Abstract: A loudspeaker mounting structure includes a case, a first cover, a second cover and a limiting module. The case is recessed inwardly with a groove. The first cover and the second cover are disposed on the upper surface and the lower surface of the case. The case, the first cover and the second cover form an accommodation cavity where a loudspeaker is mounted. The limiting module is disposed in the groove and includes a stud and a limiting component rotatably connected to the stud.

Abstract: A method for cyclic biochemical conversion of carbon dioxide and hot gas cogeneration in depleted oil and gas reservoirs includes: S1: selecting a target depleted oil and gas reservoir; S2: adjusting a temperature of the target depleted oil and gas reservoir to 30° C. to 70° C. and detecting whether formation water of the target depleted oil and gas reservoir contains methanogenic archaea, in which if no methanogenic archaeon is contained, then methanogenic archaea is injected and step S3 is proceeded, and if methanogenic archaea are contained, then step S3 is proceeded directly; S3: injecting a mixture of carbon dioxide and hydrogen into the target depleted oil and gas reservoir through a gas injection well; and S4: shutting down the gas injection well to wait for the methanogenic archaea to convert carbon dioxide and hydrogen into methane and exploiting the methane and heat energy in the target depleted oil and gas reservoir.

Abstract: A method for performing access management of a memory device in a predetermined communications architecture with aid of automatic parameter setting and associated apparatus are provided. The method includes: utilizing the memory controller to set at least one write booster static parameter of a write booster function of the memory device; utilizing the memory controller to perform device initialization corresponding to at least one initialization phase of the memory device; and after completing the device initialization corresponding to the at least one initialization phase, performing at least one adaptive flag-setting operation, for setting at least one write booster flag among a plurality of write booster flags of the write booster function, wherein the at least one write booster flag includes a first write booster flag acting as a write booster switch. The adaptive flag-setting operation includes setting the first write booster flag to enable the write booster function by default.

Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.

Abstract: A display device includes a flexible display panel having two surfaces opposite to each other, and a heat dissipation sheet disposed on one of the two surfaces of the flexible display panel and being foldable together with the flexible display panel. In a side view, the heat dissipation sheet includes at least one opening.

Abstract: An image compensation circuit for an image sensor includes a gain amplifier, a compensation control circuit, a memory and a digital-to-analog converter (DAC). The gain amplifier is used for receiving a plurality of image signals from the image sensor and amplifying the plurality of image signals. The compensation control circuit is used for generating a plurality of compensation values for the plurality of image signals. The memory, coupled to the compensation control circuit, is used for storing the plurality of compensation values. The DAC, coupled to the memory and the gain amplifier, is used for converting the plurality of compensation values into a plurality of compensation voltages, respectively, to compensate the plurality of image signals with the plurality of compensation voltages.

Abstract: The present disclosure provides an electronic device including a flexible substrate, an electronic unit, and a cover. The flexible substrate has a first portion and a second portion. The electronic unit is disposed on the flexible substrate. The cover is disposed on the electronic unit and includes a first layer. The first layer is retreated from an edge of the first portion by a first distance and retreated from an edge of the second portion by a second distance, and the second distance is different from the first distance.

Abstract: A rollable electronic device with a rollable axis includes a base layer, an insulating layer, and one or more electronic units. The insulating layer is disposed on the base layer and includes a plurality of first trenches. The first trenches have a first longitudinal direction parallel to the rollable axis. The one or more electronic units are disposed on the insulating layer. In a top view, at least one of the electronic units is disposed between two adjacent first trenches of the first trenches, and the two adjacent first trenches are overlapped with each other along a direction perpendicular to the first longitudinal direction.

Abstract: A display device includes a display panel including a rollable portion and a non-rollable portion. The display panel includes a supporting structure including a groove disposed on a first side of the supporting structure, a substrate disposed on a second side of the supporting structure and the first side opposite to the second side, and a circuit board fixed onto a back of the display panel. The non-rollable portion has a first region. A first region of the circuit board is joined to the first region of the non-rollable portion. The non-rollable portion has a first end and a second end. The first end is connected to the rollable portion. The second end is connected to the circuit board.

Abstract: An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.

Abstract: Systems and techniques are described herein for generating image content. For instance, an apparatus for generating image content is provided. The method may include a user interface configured to: display an image of a field of view; and receive a user input indicative of a desired change to the image, wherein the desired change to the image comprises a change to the field of view; and at least one processor configured to: provide at least part of the image and an indication of the desired change as inputs to a generative machine-learning model; obtain an altered image from the generative machine-learning model, wherein the altered image comprises at least part of the image of the field of view and generated pixels outside of the field of view.

Abstract: An electronic device including an electronic module, an inflator and an airbag is disclosed. The airbag is configured to be inflated by a gas produced by the inflator. The electronic module is disposed on the airbag and includes a first surface, a corner connecting with the first surface and a second surface opposite to the first surface. When the airbag is not inflated by the gas, at least a portion of the second surface is disposed between the first surface and the air bag, and the electronic module is at least partially overlapped with the airbag and not overlapped with the inflator in a top-view direction of the electronic module. When the airbag is inflated by the gas, the airbag contacts the corner of the electronic module, and the airbag at least partially contacts the first surface of the electronic module in the top-view direction of the electronic module.

Abstract: An electronic device including a flexible substrate, a plurality of electronic components, and a first driving unit is provided. The flexible substrate includes a surface having a first region and a second region. The first region has a Gaussian curvature of 0 and the second region has a non-zero Gaussian curvature. The plurality of electronic components are disposed on the flexible substrate. The first driving unit is disposed on the first region of the flexible substrate. One of the plurality of electronic components located on the second region of the flexible substrate is driven by the first driving unit.

Abstract: A method of making a mouse pad contains: bonding and hot-press molding a body and a cloth by using a first mold and a second mold. The body is made of polyurethane (PU), the second mold includes a cavity, and a size of the cavity of the second mold is equal to a predetermined size of the body, and a guide rib surrounds the cavity. The method comprising steps of: 1) flattening the body; 2) bonding the cloth on the body; 3) cutting the body in a predetermined; 4) hot-press molding the body and the cloth; 5) sublimation printing; and 6) hot-press molding to trim the mouse pad by using the first mold and of the guide rib the second mold.

Abstract: An image sensor includes a sensor layer and a color filter layer disposed on the sensor layer. The image sensor further includes a lens layer disposed on the color filter layer. The lens layer includes a plurality of micro lenses. The image sensor further includes a first cut filter layer disposed over the lens layer. The first surface of the first cut filter layer has a plurality of first protrusions.

Abstract: An electronic device includes an insulating layer, a first conductive portion, a second conductive portion, a connective portion, a processing unit and an electronic element. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer. The connective portion is at least partially disposed in the insulating layer. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion. The thickness of the processing unit is greater than the thickness of the first conductive portion.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: An electronic device including a panel and an actuator is disclosed. The panel includes a first substrate, a second substrate and a plurality of light-emitting elements. The second substrate is disposed on the first substrate, and the second substrate includes a plurality of main portions and a plurality of openings. The plurality of light-emitting elements are disposed on the plurality of main portions of the second substrate. The first substrate is disposed between the actuator and the second substrate. In a deformation mode, the panel is deformed by the actuator.