Abstract: The invention relates to a light beam generating device and method, and a projection device. The light beam generating device is configured to receive a color control signal and generate a target light beam having a target color, and includes a plurality of drivers, a current signal generating circuit, and a control circuit. The drivers respectively drive a plurality of light-emitting elements according to a plurality of current signals, wherein the plurality of light-emitting elements collectively generate the target light beam. The current signal generating circuit is coupled to the drivers and generates the plurality of current signals according to the color control signal corresponding to the target color. The control circuit is coupled to the drivers and controls whether each driver is enabled according to the color control signal.

Abstract: A driving device is provided. The driving device includes a signal processing circuit and a driving circuit. The signal processing circuit is configured to generate a current input signal according to a target current signal. The driving circuit is configured to receive the current input signal and generate a current output signal according to the current input signal to drive a light emitting element. In a first time interval, the current input signal gradually rises from a first current value to a target current value in a continuous or segmented manner according to a rising slope. Further, a control method of the driving device and a lighting system including the driving device are also provided.

Abstract: The invention relates to a light beam generating device and method, and a projection device. The light beam generating device is configured to receive a color control signal and generate a target light beam having a target color, and includes a plurality of drivers, a current signal generating circuit, and a control circuit. The drivers respectively drive a plurality of light-emitting elements according to a plurality of current signals, wherein the plurality of light-emitting elements collectively generate the target light beam. The current signal generating circuit is coupled to the drivers and generates the plurality of current signals according to the color control signal corresponding to the target color. The control circuit is coupled to the drivers and controls whether each driver is enabled according to the color control signal.

Abstract: Methods and systems for analysing a property of a cornea of an eye using terahertz (THz) radiation are provided. The method includes projecting a first THz wave onto a surface of the cornea and detecting a first reflected wave being a reflection of the first THz wave reflected from the surface of the cornea. The method further includes deforming the cornea by projecting visible light or puffing air to the surface of the cornea, projecting a second THz wave onto the surface of the cornea after the deforming, and detecting a second reflected wave being a reflection of the second THz wave reflected from the surface of the cornea after the deforming. Finally, the method includes calculating the property of the cornea based on the first reflected wave and the second reflected wave. The invention particularly relates to systems and methods for corneal elasticity and/or rigidity analysis using terahertz (THz) time-domain spectroscopy.

Abstract: Methods and systems for dry eye analysis using terahertz (THz) radiation. The method includes projecting a THz wave onto a surface of an eye and detecting a reflected wave being a reflection of the THz wave reflected from the surface of the eye. The method further includes analysing properties of the eye in response to the THz wave reflected from the surface of the eye, the properties of the eye including thickness of the eye's cornea and ambient tissues, and analyzing the properties of the eye comprises measuring the thickness of the cornea and/or the ambient tissues and/or measuring an amount of chemical components of one or more of the eye's layers.

Abstract: A projection system and a control method of a driving current thereof are provided. A power supply of an illumination module provides the driving current to drive a light source to provide an illumination beam. A filter wheel receives the illumination beam and filtered beams are generated. The illumination beam passes through the filter wheel during a first period and a first filtered beam is generated. The illumination beam passes through the filter wheel during a second period and a second filtered beam is generated. The filtered beams include the first filtered beam, the second filtered beam, and an intermediate filtered beam generated during an intermediate period between the first and second periods. A control device controls the power supply to continuously provide the driving current from the first period, through the intermediate period, to the second period.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A projection system and a control method of a driving current thereof are provided. A power supply of an illumination module provides the driving current to drive a light source to provide an illumination beam. A filter wheel receives the illumination beam and filtered beams are generated. The illumination beam passes through the filter wheel during a first period and a first filtered beam is generated. The illumination beam passes through the filter wheel during a second period and a second filtered beam is generated. The filtered beams include the first filtered beam, the second filtered beam, and an intermediate filtered beam generated during an intermediate period between the first and second periods. A control device controls the power supply to continuously provide the driving current from the first period, through the intermediate period, to the second period.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: In a first aspect, a system for analysing a fluid sample is provided, comprises: a container configured to receive the fluid sample; a first light source optically coupled to the container and configured to project a first light having a first wavelength; a second light source optically coupled to the container and configured to project a second light having a second wavelength different from the first wavelength; one or more photo-sensors optically coupled to the container and configured to analyse the fluid sample in response to a first scattered light generated in response to projecting the fluid sample with the first light source and a second scattered light generated in response to projecting the fluid sample with the second light source. In a preferred embodiment, the nutritious compositions (such as the concentration of fats and protein) of milk samples are identified based on the scattering of the first and second light source by the milk sample.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: The present invention refers to a non-invasive method for isolating adipose-derived stem cells from adipose tissue by illuminating the adipose tissue with at least one laser having a wavelength of between 360 nm to 480 nm or between 800 nm to 2 pm for a predetermined time for dissociating fat cells and blood vessels of the adipose tissue to release intact stem cells from the adipose tissue while maintaining the viability of the stem cells. In the preferred embodiment, the adipose tissue is illuminated with pulsed near infra-red (NIR) laser and a continuous wave (CW) diode blue laser. The present invention also contains a system adapted for isolating adipose-derived stem cells from adipose tissue using the method of the present invention.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting clement, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.