Abstract: Disclosed are a heat-electricity discrete power module with two-way heat-dissipation ceramic substrates and a manufacturing method of the same, including: two double-sided metal-clad ceramic substrates, a power transistor die, and an insulation sealant; each double-sided metal-clad ceramic substrate including a ceramic insulation layer, a three-dimensional conductive layer formed on the first ceramic insulation layer and facing the opposite three-dimensional conductive layer to constitute an electrical circuit, and a thermally-conductive metallic layer opposite and insulated from the three-dimensional conductive layer, respectively; electrodes of each power transistor die are electrically conductively connected to the three-dimensional conductive layer, and their upper and lower surfaces are thermally conductively connected to respective three-dimensional conductive layers; circuit components are additionally mounted on the three-dimensional conductive layers; at least one conductive post is formed between th

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to implement seamless switching of dynamic range and/or refresh rate on display devices. An example apparatus disclosed herein causes a display to activate panel self refresh after a command to switch a graphics output from a first dynamic range to a second dynamic range, the graphics output provided to the display. The example apparatus also switches the graphics output from the first dynamic range to the second dynamic range after the panel self refresh is activated. The example apparatus further causes the display to deactivate the panel self refresh after the graphics output is switched to the second dynamic range.

Abstract: A photovoltaic cell is provided, which includes: a substrate; a tunnel oxide layer and a doping conductive layer sequentially disposed on a first surface of the substrate in a direction away from the substrate, wherein the tunnel oxide layer includes nitrogen and phosphorus; a doping surface field disposed in the substrate, wherein the doping surface field is in contact with a side of the tunnel oxide layer facing the substrate, the doping surface field includes a doping element of a same conductivity type as a doping element in the substrate, and a doping concentration on a side of the doping surface field facing the tunnel oxide layer is greater than a doping concentration on a side of the doping surface field away from the tunnel oxide layer; and a metal electrode electrically connected to the doping conductive layer.

Abstract: The disclosure provides a resin composition, a substrate, and a copper clad laminate, wherein the resin composition includes a naphthalene ring epoxy resin, a bismaleimide resin, a crosslinking agent, polysiloxane, an accelerator, and a filler.

Abstract: An electronic device includes a first base, a plurality of electrodes, a plurality of traces, an insulating layer, a second base and an electrochromic layer. The electrodes are disposed on the first base. Each electrode includes a mesh conductive pattern and a transparent conductive pattern. The mesh conductive pattern has a plurality of mesh lines and a plurality of meshes defined by the mesh lines. The transparent conductive pattern covers the mesh lines and the meshes, and is electrically connected to the mesh conductive pattern. The traces are disposed on the first base, and are electrically connected to the electrodes respectively. The insulating layer is disposed on the first base, and at least covers the traces. The second base is disposed opposite to the first base.

Abstract: The present disclosure relates to an integrated chip. The integrated chip comprises a dielectric layer over a substrate. A first metal feature is over the dielectric layer. A second metal feature is over the dielectric layer and is laterally adjacent to the first metal feature. A first dielectric liner segment extends laterally between the first metal feature and the second metal feature along an upper surface of the dielectric layer. The first dielectric liner segment extends continuously from along the upper surface of the dielectric layer, to along a sidewall of the first metal feature that faces the second metal feature, and to along a sidewall of the second metal feature that faces the first metal feature. A first cavity is laterally between sidewalls of the first dielectric liner segment and is above an upper surface of the first dielectric liner segment.

Abstract: A modified polyethylene terephthalate copolyester, including three fragments shown as [Fragment 1], [Fragment 2], and [Fragment 3] in the specification, is provided.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first substrate comprising a first semiconductor material. A first light sensor is disposed within the first substrate. The first light sensor is configured to absorb electromagnetic radiation within a first wavelength range. A second light sensor is disposed within an absorption structure underlying the first substrate. The second light sensor is configured to absorb electromagnetic radiation within a second wavelength range different from the first wavelength range. The absorption structure underlies the first light sensor and comprises a second semiconductor material different from the first semiconductor material.

Abstract: The method includes receiving a semiconductor device having a first surface and a second surface. The first surface is a top surface including a conductive material exposed thereon; and the second surface is an embedded surface including the conductive material and a dielectric material. The method also includes selecting a first polishing slurry to achieve a first polishing rate of the conductive material in the first polishing slurry and a second polishing rate of the dielectric material in the first polishing slurry. The method further includes selecting a second polishing slurry to achieve a third polishing rate of the conductive material in the second polishing slurry and a fourth polishing rate of the dielectric material in the second polishing slurry. The method additionally includes polishing the first surface with the first polishing slurry until the second surface is exposed; and polishing the second surface with the second polishing slurry.

Abstract: A high-strength ring groove rivet includes a gun head assembly, a driving mechanism, a transmission mechanism, a power source and a control module arranged in a riveting tool shell. The transmission mechanism has a planetary roller lead screw shaft in coaxial driving connection with the clamping jaw of the gun head assembly, and is also in driving connection with the driving shaft of the driving mechanism through gears installed on the planetary roller lead screw shaft and the driving shaft of the driving mechanism respectively. The planetary roller lead screw is adopted as a component for converting rotary motion into linear motion, the output tension can reach 70 kN, and riveting installation of ring groove rivets with the diameter specification of 12 mm can be effectively completed.

Abstract: A preparation method of a modified bismaleimide resin includes the following steps. Maleic anhydride is mixed with a bisamine compound to obtain a corresponding mixture. The mixture is heated. The bisamine compound has a main chain structure or fragment represented by Formula A, Formula B, or Formula C as described in the description.

Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.

Abstract: A complex ionic compound includes a carrier, a bridging agent, and an adsorbent. The bridging agent is grafted to the carrier, and the adsorbent is grafted to the bridging agent.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: Disclosed is a resin composition including a resin. The resin includes a benzoxazine resin, an epoxy resin, and a modified maleimide resin. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by performing a nitration and a hydrogenation to a dicyclopentadiene phenolic resin.

Abstract: A funnel storage device is provided, wherein the funnel storage device includes: a tubular member including a first end portion and a second end portion; a receiving member connected to the first end portion, in communication with an interior of the tubular member, and tapering in a direction toward the first end portion; and a base connected to the second end portion, not in communication with the interior of the tubular member, and expanding in a direction away from the second end portion.

Abstract: The disclosure provides a resin composition, which includes 30 wt % to 50 wt % of a bismaleimide resin; 1 wt % to 10 wt % of an epoxy resin; 1 wt % to 10 wt % of a benzoxazine resin; 1 wt % to 5 wt % of a hardener; 10 wt % to 40 wt % of a filler; and 0.1 wt % to 3 wt % of a coupling agent, based on a total weight of the resin composition.

Abstract: The disclosure provides a resin composition, which includes 30 wt % to 60 wt % of a bismaleimide resin; 1 wt % to 10 wt % of a liquid rubber resin; and 20 wt % to 50 wt % of a filler, based on a total weight of the resin composition.

Abstract: A display device and a backlight control method of the display device are provided. When a duration of an image occlusion period is shorter than a preset duration, a backlight driving circuit is controlled to respectively provide a first pulse current and a second pulse current in a first light emitting period and a second light emitting period in each frame period, so as to drive a backlight unit to provide a first backlight and a second backlight. Here, the first pulse current is greater than the second pulse current.