Abstract: A method for sterilizing a membrane comprising an oxidoreductase enzyme, comprises: irradiating with gamma radiation the membrane comprising an oxidoreductase enzyme soaked in an aqueous buffer solution. Associated biosensors and bioreactors are also described.

Abstract: A method and system for switching a relay node are provided. The method comprises: a source base station of a D2D relay node or a MME sends the relevant information about the D2D relay node to a target base station, and the target base station perform a corresponding process according to the relevant information about the D2D relay node.

Abstract: A TDBU (top down, bottom up) window covering includes a first crossbeam and a second crossbeam below a fixture, wherein a slat assembly is connected between the first crossbeam and the second crossbeam. A first control structure is further provided in the first crossbeam, and a second control structure is provided in the second crossbeam. The first control structure moves the first crossbeam toward or away from the fixture, and the second control structure moves the second crossbeam toward or away from the first crossbeam. Whereby, the assembling and the maintenance of the window covering are more convenient and easier.

Abstract: A method of identifying compounds as direct inhibitors of Keap1-Nrf2 interaction through high-throughput screening and lead development. The direct inhibitors of Keap1-Nrf2 interaction are more specific and free of various undesirable effects than existing indirect inhibitors, and are potential drug candidates of chemopreventive and therapeutic agents for treatment of various diseases or conditions involving oxidative stress and/or inflammation, including but not limited to cancers, diabetes, Alzheimer's, and Parkinson's. Novel compounds are identified and methods of preventing or treating diseases or conditions related to Keap1-Nrf2 interaction activity by use of the novel compounds identified or compositions containing such compounds are also disclosed.

Abstract: A package structure includes a first package layer, a second package layer, and a chip layer positioned between the first package layer and the second package layer. The first package layer includes an electrical signal structure electrically isolated from a first thermal conduction structure. The chip layer includes an integrated circuit (IC) chip electrically connected to the electrical signal structure, a molding material, and a through-via positioned in the molding material. The first thermal conduction structure, the through-via, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.

Abstract: Systems and methods are described for implementing a coordinator within a coordinated environment, which environment includes set of coordinated devices managed by the coordinator. The coordinator can be provisioned with a set of tasks, each task corresponding to a segment of code that can be executed by the coordinator, such as to manage the coordinated devices. To assist in execution of the tasks, the coordinator can include a resource manager that generates execution environments corresponding to an individual task execution, which environments may be isolated from other execution environments. The coordinator can further include a scheduler to obtain calls to execute tasks, and implement a queue from which to select tasks for execution. On selecting a task, the scheduler may interact with the resource manager to generate an execution environment for the task, and cause execution of the task within the execution environment.

Abstract: An oscillation device includes an oscillator and a logic circuit. The oscillator generates an output oscillation signal. The logic circuit controls the oscillator according to the output oscillation signal, such that the output oscillation signal includes two different oscillation periods. The oscillation device may be used as a temperature-to-frequency converter without any bandgap reference circuit.

Abstract: A method for replacing a relay, comprising: a first D2D UE receives D2D relay node replacement indication information transmitted by a control node; and the first D2D UE communicates, according to the D2D relay node replacement indication information, through a new D2D relay node. Also disclosed are another method and system for replacing a relay node, a D2D UE and a control node.

Abstract: Systems and methods are described for configuring a coordinator within a coordinated environment, which environment includes set of coordinated devices managed by the coordinator. The coordinated devices may include devices configured to be managed remotely, such as thin devices, devices with alternative primary functions (e.g., appliances, household objects, etc.), or devices with limited localized user interfaces. To manage the set of coordinated devices, the coordinator can execute tasks, each task corresponding to a set of portable code executable by the coordinator to implement a desired functionality. A user may generate one or more tasks, and submit them to a service provider environment for deployment to the coordinator. The service provider environment can utilize a device shadow to notify the coordinator of the obtained tasks, and thereafter deliver the tasks to the coordinator, thus modifying a configuration of the coordinator.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a dihydroxy bis-sulfide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A touch sensing module includes a substrate, sensing electrodes, and a covering layer. The sensing electrodes are disposed on a surface of the substrate. Each of the sensing electrodes has a first end and a second end opposite to the first end. The second end is adopted to be electrically connected with an external circuit. The covering layer is disposed on a side of the sensing electrodes distal from the substrate, and covers the sensing electrodes. The covering layer has openings. The first ends of the sensing electrodes are exposed within the openings respectively.

Abstract: Disclosed herein is a flame retardant composition comprising 20 to 80 weight percent of a polycarbonate; 1 to 20 weight percent of a halogenated phenoxyphosphazene flame retardant, where all weight percents are based on a total weight of the flame retardant composition. Disclosed herein too is a method comprising blending a 20 to 80 weight percent of a polycarbonate; and 1 to 20 weight percent of a halogenated phenoxyphosphazene flame retardant to produce a flame retardant composition, where all weight percents are based on a total weight of the flame retardant composition.

Abstract: A method deactivates secondary Component Carrier (CC) measurement in a communications apparatus providing wireless communications services via a first CC in a wireless network, wherein the communications apparatus includes a first signal processing component chain comprising a plurality of signal processing components and is configured for processing the RF signals for the first CC and a second signal processing component chain comprising a plurality of signal processing components. The method includes operations of determining a switch timing for turning on at least one of the signal processing components in the second signal processing component chain for performing a deactivated secondary CC measurement; performing the deactivated secondary CC measurement via the second signal processing component chain, wherein the secondary CC is not able to perform data transmission or reception during a deactivated state, and wherein the switch timing is determined according to a Discontinuous Reception (DRX) cycle.

Abstract: A fin structure suitable for a FinFET and having a buried insulator layer is disclosed. In an exemplary embodiment, a semiconductor device comprises a substrate with a first semiconductor material and having a fin structure formed thereupon. The fin structure includes a lower region proximate to the substrate, a second semiconductor material disposed on the lower region, a third semiconductor material disposed on the second semiconductor material, and an insulating material selectively disposed on the second semiconductor material such that the insulating material electrically isolates a channel region of the fin structure and further such that the insulating material exerts a strain on the channel region. The semiconductor device further comprises an isolation feature disposed adjacent to the fin structure.

Abstract: A buffering method for video playing includes: playing a video according to an amount of video buffer data and a predefined playing threshold, and monitoring a network speed; determining whether the network speed meets a predefined condition; and updating a previously set video buffer depth and the playing threshold according to the network speed if the network speed meets the predefined condition. A storage medium and device are also provided.

Abstract: A method includes spraying a liquid including polymer and a gas substantially inert to the liquid respectively from a first and second orifice of a nozzle into air to form mist of beads. The beads then are collected with a collecting medium at a temperature in a range from about ?10° C. to about 80° C. The collecting medium includes at least one of water and alcohols.

Abstract: A package structure includes a first redistribution layer, a molding material, a semiconductor device and an inductor. The molding material is located on the first redistribution layer. The semiconductor device is molded in the molding material. The inductor penetrates through the molding material and electrically connected to the semiconductor device.

Abstract: A light blocking system is disclosed, which is adapted to be used in a vertical blind which includes a headrail, a control mechanism provided in the headrail, and a covering assembly including a plurality of slats. Each of the slats is connected to the control mechanism with an end thereof, and therefore is hung below the headrail. A gap is left between the covering assembly and the headrail. The control mechanism is adapted to turn the slats in situ relative to the headrail, or to move the slats back and forth in a longitudinal direction of the headrail. The light blocking system includes a cover plate provided corresponding to the gap, wherein the cover plate covers the gap when the covering assembly is in a closed state.

Abstract: A sample processing kit including a centrifugal microfluidic component and a collection component detachably fitted into the microfluidic component is provided. Upon the application of the sample processing kit, target molecules or cells may be separated and collected by the collection component for further experimentation.

Abstract: A mechanical switch structure includes a keycap, a base plate formed with a guiding opening, a scissor unit disposed on the base plate, and a receiving housing. The receiving housing has a first accommodation and a second accommodation. A guiding unit is received in the first accommodation along a pressing direction of the keycap, and is formed with a hillside portion. A first elastic element provides the guiding unit with an elastic force. A resistance module has an abutting unit which is abutted against the hillside portion of the guiding unit, and a second elastic unit to provide the abutting unit with an elastic force toward the guiding unit. The hillside portion is undulate-shaped and faces the guiding unit. The abutting unit is abutted against the hillside portion so as to provide different resistances during a pressing stroke of the keycap.