Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.

Abstract: A container device includes a receptacle having a bottom wall and an outer peripheral wall for forming a chamber to engage with a heat conductive member, a housing is engaged into the receptacle and includes an inner peripheral flange, a cap is selectively engaged with the receptacle, and a cover is selectively engaged with an inner peripheral portion of the cap for selectively engaging onto the cap when the cap is engaged onto the receptacle, and the cover is engageable into the housing and engageable with the inner peripheral flange of the housing when the cap is disengaged from the receptacle for providing different food cooking effect to the microwave oven cooking.

Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.

Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.

Abstract: A submersible pump assembly has a centrifugal pump with a number of stages, each of the stages having a rotatable impeller and a non rotating diffuser. The diffuser has vanes, each of the vanes curving radially inward from an outer end to an inner end. The vanes define vane passages between adjacent ones of the vanes through which well fluid flows. The vanes have thicknesses between inner and outer sides of each of the vanes that gradually increase from the outer ends toward the inner ends. At least one pocket is formed in each of the inner sides of each of the vanes. The pockets are open cavities to receive a portion of the well fluid flowing from the vane passages to the diffuser outlet.

Abstract: An impeller vane includes at least one groove on a high pressure or working surface of the impeller vane to increase pump efficiency and reduce pump power requirements. The impeller vane includes a groove or a plurality of grooves formed on the high pressure surface of the vane. The grooves extend from a leading end of the vane to a trailing end of the vane. The grooves define ridges on either side of each groove that extend the length of the groove.

Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.

Abstract: A photolithography system includes a photo-mask storage, at least one photolithography machine and an overhead crane for transporting at least one photo-mask at least between the photo-mask storage and the photolithography machine. The overhead crane includes at least one main rail, a mask girder, a mask hoist and a mask holding device. The mask girder is coupled with the main rail and movable at least between a first position above the photo-mask storage and a second position above the photolithography machine. The mask hoist is movably coupled with the mask girder. The mask holding device is coupled with the mask hoist.

Abstract: One or more techniques or systems for ultra-high vacuum (UHV) wafer processing are provided herein. In some embodiments, a vacuum system includes one or more cluster tools connected via one or more bridges. For example, a first cluster tool is connected to a first bridge. Additionally, a second cluster tool is connected to a second bridge. In some embodiments, the first bridge is configured to connect the second cluster tool to the first cluster tool. In some embodiments, the second cluster tool is connected to the first bridge, thus forming a ‘tunnel’. In some embodiments, the second bridge comprises one or more facets configured to enable a connection to an additional process chamber or an additional cluster tool. In this manner, a more efficient UHV environment is provided, thus enhancing a yield associated with wafer processing, for example.

Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.

Abstract: The disclosure provides a cell penetrating peptide. The cell penetrating peptide includes an amino acid sequence of Dn, in which D represents an aspartate residue and 2?n?15.

Abstract: A rail transport system and method for a semiconductor fabrication facility (FAB). In one embodiment, the system includes a network of stationary rails and a wheeled vehicle movable on the rails via rolling movement. The vehicle is operable to hold a wafer carrier that stores a plurality of wafers. A cross-floor transport system is provided that may include a vehicle lifter positioned near the network of rails that extends between a first elevation and a second elevation in the FAB. The lifter is configured and operable to receive the vehicle from rails at the first elevation and vertically transport the vehicle to rails at the second elevation without removing the wafer carrier from the wheeled vehicle. In one embodiment, the lifter is configured so that the vehicle may be rolled directly onto and off of the lifter for vertical transport.

Abstract: An impeller vane includes at least one groove on a high pressure or working surface of the impeller vane to increase pump efficiency and reduce pump power requirements. The impeller vane includes a groove or a plurality of grooves formed on the high pressure surface of the vane. The grooves extend from a leading end of the vane to a trailing end of the vane. The grooves define ridges on either side of each groove that extend the length of the groove.

Abstract: A method for producing polyploid plants of orchids includes the steps of: providing a protocorm or protocom-like body (PLB) of an orchid, the protocorm or PLB having an upper portion with a growing point and a lower portion without any growing point; cutting the protocorm or PLB approximately at a point of half height to separate the upper portion; subculturing the lower portion of the protocorm or PLB in an inducing medium, and putting a cut surface of the lower portion of the protocorm or PLB to face upward so that one or more next-generation PLBs grow from the cut surface of the lower portion. The method characterized in using no antimicrotubule agent can simplify the entire process of orchid polyploidy breeding, and can be used in mass-production of the stable polyploid plants.

Abstract: An LED controller application specific integrated circuit includes a host interface and a PWM module. The PWM module is configured to control a plurality of LED devices, and comprises a PWM data buffer, an arithmetic core and a plurality of PWM channels. The PWM data buffer is configured to store PWM turning-point data from the host. The arithmetic core is configured to generate PWM data according to the PWM turning-point data stored in the PWM data buffer. The plurality of PWM channels are configured to receive the PWM data, and each comprises a PWM controller and a PWM I/O interface. The PWM controller is configured to control the operation of the PWM channel. The PWM I/O interface is configured to connect to an LED device.

Abstract: A cuffless blood pressure monitor is revealed. The cuffless blood pressure monitor includes a pressure detection module, a signal processing module and a display module. The pressure detection module detects blood pressure to generate a blood pressure pulse signal. The signal processing module processes the blood pressure pulse signal to generate a measurement result that is displayed by the display module. The cuffless blood pressure monitor measures continuous blood pressure pulse signals, processes the blood pressure pulse signals by the signal processing module, and calculates the measurement result for real-time measurement of blood pressure. A measurement point on the user is pressed by a soft pressure-transferring medium so that the user won't feel uncomfortable. Moreover, the cuffless blood pressure monitor is compact and portable.

Abstract: An electronic greeting card integrated with a physical carrier is disclosed and includes: a first wireless communication circuit module for wirelessly transceiving a signal associated with data or a command; a first communication software module, when executed, establishing a communication link with an electronic apparatus with a greeting card browser via the first wireless communication circuit module; a greeting card software module for editing, browsing and archiving the digital content, and storing the digital content or the status information back to the electronic greeting card; at least one flash memory for storing programming codes respectively corresponding to the software modules and storing the digital content and status information; a processor for processing the data or command from the first wireless communication circuit module; and a physical carrier for carrying the first wireless communication circuit module, the flash memory and the processor.

Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.

Abstract: A method for producing polyploid plants of orchids includes the steps of: providing a protocorm or protocom-like body (PLB) of an orchid, the protocorm or PLB having an upper portion with a growing point and a lower portion without any growing point; cutting the protocorm or PLB approximately at a point of half height to separate the upper portion; subculturing the lower portion of the protocorm or PLB in an inducing medium, and putting a cut surface of the lower portion of the protocorm or PLB to face upward so that one or more next-generation PLBs grow from the cut surface of the lower portion. The method characterized in using no antimicrotubule agent can simplify the entire process of orchid polyploidy breeding, and can be used in mass-production of the stable polyploid plants.

Abstract: The present invention relates to an emulsion type adhesive applicable for over-laminating films, the preparation and the use thereof. The emulsion type adhesive comprises: (a) 60 to 99.5 parts per hundred of monomers of one or more alkyl acrylates containing 4-12 carbon atoms on the alkyl group; (b) 0.5 to 40 parts per hundred of monomers of an alkyl acrylate containing 1-3 carbon atoms in the alkyl group or an alkyl methacrylate containing 1-6 carbon atoms in the alkyl group; (c) 0.1 to 5 parts per hundred of monomers of dicarboxylic acids; (d) 1 to 5 parts per hundred of a reactive surfactant; (e) 0.1 to 15 parts per hundred of an organic acid vinyl ester; and (f) 100 parts per hundred of soft water, (a) and (b) are 100 parts by hundred, while (c), (d), (e) and (f) are calculated based on the total weight of (a)+(b). The products of this invention have excellent properties.