Patents by Inventor Lin Lan
Lin Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240044528Abstract: An apparatus includes a compressor, a first heat exchanger, a reheater, a first valve, a second heat exchanger, a four-way valve, a cap tube, and a blower. The compressor compresses a refrigerant. The blower moves air proximate the second heat exchanger to the reheater. During a cooling mode of operation, the four-way valve is configured to direct refrigerant from the first heat exchanger to the compressor; the compressor compresses the refrigerant received from the first heat exchanger; and the cap tube is configured to allow refrigerant to bypass the reheater.Type: ApplicationFiled: October 18, 2023Publication date: February 8, 2024Inventors: Der-Kai Hung, Lin Lan, Christopher John Drury
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Publication number: 20240038688Abstract: A device includes a molding compound, a plurality of through vias, a seal ring structure, and a protection layer. The plurality of through vias are embedded in the molding compound. The seal ring structure is over the molding compound and surrounds the through vias in a top view. The protection layer covers the seal ring and extends toward the molding compound in a cross-sectional view.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Zi-Jheng LIU, Jo-Lin LAN, Yu-Hsiang HU, Hung-Jui KUO
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Publication number: 20240038431Abstract: The present disclosure discloses a shielded insulating shell and an electronic device. The shielded insulating shell includes a shell body provided with a first cavity, with an inner shielding layer near the first cavity and an outer shielding layer far away from the first cavity being formed on the shell body; a first structure formed on the first cavity, and formed by assembling to comprise at least a first shielding layer, a first insulating layer, a first air gap layer, a second insulating layer, and a second shielding layer arranged sequentially from an inner side to an outer side of the first cavity; and an assembling gap formed on the first structure, which cooperates with the first air gap layer to form a creepage path on the first structure that extends from the inner shielding layer to the outer shielding layer.Type: ApplicationFiled: July 20, 2023Publication date: February 1, 2024Inventors: Peng MA, Yicong XIE, Weiqiang ZHANG, Guoli LIU, Lin LAN
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Patent number: 11828486Abstract: An apparatus includes a compressor, a first heat exchanger, a reheater, a first valve, a second heat exchanger, a four-way valve, a cap tube, and a blower. The compressor compresses a refrigerant. The blower moves air proximate the second heat exchanger to the reheater. During a heating mode of operation, the four-way valve is configured to direct refrigerant from the compressor to the second heat exchanger; the second heat exchanger is configured to use the refrigerant from the compressor to heat air proximate the second heat exchanger; and the cap tube is configured to allow refrigerant to bypass the reheater.Type: GrantFiled: December 16, 2021Date of Patent: November 28, 2023Assignee: Lennox Industries Inc.Inventors: Der-Kai Hung, Lin Lan, Christopher John Drury
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Patent number: 11817399Abstract: A device includes a semiconductor chip, a molding compound, an insulating structure, an under-bump-metallurgy (UBM), a conductive ball, and a protection layer. The molding compound laterally surrounds the semiconductor chip. The insulating structure is over the semiconductor chip and the molding compound. The UBM is over the insulating structure and is electrically connected to the semiconductor chip. The conductive ball is in contact with the UBM. The protection layer extends from the UBM to the molding compound.Type: GrantFiled: June 6, 2021Date of Patent: November 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Zi-Jheng Liu, Jo-Lin Lan, Yu-Hsiang Hu, Hung-Jui Kuo
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Publication number: 20230345653Abstract: The disclosure provides a compressing structure for compressing a component, a power module and a method for compressing a component inside a chamber, the compressing structure is provided for compressing a component onto a fixed plate and comprises a plate-shaped structure, the component is secured to a first side of the plate-shaped structure, the outside of the plate-shaped structure is provided with a base; at least a steering compressing member is provided between a second side of the plate-shaped structure and the base, and mounted on the second side of the plate-shaped structure or the base, the steering compressing member is provided for transforming an rotational motion into a translational motion; and at least a positioning device mounted on the side of the plate-shaped structure and the base. The compressing structure provided by the disclosure compresses the component onto the fixed plate.Type: ApplicationFiled: March 2, 2023Publication date: October 26, 2023Inventors: Lin LAN, Jing RONG, Weiqiang ZHANG
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Patent number: 11783987Abstract: A transformer includes an insulation member, a high voltage part, and a low voltage part, the insulation member includes a first insulator, a second insulator, and a reference plane, the high voltage part is disposed on a first side of the reference plane, the low voltage part is disposed on a second side of the reference plane, the first insulator is disposed on the reference plane, at least a portion of the second insulator is located around the high voltage part, at least one air passage is formed by the insulation member, and at least a portion of the air passage is located within a height of the high voltage part in a normal direction of the reference plane.Type: GrantFiled: September 3, 2020Date of Patent: October 10, 2023Assignee: Delta Electronics (Shanghai) CO., LTDInventors: Quanliang Zhang, Shizhong Guo, Min Zhou, Lin Lan
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Publication number: 20230307251Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.Type: ApplicationFiled: May 26, 2023Publication date: September 28, 2023Inventors: Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu, Meng-Wei Chou
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Patent number: 11757363Abstract: The invention discloses a power module and a power conversion device. The power module includes a primary converting unit including a first active device unit; a secondary converting unit including a second active device unit; a transformer including a primary unit connected to the primary converting unit and a secondary unit connected to the secondary converting unit; a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed; and an insulating plate including an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body.Type: GrantFiled: September 28, 2021Date of Patent: September 12, 2023Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Lin Lan, Weiqiang Zhang, Yicong Xie, Quanliang Zhang, Jing Rong, Wei Zhou
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Publication number: 20230235655Abstract: A wellbore staged operation method, includes running, after a first well drifting operation is performed on a wellbore, a pipe string (100) in the wellbore, wherein the pipe string (100) includes, along a direction from bottom to top, a floating hoop (2), a plug seat (7), a toe-end sliding sleeve (3), and a fracturing sliding sleeve (4); performing a cementing operation, wherein cement slurry pumped into an inner chamber of the pipe string (100) enters an annulus between the pipe string and the wellbore through the plug seat (7) and the floating hoop (2) to form a cement sheath, the cement sheath isolating the toe-end sliding sleeve (3) from the fracturing sliding sleeve (4); performing a second drifting operation to ensure the toe-end sliding sleeve (3) of the pipe string (100) exposed; performing a pressure test for the pipe string; and performing staged fracturing constructions.Type: ApplicationFiled: June 10, 2021Publication date: July 27, 2023Inventors: Wei LEI, Zhimin HOU, Haifeng DONG, Yancheng YAN, Lin LAN, Xingwen WANG, Xiaogang WANG, Zhiguo QIAO, Zhou FANG
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Patent number: 11699598Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.Type: GrantFiled: December 14, 2020Date of Patent: July 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu, Meng-Wei Chou
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Patent number: 11683900Abstract: The present disclosure relates to the field of power electronics, and proposes a power conversion system, including a power cabinet, a first divider and a plurality of power modules. The power cabinet includes a first high voltage compartment and a first low voltage compartment. The first divider is arranged in the power cabinet, and extends along a height direction of the power cabinet to separate the first high voltage compartment and the first low voltage compartment. The plurality of power modules are arranged in the power cabinet, each power module includes a high voltage input terminal and a low voltage output terminal; the high voltage input terminal is arranged in the first high voltage compartment, and the low voltage output terminal is arranged in the first low voltage compartment.Type: GrantFiled: September 30, 2020Date of Patent: June 20, 2023Assignee: Delta Electronics (Shanghai) CO., LTDInventors: Lin Lan, Weiqiang Zhang
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Patent number: 11630795Abstract: Disclosed is an RS-485 circuit, which includes an RS-485 interface chip, a start detector, a control module and a counter. The RS-485 interface chip includes a data input terminal and an enable terminal, wherein the data input terminal is configured to receive a data signal, the enable terminal is configured to receive a start signal or a switching signal to make the RS-485 interface chip in a data transmitting state or a data receiving state. The start detector is configured to detect a first signal edge of the data signal to generate the start signal to the enable terminal. After detecting the first signal edge of the data signal, the control module outputs first counting information. The counter is configured to count based on the first counting information, and output the switching signal to the enable terminal when the counter expires.Type: GrantFiled: December 8, 2021Date of Patent: April 18, 2023Assignee: Feature Integration Technology Inc.Inventor: Yu-Lin Lan
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Patent number: 11600423Abstract: The present disclosure provides a transformer including at least one magnetic core each having at least one window; one primary side winding passing through the at least one window, a wire forming the primary side winding being sequentially covered with a first solid insulating layer, a grounded shielding layer and a second solid insulating layer from inside to outside along a radial direction of the wire, the grounded shielding layer being connected to a reference ground; and at least one secondary side winding, each passing through the at least one window, the primary side winding having a first voltage with respect to the reference ground, the secondary side winding having a second voltage with respect to the reference ground, and the second voltage being greater than 50 times of the first voltage.Type: GrantFiled: May 6, 2019Date of Patent: March 7, 2023Assignee: Delta Electronics, Inc.Inventors: Peng Ma, Yicong Xie, Lin Lan, Weiqiang Zhang
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Publication number: 20220382704Abstract: Disclosed is an RS-485 circuit, which includes an RS-485 interface chip, a start detector, a control module and a counter. The RS-485 interface chip includes a data input terminal and an enable terminal, wherein the data input terminal is configured to receive a data signal, the enable terminal is configured to receive a start signal or a switching signal to make the RS-485 interface chip in a data transmitting state or a data receiving state. The start detector is configured to detect a first signal edge of the data signal to generate the start signal to the enable terminal. After detecting the first signal edge of the data signal, the control module outputs first counting information. The counter is configured to count based on the first counting information, and output the switching signal to the enable terminal when the counter expires.Type: ApplicationFiled: December 8, 2021Publication date: December 1, 2022Applicant: Feature Integration Technology Inc.Inventor: Yu-Lin LAN
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Patent number: 11477920Abstract: The present disclosure relates to the field of power electronics technology, and proposes a power module, including: a case and an isolating part disposed in the case; a first air duct and a second air duct stacked to each other, separated by the isolating part, and penetrated in a front-to-rear direction in the case; a high-voltage power unit; a low-voltage power unit; and a transformer, including a high-voltage portion and a low-voltage portion, wherein the high-voltage portion includes a first magnetic core and a high-voltage coil disposed on the first magnetic core, and the low-voltage portion includes a second magnetic core and a low-voltage coil disposed on the second magnetic core, wherein the high-voltage power unit and the high-voltage portion are disposed in the first air duct, and the low-voltage power unit and the low-voltage portion are disposed in the second air duct.Type: GrantFiled: October 22, 2020Date of Patent: October 18, 2022Assignee: Delta Electronics (Shanghai) CO., LTDInventors: Lin Lan, Weiqiang Zhang, Quanliang Zhang
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Publication number: 20220307755Abstract: An HVAC system includes an outdoor heat exchanger. A first indoor heat exchanger is fluidly coupled to the outdoor heat exchanger and disposed in a first zone. A second indoor heat exchanger is fluidly coupled to the outdoor heat exchanger and disposed in a second zone. A compressor is fluidly coupled to the outdoor heat exchanger, the first indoor heat exchanger, and the second indoor heat exchanger. A first circulation fan is positioned to circulate air around the first indoor heat exchanger and a second circulation fan is positioned to circulate air around the second indoor heat exchanger. A first zone controller is electrically coupled to the first indoor heat exchanger.Type: ApplicationFiled: June 16, 2022Publication date: September 29, 2022Applicant: Lennox Industries Inc.Inventors: Ben HOBSON, Hongbing LIAN, Der-Kai HUNG, Steve MERSH, Lin LAN, Shahn MARKARIAN
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Patent number: 11397040Abstract: An HVAC system includes an outdoor heat exchanger. A first indoor heat exchanger is fluidly coupled to the outdoor heat exchanger and disposed in a first zone. A second indoor heat exchanger is fluidly coupled to the outdoor heat exchanger and disposed in a second zone. A compressor is fluidly coupled to the outdoor heat exchanger, the first indoor heat exchanger, and the second indoor heat exchanger. A first zone controller is electrically coupled to the first indoor heat exchanger. The first zone controller is configured to measure a temperature in the first zone, compare the measured temperature to a setpoint temperature of the first zone, and responsive to a difference between the measured temperature and the setpoint temperature, adjust a speed of a first circulation fan independent of the speed of a second circulation fan.Type: GrantFiled: November 8, 2019Date of Patent: July 26, 2022Assignee: Lennox Industries Inc.Inventors: Ben Hobson, Hongbing Lian, Der-Kai Hung, Steve Mersh, Lin Lan, Shahn Markarian
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Publication number: 20220149743Abstract: The invention discloses a power module and a power conversion device. The power module includes a primary converting unit including a first active device unit; a secondary converting unit including a second active device unit; a transformer including a primary unit connected to the primary converting unit and a secondary unit connected to the secondary converting unit; a first heat dissipating unit on which the primary unit and the first active device unit are disposed; a second heat dissipating unit on which the secondary unit and the second active device unit are disposed; and an insulating plate including an insulating plate body and a semi-conducting layer disposed on a surface of the insulating plate body.Type: ApplicationFiled: September 28, 2021Publication date: May 12, 2022Inventors: Lin LAN, Weiqiang ZHANG, Yicong XIE, Quanliang ZHANG, Jing RONG, Wei ZHOU
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Publication number: 20220107097Abstract: An apparatus includes a compressor, a first heat exchanger, a reheater, a first valve, a second heat exchanger, a four-way valve, a cap tube, and a blower. The compressor compresses a refrigerant. The blower moves air proximate the second heat exchanger to the reheater. During a heating mode of operation, the four-way valve is configured to direct refrigerant from the compressor to the second heat exchanger; the second heat exchanger is configured to use the refrigerant from the compressor to heat air proximate the second heat exchanger; and the cap tube is configured to allow refrigerant to bypass the reheater.Type: ApplicationFiled: December 16, 2021Publication date: April 7, 2022Inventors: Der-Kai Hung, Lin Lan, Christopher John Drury