Abstract: A preparation method of a modified bismaleimide resin includes the following steps. Maleic anhydride is mixed with a bisamine compound to obtain a corresponding mixture. The mixture is heated. The bisamine compound has a main chain structure or fragment represented by Formula A, Formula B, or Formula C as described in the description.

Abstract: A high-strength ring groove rivet includes a gun head assembly, a driving mechanism, a transmission mechanism, a power source and a control module arranged in a riveting tool shell. The transmission mechanism has a planetary roller lead screw shaft in coaxial driving connection with the clamping jaw of the gun head assembly, and is also in driving connection with the driving shaft of the driving mechanism through gears installed on the planetary roller lead screw shaft and the driving shaft of the driving mechanism respectively. The planetary roller lead screw is adopted as a component for converting rotary motion into linear motion, the output tension can reach 70 kN, and riveting installation of ring groove rivets with the diameter specification of 12 mm can be effectively completed.

Abstract: A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.

Abstract: A funnel storage device is provided, wherein the funnel storage device includes: a tubular member including a first end portion and a second end portion; a receiving member connected to the first end portion, in communication with an interior of the tubular member, and tapering in a direction toward the first end portion; and a base connected to the second end portion, not in communication with the interior of the tubular member, and expanding in a direction away from the second end portion.

Abstract: A complex ionic compound includes a carrier, a bridging agent, and an adsorbent. The bridging agent is grafted to the carrier, and the adsorbent is grafted to the bridging agent.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: Disclosed is a resin composition including a resin. The resin includes a benzoxazine resin, an epoxy resin, and a modified maleimide resin. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by performing a nitration and a hydrogenation to a dicyclopentadiene phenolic resin.

Abstract: The disclosure provides a resin composition, which includes 30 wt % to 60 wt % of a bismaleimide resin; 1 wt % to 10 wt % of a liquid rubber resin; and 20 wt % to 50 wt % of a filler, based on a total weight of the resin composition.

Abstract: The disclosure provides a resin composition, which includes 30 wt % to 50 wt % of a bismaleimide resin; 1 wt % to 10 wt % of an epoxy resin; 1 wt % to 10 wt % of a benzoxazine resin; 1 wt % to 5 wt % of a hardener; 10 wt % to 40 wt % of a filler; and 0.1 wt % to 3 wt % of a coupling agent, based on a total weight of the resin composition.

Abstract: A display device and a backlight control method of the display device are provided. When a duration of an image occlusion period is shorter than a preset duration, a backlight driving circuit is controlled to respectively provide a first pulse current and a second pulse current in a first light emitting period and a second light emitting period in each frame period, so as to drive a backlight unit to provide a first backlight and a second backlight. Here, the first pulse current is greater than the second pulse current.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: Disclosed is an electronic assembly that includes a heat sink with a groove that is cut on a surface of the heat sink. A thermal interface material is disposed between the heat sink and an electronic device. A compressible filler disposed in the groove surrounds and confines the thermal interface material.

Abstract: A transparent display apparatus includes a first transparent substrate, first to third light-emitting elements, and a first frequency band blocking filter. The first transparent substrate has a first display area and a first transparent area outside the first display area. The first to third light-emitting elements are disposed at the first display area and respectively used for emitting first to third color lights. The first frequency band blocking filter is disposed on a transmission path of the first to third color lights. The first frequency band blocking filter has first to third blocking bands respectively corresponding to the first to third color lights. FWHM of the first to third blocking bands fall in a range of 15 nm to 55 nm.

Abstract: The present disclosure provides a storage control method, including: sending a command acquisition request for at least one first queue, where the at least one first queue is a queue among a plurality of queues which accumulates at least one queue request message, and a command acquisition request for each first queue of the at least one first queue corresponds to all accumulated queue request messages of the first queue; and receiving a storage command for each first queue in the at least one first queue.

Abstract: An integrated circuit (IC) with conductive structures and a method of fabricating the IC are disclosed. The method includes depositing a first dielectric layer on a semiconductor device, forming a conductive structure in the first dielectric layer, removing a portion of the first dielectric layer to expose a sidewall of the conductive structure, forming a barrier structure surrounding the sidewall of the conductive structure, depositing a conductive layer on the barrier structure, and performing a polishing process on the barrier structure and the conductive layer.

Abstract: A flying probe includes a test module and a processor. The test module measures a plurality of delta capacitances associated with a plurality of vias in a printed circuit board. The plurality of vias include first, second, third and fourth vias. Each different delta capacitance is measured between a different pair of the vias. The processor compares all the delta capacitances to a threshold value. In response to multiple delta capacitances associated with the first via being greater than or equal to the threshold value, the processor detects a possible via stripping issue for the first via.

Abstract: A fluid filling device is provided, including: a covering unit, a quick-connecting unit and a base. The covering unit is configured to cover an opening portion. The covering unit includes a first flow channel, and the first flow channel is configured to be communicated with an interior of the opening portion. The quick-connecting unit is disposed on the covering unit and communicated with the first flow channel. The base includes at least one joint, a second flow channel and a connection portion. The at least one joint is configured to be assembled with at least one pipe. The second flow channel is communicated respectively with the at least one joint and the connection portion. The connection portion is detachably and communicatedly connected with the quick-connecting unit.