Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.

Abstract: The present application discloses a semiconductor device with a protruding contact and a method for fabricating the semiconductor device with the protruding contact. The semiconductor device includes a substrate, a capacitor contact structure protruding from the substrate, and a landing pad layer covering a portion of a top surface of the capacitor contact structure and an upper portion of a sidewall of the capacitor contact structure.

Abstract: In this application, a manner of generating a modulated field STF is enriched, so that a manner of generating a PPDU is enriched, thereby improving data transmission flexibility. The method includes: After generating a PPDU, a transmit end sends the PPDU to at least one receive end, where the PPDU includes at least one modulated field STF, the modulated field STF includes a plurality of zero elements and a plurality of non-zero elements, m1 zero elements are included before a first non-zero element, m2 zero elements are included after a last non-zero element, m1+m2 zero elements are included between any two adjacent non-zero elements, m1 and m2 both are positive integers, and the modulated field STF is mapped to a plurality of consecutive subcarriers for transmission. This application is used for data transmission.

Abstract: A smoke removal device includes a connecting tube, a burner, and a plurality of heat storage meshes. The connecting tube has an inlet end and an outlet end. The burner is disposed in the connecting tube and has a flame outlet. The heat storage meshes are sequentially disposed between the flame outlet and the outlet end. The heat storage meshes includes a first heat storage mesh and a second heat storage mesh. The first heat storage mesh is located between the second heat storage mesh and the flame outlet. A mesh-number of per unit area of the first heat storage mesh is larger than that of the second heat storage mesh. The first heat storage mesh and the second heat storage mesh could slow down a flow rate of flame to increase temperatures of the heat storage meshes. The smoke is burned off once touching the heat storage meshes.

Abstract: The disclosure describes various aspects of a cryogenic trapped-ion system. In an aspect, a method is described that includes bringing a chain of ions in a trap at a cryogenic temperature, the trap being a micro-fabricated trap, and performing quantum computations, simulations, or both using the chain of ions in the trap at the cryogenic temperature. In another aspect, a method is described that includes establishing a zig-zag ion chain in the cryogenic trapped-ion system, detecting a change in a configuration of the zig-zag ion chain, and determining a measurement of the pressure based on the detection in the change in configuration. In another aspect, a method is described that includes measuring a low frequency vibration, generating a control signal based on the measurement to adjust one or more optical components, and controlling the one or more optical components using the control signal.

Abstract: Embodiments of the present disclosure relate to an un-doped or low-doped epitaxial layer formed below the source/drain features. The un-doped or low-doped epitaxial layer protects the source/drain features from damage during replacement gate processes, and also prevent leakage currents in the mesa device. A semiconductor device is disclosed. The semiconductor device includes an epitaxial feature having a dopant of a first concentration, and a source/drain feature in contact with the epitaxial feature. The source/drain feature comprises the dopant of a second concentration, and the second concentration is higher than the first concentration.

Abstract: A method and device for implementing an FPGA-based large-scale radio frequency interference array correlator are provided. The method includes: obtaining the number of channels of data of a radio frequency interference array, and performing average division; calculating the total correlation of data group and the total correlation between the data group and other data groups respectively through corresponding correlation calculation modules, and performing an accumulation calculation in an integration period to complete the total correlation operation of the radio frequency interference array. By means of grouping division and time division multiplexing, the FPGA resource is effectively utilized, and the calculation process of FPGA is simplified. The new method is suitable for the operation process of the system with high parallelism and high real-time requirements, and provides a high-efficiency solution for the real-time calculation of massive data of the large-scale radio frequency interference array.

Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.

Abstract: Dialog system training techniques using a simulated user system are described. In one example, a simulated user system supports multiple agents. The dialog system, for instance, may be configured for use with an application (e.g., digital image editing application). The simulated user system may therefore simulate user actions involving both the application and the dialog system which may be used to train the dialog system. Additionally, the simulated user system is not limited to simulation of user interactions by a single input mode (e.g., natural language inputs), but also supports multimodal inputs.

Abstract: The present disclosure discloses a method and a device in a node for wireless communications. A first node receives a first signaling, the first signaling being used for indicating a first time unit format; and transmits first information and second information; herein, the first information is used for indicating a first symbol set and a second symbol set; the first symbol set and the second symbol set respectively comprise a positive integer number of multicarrier symbol(s); each multicarrier symbol in the first symbol set corresponds to first-type symbols in the first time unit format, while each multicarrier symbol in the second symbol set corresponds to second-type symbols in the first time unit format; each of the first-type symbols comprises (a) downlink symbol(s), while each of the second-type symbols comprises (an) uplink symbol(s). The present disclosure expands access to transmission resources for sidelink.

Abstract: Provided is an access selection method. The method includes the following steps: a first transmission node receives configuration information of one of a parent node or a neighboring cell, and the first transmission node performs a measurement, monitoring, or a selection on an accessed parent node according to the configuration information. Further provided is an access selection apparatus, an electronic apparatus and a storage medium.

Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.

Abstract: A method includes depositing a plurality of layers, which includes depositing a spin orbit coupling layer, depositing a dielectric layer over the spin orbit coupling layer, depositing a free layer over the dielectric layer, depositing a tunnel barrier layer over the free layer, and depositing a reference layer over the tunnel barrier layer. The method further includes performing a first patterning process to pattern the plurality of layers, and performing a second patterning process to pattern the reference layer, the tunnel barrier layer, the free layer, and the dielectric layer. The second patterning process stops on a top surface of the spin orbit coupling layer.

Abstract: A method for performing PDCCH monitoring of component carriers (CCs) in a carrier aggregation scheme that aggregates a first CC and a second CC. In some embodiments, the method includes: calculating a first monitoring occasion start time for a monitoring occasion of the first CC, wherein the first monitoring occasion start time is expressed as a first symbol-index value; calculating a second monitoring occasion start time for a monitoring occasion of the second CC, wherein the second monitoring occasion start time is expressed as a second symbol-index value; and generating a schedule for the monitoring occasion of the first CC and the monitoring occasion of the second CC based on an ascending order of the first monitoring occasion start time and the second monitoring occasion start time.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Abstract: A repair method of a memory includes dividing a plurality of general bits into a plurality of first groups and dividing a plurality of redundancy bits into a plurality of second groups. When one of the plurality of first groups has a defective bit, one of the plurality of second groups is selected to replace the first group which has the defective bit. Because the repair method uses a group as a repair unit, a repair circuit is simpler and smaller and a processing speed of the repair circuit is faster.

Abstract: A display device includes a first substrate, a first metal layer, a gate insulating layer, semiconductor channels, a second metal layer, a color filter layer, a shielding electrode, an insulating layer, pixel electrodes, a liquid crystal layer, a second substrate and a second common electrode. The first metal layer is located on the first substrate and includes scan lines, gates and first common electrodes. The gate insulating layer is located on the first metal layer. The semiconductor channels are located on the gate insulating layer. The second metal layer is located on the gate insulating layer, and includes sources, drains and data lines. The color filter layer is located on the second metal layer. The shielding electrode at least partially overlaps the second metal layer. The insulating layer is located on the color filter layer. The second common electrode is located on the second substrate.

Abstract: Provided are a polypeptide and nucleic acid for encoding the polypeptide, a nucleic-acid construct, an expression vector, and a host cell containing the nucleic acid, an antigen-presenting cell presenting the polypeptide on the surface of the cell, and immune effector cell thereof, a pharmaceutical composition containing the polypeptide, a vaccine containing the nucleic acid, the nucleic acid construct, the expression vector, the host cell, the antigen-presenting cell, and the immune effector cell, and an antibody recognizing the polypeptide. Also provided is a therapeutic method using the polypeptide, the nucleic acid, the pharmaceutical composition, the vaccine, and the antibody. Also provided are a diagnosis method and diagnosis apparatus for detecting the described polypeptide. Also provided is an application of the polypeptide in preparing a vaccine, a tumor diagnosis kit, or a pharmaceutical composition, and an application of the polypeptide or the nucleic acid as a test target in tumor diagnosis.