Abstract: A heat sink includes a heat pipe having a hollow body with an airtight chamber defined therein, and a quantity of working fluid contained in the chamber. The heat sink further includes a plurality of fins integrally formed with the heat pipe and extending outwards from an outer surface of the body. A skiving is performed to a metal pipe to obtain the hollow body and the fins integrally extending from the hollow body. Accordingly, there is no interface heat resistance between the fins and the hollow body.

Abstract: A fastener, for assembling a fan to a bracket, includes a shaft, and an expanding head extending from an end of the shaft. The shaft has a bulge formed at an opposite end thereof. A handle extends from the bulge of the shaft. The handle is used for facilitating an operator to manipulate the fastener to secure the fan and the bracket together. By pulling the handle of the fastener, the shaft of the fastener extends through the fan and the bracket to reach a position where the head and the bulge of the shaft of the fastener tightly sandwich the fan and the bracket therebetween.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.

Abstract: A clip assembly includes a bolt, a sleeve, and a resilient component held between the bolt and the sleeve. The bolt includes a head formed at an end thereof, an engaging portion formed at an opposite end thereof, and an engaging structure located between the head and the engaging portion. The sleeve includes a hollow body having an engaging structure. When the bolt is inserted into the body of the sleeve along a first direction, the engaging structure of the bolt engages with the engaging structure of the sleeve to block the bolt from escaping from the sleeve along a second direction opposite to the first direction. The resilient component is adapted to exert a force on the bolt to cause the bolt to have a tendency to move along the second direction.

Abstract: A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe (220) transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Abstract: A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base (12), a cover (14) and a plurality of heat dissipating fins (16) sandwiched between the base and the cover. The second heat sink comprises a plurality of cooling fins (22). Each heat pipe comprises three portions, respectively orderly sandwiched between the base and the heat dissipating fins, sandwiched between the cover and the heat dissipating fins and thermally extending in the cooling fins.

Abstract: A heat dissipation device includes a heat sink (10) and a heat capacitor (20). The heat sink includes a base (12) attachable with a heat-generating electronic component (30) and a fin assembly (14) extending from the base. The fin assembly includes two supports (140) and each support has a plurality of first fins (142) parallel to the base and a plurality of second fins (144) perpendicular to the base. The heat capacitor includes a sealed container (22) made of a material with a heat conductivity and a heat-storing material (24) made of a phase-change thermal interface material to absorb heat generated by the heat-generating electronic component. The heat-storing material changes from solid state to liquid state upon absorbing the heat from the heat-generating electronic component.

Abstract: A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing therethrough. The fan and the channels of the first fins corporately define an enhanced airflow path which is isolated from the channels of the second and third fins so that the fan entirely impels an airflow generated by the fan to pass through the channels of the first fins. The first fins are located corresponding to a portion of a bottom surface of a base for contacting with a heat-generating electronic component.

Abstract: A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting device and communicates the fan with the fin set and the fan with a space above a top of the fin set. The cover has a rearwards expanding port for guiding an airflow generated by a system fan to flow through the fin set. A top wall of the cover has a void to expose a portion of the top of the fin set.

Abstract: A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the base. The condensing section of the heat pipe departs from the base. The fins are stacked on the heat pipe and the reinforcing member. Therefore, the heat dissipation device has steady configuration and low cost.

Abstract: A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate and pass through the motherboard. The rings engage with the posts respectively and elastically abut against an upside of the motherboard.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: A heat sink includes a base (10) and heat pipes (20). The base includes a bottom surface contacting with a heat-generating electronic component (100), an upper surface defining grooves (12) receiving the heat pipes therein. Evaporating sections (22) of the heat pipes are located near a first end portion (10a) and condensing sections (24) of the heat pipes are located near a second end portion (10b) of the base. A first fin assembly (30) is mounted on the upper surface and a second fin assembly (40) is mounted on the bottom surface of the base near the second end portion thereof. A fan (200) is located near the second end portion of the base.

Abstract: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

Abstract: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

Abstract: A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of spaced fins, a first end and a second end opposite to the first end. Pluralities of passages are defined between the fins and extending from the first end to the second end of the fin set. Each of the fins has a plurality of louvers defined therein and a plurality of tabs each extending along a side of each of the louvers from each of the fins. The louvers of the fins communicate with the passages between the fins. The tabs of each of the fins extend toward corresponding louvers of the adjacent fin. The passages communicate with ambient air at the first end and the second end of the fin set.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10?) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

Abstract: A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat pipes (32, 36) received in the grooves, each heat pipe comprising an evaporating section (322, 362) and a condensing section (324, 364) respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.

Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.