METHOD FOR MANUFACTURING LIGHT EMITTING UNIT
A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
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This application is a continuation of and claims the priority benefit of U.S. application Ser. No. 16/231,914, filed on Dec. 24, 2018, now allowed. The prior U.S. application Ser. No. 16/231,914 is a continuation application of and claims the priority benefit of U.S. application Ser. No. 15/859,714, filed on Jan. 1, 2018, now patented. The prior U.S. application Ser. No. 15/859,714 is a continuation application of and claims the priority benefit of U.S. application Ser. No. 14/957,630, filed on Dec. 3, 2015, now patented. The prior U.S. application Ser. No. 14/957,630 is a continuation application of and claims the priority benefit of U.S. application Ser. No. 14/474,283, filed on Sep. 1, 2014, now patented, which claims the priority benefit of Taiwan application serial no. 103124160, filed on Jul. 14, 2014. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
BACKGROUND Technical FieldThe invention relates to a light emitting unit, and particularly relates to a method for manufacturing a light emitting unit.
Related ArtGenerally, series-parallel control of a light emitting unit composed of a plurality of light emitting diode (LED) chips on a circuit substrate is implemented according to a serial-parallel connection method of voltage values and current values provided by a power supplier when a circuit layout is designed on the circuit substrate. However, since types of the LED chips are plural, i.e. the voltage value and the current value required by each of the LED chips are different, when the light emitting unit is disposed on the circuit substrate, besides that it is difficult to achieve an optimal light emitting effect, the appearance and cost of the circuit substrate are also influenced due to modification of the circuit layout.
For example, if an initial design of the circuit layout of the circuit substrate is a circuit design of 4S1P, when a conversion efficiency test is performed to modify the initial design into a circuit design of 2S2P, since series-parallel modification cannot be implemented after the circuit layout is completed, jumpers, circuit disconnection or remanufacturing or re-planning of the circuit layout are required in order to achieve the required series-parallel design, by which not only a manufacturing cost is increased, a manufacturing time is also increased.
SUMMARYThe invention is directed to a method for manufacturing a light emitting unit capable of selectively forming different series connection loop, parallel connection loop or series-parallel connection loop through a cutting process.
A method for manufacturing light emitting units comprising providing a semiconductor structure comprising a plurality of light emitting dices; forming an encapsulant covering the light emitting dices; mounting the light emitting dices to a patterned conductive layer coupled to a carrier board, wherein the light emitting dices are electrically connected to the patterned conductive layer; providing a substrate on the encapsulant, wherein the encapsulant is located between the substrate and the light emitting dices; and cutting the substrate, the encapsulant, the semiconductor structure, and the carrier board so as to obtain the light emitting units.
A method of manufacturing light emitting units comprising providing a semiconductor structure comprising a substrate, a phosphor-containing encapsulant, a plurality of light emitting dices and an external circuit, wherein the phosphor-containing encapsulant covers the light emitting dices located between the substrate and the external circuit, and a patterned conductive layer is formed on electrodes of the light emitting dices and is physically coupled to the external circuit; and cutting the semiconductor structure so as to obtain the light emitting units.
A method of manufacturing light emitting units comprising providing a semiconductor structure comprising a light transmissive layer, an encapsulant containing a phosphor material and a plurality sets of light emitting dices, wherein the encapsulant covers the light emitting dices and is disposed between the light transmissive layer and the light emitting dices; mounting a plurality of sets of wirings to the plurality of sets of light emitting dices to form series circuits and/or parallel circuits; and performing a cutting process to obtain the light emitting units, wherein each of the light emitting units at least comprises one of the sets of light emitting dices and one of the sets of wirings.
According to the above descriptions, the cutting process is performed to cut the semiconductor structure, the patterned conductive layer, the encapsulant and the substrate so as to define the light emitting unit with the series connection loop, the parallel connection loop or the series-parallel connection loop. Therefore, a user is capable of selecting a cutting region by himself according to a usage requirement, so as to form different circuit loop designs. In this way, according to the method for manufacturing the light emitting unit of the invention, the user has better manufacturing flexibility, and the manufactured light emitting unit has circuit loop designs of a plurality of patterns.
In order to make the aforementioned and other features and advantages of the invention comprehensible, several exemplary embodiments accompanied with figures are described in detail below.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
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Although the light emitting unit 100a with the series connection loop (i.e. 4S) is formed after the cutting process, in other embodiments, the cutting region can be changed according to an actual requirement of the user to form the light emitting unit of different circuit loops.
For example, referring to
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In other embodiments that are not illustrated, those skilled in the art can select the cutting region on the semiconductor structure 110 by themselves according to an actual requirement by referring to descriptions of the aforementioned embodiments, so as to form the light emitting unit with the required circuit loop (for example, 2S3P, 4S1P, etc.).
Moreover, it should be noticed that the patterned metal layer 140 of the present embodiment covers the first electrodes 124 and the second electrodes 126 of the light emitting dice 120 and extends to a part of the molding compound 130. Namely, the patterned metal layer 140 may increase a contact area of the first electrodes 124 and the second electrodes 126 of the light emitting dice 120, which avails assembling the light emitting units 100a, 100b and 100c formed after the cutting process with an external circuit, by which an alignment accuracy and assembling efficiency are effectively improved.
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In summary, the cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define the light emitting unit with the series connection loop, the parallel connection loop or the series-parallel connection loop. Therefore, the user is capable of selecting a cutting region by himself according to a usage requirement, so as to form different circuit loop designs. In this way, according to the method for manufacturing the light emitting unit of the invention, the user has better manufacturing flexibility, and the manufactured light emitting unit may have circuit loop designs of a plurality of patterns.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims
1. A method for manufacturing a light emitting unit, comprising:
- providing a semiconductor structure comprising a plurality of light emitting dices separated from each other, wherein each of the light emitting dices comprises a light emitting element, a first electrode and a second electrode, and the first electrode and the second electrode are disposed at a same side of the light emitting element, and the first electrode and the second electrode have a gap therebetween;
- forming a molding compound to encapsulate the light emitting dices, wherein the molding compound encapsulates the light emitting element of each of the light emitting dices, and exposes the first electrode and the second electrode of each of the light emitting dices, and the molding compound is doped with a phosphor material;
- forming a patterned metal layer on the first electrodes and the second electrodes of the light emitting dices, wherein the patterned metal layer directly contact the first electrodes and the second electrodes of the light emitting dices;
- providing a substrate, wherein the molding compound is located between the substrate and the light emitting elements of the light emitting dices;
- performing a cutting process to cut the molding compound and the substrate so as to define at least a light emitting unit having a series connection loop, a parallel connection loop or a series-parallel connection loop; and
- providing an external circuit disposed at one side of the light emitting units adjacent to the patterned metal layer, the light emitting units being electrically connected to the external circuit via the patterned metal layer, wherein a gap is formed between the molding compound and the external circuit.
Type: Application
Filed: Feb 24, 2020
Publication Date: Jun 18, 2020
Applicant: Genesis Photonics Inc. (Tainan City)
Inventors: Shao-Ying Ting (Tainan City), Kuan-Chieh Huang (Tainan City), Jing-En Huang (Tainan City), Yi-Ru Huang (Tainan City), Sie-Jhan Wu (Tainan City), Long-Lin Ke (Tainan City)
Application Number: 16/799,762