Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.

Abstract: The present invention relates to a cooling fin assembly suitable for heat sinks. In one embodiment, the cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Each of the engaging members including a roll piece (15a) with an elongated hole (16a) defined therein and a connecting piece (17a) with an engaging piece (18a) extending therefrom. In assembly of the cooling fins, the engaging pieces of each of the cooling fins engage in the corresponding holes of the roll pieces of an adjacent cooling fin to thereby fasten and join the cooling fins with one another.

Abstract: A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.

Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.

Abstract: A heat sink assembly includes a heat sink (80), a pair of fixing devices (40), a pair of clips (20), and a fan (90). Each clip includes a main body (24), and an operating arm (22) pivotally attached to the main body. The main body has two locking arms (246) each forming a slanted guiding portion (248) and a hook (249). Each fixing device has a top plate (42) for securing the fan thereon, and a support plate (46) for supporting the clips. A pair of tabs (49) and a pair of tongues (492) is formed at each of opposite ends of each fixing device, and defines a through hole (494) for receiving a corresponding locking arm. When the operating arm is rotated to raise the main body, the tongues guide the guiding portions and cause the hooks to tightly engage in locking holes (62) of a retention module (60).

Abstract: A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the base, and a protective cover firmly disposed around the base of the core. An offset exists between the bottom face of the cover and the spread area of the medium.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: The present invention relates to compositions and methods for releasing nucleic acid molecules from solid matrices. The invention further relates to compositions and methods for purifying and isolating nucleic acid molecules from biological materials such as animal tissues and plant matter. The methods of the invention can be readily adapted for rapid processing of multiple samples. Thus, the invention further provides automated methods for the purification of nucleic acid molecules from numerous samples. The invention also relates to kits for removing nucleic acid molecules from solid matrices.

Abstract: The present invention relates to compositions and methods for releasing nucleic acid molecules from solid matrices. The invention further relates to compositions and methods for purifying and isolating nucleic acid molecules from biological materials such as animal tissues and plant matter. The methods of the invention can be readily adapted for rapid processing of multiple samples. Thus, the invention further provides automated methods for the purification of nucleic acid molecules from numerous samples. The invention also relates to kits for removing nucleic acid molecules from solid matrices.

Abstract: A heat sink assembly includes a heat sink (80), a pair of fixing devices (40), a pair of clips (20), and a fan (90). Each clip includes a main body (24), and an operating arm (22) pivotally attached to the main body. The main body has two locking arms (246) each forming a slanted guiding portion (248) and a hook (249). Each fixing device has a top plate (42) for securing the fan thereon, and a support plate (46) for supporting the clips. A pair of tabs (49) and a pair of tongues (492) is formed at each of opposite ends of each fixing device, and defines a through hole (494) for receiving a corresponding locking arm. When the operating arm is rotated to raise the main body, the tongues guide the guiding portions and cause the hooks to tightly engage in locking holes (62) of a retention module (60).

Abstract: A biomaterial is rendered storage stable by being incorporated into a water-soluble or swellable non-glass-forming composition which can be stored at ambient temperatures.

Abstract: The present invention relates to compositions and methods for releasing nucleic acid molecules from solid matrices. The invention further relates to compositions and methods for purifying and isolating nucleic acid molecules from biological materials such as animal tissues and plant matter. The methods of the invention can be readily adapted for rapid processing of multiple samples. Thus, the invention further provides automated methods for the purification of nucleic acid molecules from numerous samples. The invention also relates to kits for removing nucleic acid molecules from solid matrices.