Abstract: Disclosed is a power supply system, including: a high-voltage input power distribution cabinet, a high-low voltage conversion cabinet, and a low-voltage output and control cabinet, the high-low voltage conversion cabinet is provided with at least one high-voltage chamber provided with a high-voltage bus bar, at least one low-voltage chamber provided with a low-voltage bus bar, an insulating partition between the high-voltage chamber and the low-voltage chamber and a plurality of power supply modules; each of the power supply modules bridges the high-voltage and low-voltage chambers and includes a high-voltage cavity, a low-voltage cavity and an isolation unit, the high-voltage and low-voltage cavities are respectively disposed corresponding to the high-voltage and low-voltage chambers and electrically connected to the high-voltage and low-voltage bus bars respectively, and the isolation unit is connected to one end of the high-voltage cavity and one end of the low-voltage cavity.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: The present disclosure relates to the technical field of power electronics, and provides a power supply system, including: a high-voltage input power distribution cabinet, a high-low voltage conversion cabinet, and a low-voltage output and control cabinet, wherein the high-low voltage conversion cabinet is provided with at least one high-voltage chamber and at least one low-voltage chamber, the high-low voltage conversion cabinet is further provided with an insulating partition between the high-voltage chamber and the low-voltage chamber, the low-voltage chamber is provided with a low-voltage bus bar, and the high-voltage chamber is provided with a high-voltage bus bar; the high-low voltage conversion cabinet is further provided with a plurality of power supply modules, and each of the power supply modules bridges the high-voltage chamber and the low-voltage chamber, the power supply module includes a high-voltage cavity, a low-voltage cavity and an isolation unit.

Abstract: The present disclosure provides a transformer including at least one magnetic core each having at least one window; one primary side winding passing through the at least one window, a wire forming the primary side winding being sequentially covered with a first solid insulating layer, a grounded shielding layer and a second solid insulating layer from inside to outside along a radial direction of the wire, the grounded shielding layer being connected to a reference ground; and at least one secondary side winding, each passing through the at least one window, the primary side winding having a first voltage with respect to the reference ground, the secondary side winding having a second voltage with respect to the reference ground, and the second voltage being greater than 50 times of the first voltage.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: An electric coupler includes a body, a first electrical path through the body having a first resistance to electric current within a first frequency range and a second electrical path through the body having a second resistance to electric current within a second frequency range.

Abstract: A method includes forming an insulating film over a semiconductor structure, forming a sealing ring over a sidewall of the insulating film, and forming a protective layer over an exposed sidewall of the sealing ring. The semiconductor structure includes a semiconductor chip and a molding compound disposed around the semiconductor chip. The exposed sidewall of the sealing ring faces away from the sidewall of the insulating film.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A method of manufacturing a semiconductor device includes: receiving a semiconductor structure having a chip region, a seal ring region surrounding the chip region, and a scribe region surroundingly defined around the seal ring region, the semiconductor structure including: a semiconductor chip in the chip region; and a molding compound disposed around the semiconductor chip and distributed in the chip region, the seal ring region and the scribe region; forming an insulating film over the chip region of the semiconductor structure and the seal ring region of the semiconductor structure; forming a seal ring over the seal ring region of the semiconductor structure and laterally adjacent to the insulating film, in which the seal ring has an exposed lateral surface facing away from the insulating film; and forming a protective layer that defines a substantially smooth and inclined lateral surface over the exposed lateral surface of the seal ring.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: A method of manufacturing a semiconductor device includes: receiving a semiconductor structure having a chip region, a seal ring region surrounding the chip region, and a scribe region surroundingly defined around the seal ring region, the semiconductor structure including: a semiconductor chip in the chip region; and a molding compound disposed around the semiconductor chip and distributed in the chip region, the seal ring region and the scribe region; forming an insulating film over the chip region of the semiconductor structure and the seal ring region of the semiconductor structure; forming a seal ring over the seal ring region of the semiconductor structure and laterally adjacent to the insulating film, in which the seal ring has an exposed lateral surface facing away from the insulating film; and forming a protective layer that defines a substantially smooth and inclined lateral surface over the exposed lateral surface of the seal ring.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: An electric coupler includes a body, a first electrical path through the body having a first resistance to electric current within a first frequency range and a second electrical path through the body having a second resistance to electric current within a second frequency range.

Abstract: A cascade CO2 refrigeration system includes a medium temperature loop for circulating a medium refrigerant and a low temperature loop for circulating a CO2 refrigerant. The medium temperature loop includes a heat exchanger having a first side and a second side. The first side evaporates the medium temperature refrigerant. The low temperature loop includes a discharge header for circulating the CO2 refrigerant through the second side of the heat exchanger to condense the CO2 refrigerant, a liquid-vapor separator collects liquid CO2 refrigerant and directs vapor CO2 refrigerant to the second side of the heat exchanger. A liquid CO2 supply header receives liquid CO2 refrigerant from the liquid-vapor separator. Medium temperature loads receive liquid CO2 refrigerant from the liquid supply header for use as a liquid coolant at a medium temperature. An expansion device expands liquid CO2 refrigerant from the liquid supply header into a low temperature liquid-vapor mixture for use by the low temperature loads.

Abstract: An electrical device comprises indicators used to indicate the operating status of the electrical device and/or the presence of hazardous voltage within the electrical device cabinet. The indicators comprise a lighting strip mounted on the outside of the device. The lighting strip can display different colors and/or flash according to the actual status of the electrical device.

Abstract: A towel includes a towel body having four corners and each corner has an L-shaped reinforcement rib connected to two sides of each corner. The density of each of the L-shaped reinforcement ribs is larger than that of the towel body. Each corner has a hole defined therethrough and located close to the reinforcement portion. Each hole has a reinforcement portion connected to the inner periphery thereof. The holes are respectively located at corners of the towel body or at positions close to sides of the towel body.

Abstract: A cascade CO2 refrigeration system includes a medium temperature loop for circulating a medium refrigerant and a low temperature loop for circulating a CO2 refrigerant. The medium temperature loop includes a heat exchanger having a first side and a second side. The first side evaporates the medium temperature refrigerant. The low temperature loop includes a discharge header for circulating the CO2 refrigerant through the second side of the heat exchanger to condense the CO2 refrigerant, a liquid-vapor separator collects liquid CO2 refrigerant and directs vapor CO2 refrigerant to the second side of the heat exchanger. A liquid CO2 supply header receives liquid CO2 refrigerant from the liquid-vapor separator. Medium temperature loads receive liquid CO2 refrigerant from the liquid supply header for use as a liquid coolant at a medium temperature. An expansion device expands liquid CO2 refrigerant from the liquid supply header into a low temperature liquid-vapor mixture for use by the low temperature loads.

Abstract: A cascade CO2 refrigeration system includes a medium temperature loop for circulating a medium refrigerant and a low temperature loop for circulating a CO2 refrigerant. The medium temperature loop includes a heat exchanger having a first side and a second side. The first side evaporates the medium temperature refrigerant. The low temperature loop includes a discharge header for circulating the CO2 refrigerant through the second side of the heat exchanger to condense the CO2 refrigerant, a liquid-vapor separator collects liquid CO2 refrigerant and directs vapor CO2 refrigerant to the second side of the heat exchanger. A liquid CO2 supply header receives liquid CO2 refrigerant from the liquid-vapor separator. Medium temperature loads receive liquid CO2 refrigerant from the liquid supply header for use as a liquid coolant at a medium temperature. An expansion device expands liquid CO2 refrigerant from the liquid supply header into a low temperature liquid-vapor mixture for use by the low temperature loads.

Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.