Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.

Abstract: A process for preparing a cured composite material useful for radio frequency filter applications comprising the steps of: (a) providing a curable thermoset epoxy resin composition comprising (i) at least one epoxy resin; (ii) at least one toughening agent; (iii) at least one hardener; and (iv) at least one filler, (b) curing the curable thermoset epoxy resin composition of step (a) to form a cured composite; wherein the curable thermoset epoxy resin composition upon curing provides a cured composite product with a balance of properties comprising Tg, coefficient of thermal expansion, tensile strength, thermal conductivity; and having a density of less than 2.7 g/cc; and (c) coating at least a portion of the surface of the cured composite of step (b) with an electrically conductive metal layer to form a metalized coating on at least a portion of the surface of the cured composite.

Abstract: Polymeric compositions suitable for use as insulation materials in electrical applications. Such polymeric compositions comprise an ethylene/?-olefin-based elastomer and a filler, where the filler consists essentially of an amorphous silica. Such polymeric compositions can optionally further comprise an ethylene-based thermoplastic polymer. Also disclosed are coated conductors comprising such polymeric compositions as insulation materials.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, and a polycationic amine compound in solution in the liquid carrier. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine containing polymer in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine compound in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: An image display method of a half-source-driving (HSD) liquid crystal display (LCD) for mitigating the screen flickering effect caused by applying a frame rate control (FRC) algorithm in the LCD includes providing a first gate sequence corresponding to a pixel array in the LCD display. If a target gray level of the pixel array is an average value of a first gray level and a second gray level, write the first gray level to a plurality of sub-pixels of the pixel array being charged first according to the first gate sequence, and write the second gray level smaller than the first gray level to a plurality of sub-pixels of the pixel array being charged latter according to the first gate sequence.

Abstract: A metallized optical fiber comprises: A) An optical fiber, and B) A conductive metal over and in contact with the optical fiber and having a thickness that is at least 0.15 times the thickness of the optical fiber. The metallized optical fiber can form a component of a hybrid optical fiber/coaxial cable, and it provides good protection against interference with the data signal traveling along the optical fiber from electrical current from an adjacent or near-by electrical conductor.

Abstract: Designing a GUI development toolkit includes creating a windows event class with a property of window predefined condition events and a property of window drag and drop events; creating a windows adapter class with two trigger methods; creating a windows class with a window listener method configured to cause the window to enter into an edit mode in response to detecting the property of window predefined condition events is triggered; and to obtain and save initial location, dragged-to location and the mapping relationship between thereof for each component in the window in response to detecting that the property of window drag and drop events is triggered; and creating a component class with an action listener method defined to cause components in a window to be dragged to other locations of the window in which the components are located in response to detecting that the window is under the edit mode.

Abstract: A gate driver includes a plurality of shift registers and a plurality of cutting units. Each of the shift registers is configured for outputting a shift register signal according to a clock signal of the each of the shift register sequentially. Each of the shift register signals has a working period and the two working periods of the two adjacent shift register signals overlap each other. Each of the cutting units is coupled to a respective one of the shift registers. The cutting unit corresponding to the Nth shift register is configured for cutting a part of the working period from the shift register signal of the Nth shift register to generate a gate driving signal according to the clock signal of the (N?1)th or (N+1)th shift register, such that working periods of the gate driving signals are staggered. N is a positive integer larger than two.

Abstract: A display device includes multiple pixels, a gate driver and a data driver. Each pixel includes a transistor and a pixel capacitor electrically coupled to the transistor. The gate driver is configured to turn on the transistor of a first pixel for one time during a first turn-on period of multiple turn-on cycles of a frame cycle of a frame displayed by the display device. The data driver is configured to charge the pixel capacitor of the first pixel via the transistor of the first pixel to a first over-charge voltage and a data voltage during an over-charge period and a recovery period of the first turn-on period. The first over-charge voltage is different from the data voltage. A method for driving the display device is also provided.

Abstract: A method for reconstructing an image of an object that includes a plurality of image elements. The method includes accessing image data associated with a plurality of image elements, and reconstructing an image of the object by optimizing an objective function, where the objective function is optimized by iteratively solving a nested sequence of approximate optimization problems. The algorithm is composed of nested iterative loops, in which an inner loop iteratively optimizes an objective function approximating the outer loop objective function, and an outer loop that utilizes the solution of the inner loop to optimize the original objective function.

Abstract: A display panel includes a plurality of first driving switches installed at a first side of the display panel, a plurality of second switches installed at a second side of the display panel, a plurality of first data lines, a plurality of second data lines, a plurality of scan lines, and a plurality of pixels. Each of the first driving switches includes a first input end and a plurality of first output ends. Each of the second driving switches includes a second input end and a plurality of second output ends. The first data lines are electrically connected to the first output ends. The second data lines are electrically connected to the second output ends. The plurality of pixels are electrically connected to the plurality of first data lines, second data lines and scan lines for displaying images. The first data lines and the second data lines are arranged interlacedly.

Abstract: The present disclosure relates to iterative reconstruction of images. In certain embodiments, a deconvolution filter is used to approximate the inversion of a Hessian matrix associated with the reconstruction. In one such embodiment, the desired image is not reconstructed directly in the iterative process. Instead, an image is reconstructed that yields the desired image when filtered by the deconvolution filter.

Abstract: Disclosed are a polishing composition and method of polishing a substrate. The composition has low-load (e.g., up to about 0.1 wt. %) of abrasive particles. The polishing composition also contains water and at least one anionic surfactant. In some embodiments, the abrasive particles are alpha alumina particles (e.g., coated with organic polymer). The polishing composition can be used, e.g., to polish a substrate of weak strength such as an organic polymer. An agent for oxidizing at least one of silicon and organic polymer is included in the composition in some embodiments.

Abstract: A method is provided for iteratively reconstructing an image of an object. The method includes accessing measurement data associated with the image, and using a simultaneous algorithm to reconstruct the image. Using the simultaneous algorithm to reconstruct the image includes determining a scaling factor that is voxel-dependent, and applying the voxel-dependent scaling factor to a gradient of an objective function to reconstruct the image.

Abstract: A composition comprising (A) at least one bisphenol-A polycarbonate resin, (B) at least one polypropylene, preferably a high crystallinity polypropylene, (C) at least one compatibilizer comprising an amine functionalized elastomeric polymer, (D) at least one organic phosphate flame retardant, preferably an organic phosphate that is liquid at room temperature, and, optionally, (E) one or more additives. These compositions are useful in the manufacture of wire insulation coatings of less than 0.2 mm with good scrape abrasion resistance.

Abstract: The present disclosure is directed to a plasticizer composition, polymeric compositions containing the plasticizer composition, and conductors coated with the polymeric composition. The plasticizer composition includes a first plasticizer comprising epoxidized fatty acid alkyl esters and a second plasticizer comprising an epoxidized natural oil. The plasticizer composition, first plasticizer, and/or second plasticizer can undergo one or more color-reducing treatment processes, such as distillation, filtration, and/or peroxide treatment.

Abstract: The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a substrate with the chemical-mechanical polishing composition. The polishing composition comprises (a) abrasive particles, wherein the abrasive particles comprise zirconia, (b) at least one metal ion oxidizer, wherein the at least one metal ion oxidizer comprises metal ions of Co3+, Au+, Ag+, Pt2+, Hg2+, Cr3+, Fe3+, Ce4+, or Cu2+, and (c) an aqueous carrier, wherein the pH of the chemical-mechanical polishing composition is in the range of about 1 to about 7, and wherein the chemical-mechanical polishing composition does not contain a peroxy-type oxidizer.