing a polycation block. The polycations and polycation containing polymers can contain dicarboxylic acid ester units and units of (?-amino acid)-?,?-alkylene diester units. The nanoparticles can contain high loadings of anionic active agents, with sustained release of the active agents. Methods of making the polycations and polycation containing polymers are provided. Methods of making the nanoparticles and formulating them for administration to an individual in need thereof are also provided.

Abstract: Disclosed are systems and devices for facilitating audiovisual communication. According to embodiments, there may be provided a communication device including or otherwise functionally associated with a video camera to acquire visual information from a scene and to convert the visual information into a video stream. A video processing circuit may (a) receive the video stream, (b) extract user related features from the video stream; and (c) detect and characterize one or more user actions. A controller to receive the video processing circuit output and responsive to an indication of one or more detected events within the video stream to trigger a communication session between said communication device and an addressee device, wherein different addressee devices may be associated with different detected actions.