Abstract: A multi-chip package comprising an interconnection substrate; a first semiconductor IC chip over the interconnection substrate, wherein the first semiconductor IC chip comprises a first silicon substrate, a plurality of first metal vias passing through the first silicon substrate, a plurality of first transistors on a top surface of the first silicon substrate and a first interconnection scheme over the first silicon substrate, wherein the first interconnection scheme comprises a first interconnection metal layer over the first silicon substrate, a second interconnection metal layer over the first interconnection layer and the first silicon substrate and a first insulating dielectric layer over the first silicon substrate and between the first and second interconnection metal layers; a second semiconductor IC chip over and bonded to the first semiconductor IC chip; and a plurality of second metal vias over and coupling to the interconnection substrate, wherein the plurality of second metal vias are in a space

Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

Abstract: Implementations of semiconductor packages may include a die having a first side and a second side opposite the first side, a first metal layer coupled to the first side of the die, a tin layer coupled to the first metal layer, the first metal layer between the die and the tin layer, a backside metal layer coupled to the second side of the die, and a mold compound coupled to the die. The mold compound may cover a plurality of sidewalls of the first metal layer and a plurality of sidewalls of the tin layer and a surface of the mold compound is coplanar with a surface of the tin layer.

Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall is disposed above the first protrusion, and the second wall is disposed above the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.

Abstract: A bonding tool for bonding semiconductor dies to a semiconductor wafer is provided. The bonding tool includes a wafer chuck, an edge support, a hard plate, and a buffer layer. The wafer chuck carries the semiconductor wafer and the semiconductor dies placed on the semiconductor wafer. The edge support is disposed on the wafer chuck, the semiconductor wafer and the semiconductor dies are laterally surrounded by the edge support, and a top surface of the edge support substantially levels with surfaces of the semiconductor dies. The hard plate is movably disposed over the semiconductor dies, the edge support and the wafer chuck. The buffer layer is disposed on a bottom surface of the hard plate, and the buffer layer is in contact with the top surface of the edge support and the semiconductor dies when the hard plate moves towards the edge support.

Abstract: A patrol and inspection vehicle includes a vehicle body, distance measuring devices installed on front and rear sides of the vehicle body for detecting distances of ambient objects, a LiDAR sensor installed on the vehicle body for constructing a three-dimensional spatial model for positioning and navigation, a panoramic camera installed on the vehicle body for recognizing images of ambient individuals, and a gas detector installed on the vehicle body for detecting leaked gases having a temperature different from room temperature. The patrol and inspection vehicle can automatically inspect whether there are gas leaks in pipelines and detect if individuals have accidentally entered restricted areas, thereby reducing the manpower required for patrols and enhancing factory safety.

Abstract: The present application relates to a method for preventing a false triggering of a live streaming risk control, a device, and a product, the method includes responding to an instruction of starting a virtual live streaming, starting an e-commerce live streaming room on an e-commerce platform; obtaining a speech list from a speech server, the speech list including speech texts corresponding to business links of a same live streaming business process; generating a portrait oral video corresponding to each of the speech texts based on a template video, the template video having a preset required duration, and each image frame of the template video comprising a facial image collected based on a same person; implementing a virtual live streaming activity by pushing the portrait oral video corresponding to each speech text to the e-commerce live streaming room, according to the live streaming business process.

Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, a semiconductor package component having a semiconductor die bonded to the substrate, a lid attached to the substrate, and a first composite metal feature between the semiconductor package component and the lid. The first composite metal feature may include a first metal feature having a first material and a second metal feature having a second material. The first material may be an intermetallic compound. The second material may be different from the first material.

Abstract: Methods and systems are provided for sample preparation techniques and sequencing of macromolecular constituents of cells and other biological materials.

Abstract: A display system comprises a waveguide having light incoupling or light outcoupling optical elements formed of a metasurface. The metasurface is a multilevel (e.g., bi-level, tri-level, etc.) structure having a first level defined by spaced apart protrusions formed of a first optically transmissive material and a second optically transmissive material between the protrusions. The metasurface can also include a second level formed by the second optically transmissive material. The protrusions on the first level may be patterned by nanoimprinting the first optically transmissive material, and the second optically transmissive material may be deposited over and between the patterned protrusions. The widths of the protrusions and the spacing between the protrusions may be selected to diffract light, and a pitch of the protrusions may be 10-600 nm.

Abstract: A neural network point cloud data analyzing method includes a data input step and an analyzing step. In the data input step, a processor receives a point cloud data. In the analyzing step, the processor analyzes the point cloud data based on an enhanced VoxNet 3D model. The enhanced VoxNet 3D model includes an input layer, a first hidden unit, a first pooling layer, a 1st to a 3rd second hidden units, a second pooling layer, a third pooling layer and a fourth pooling layer. The input layer is for inputting the point cloud data. The first hidden unit is signally connected to the input layer. The first pooling layer receives an output from a first activation layer. The 1st to the 3rd second hidden units are sequentially connected after the first pooling layer.

Abstract: Provided herein are methods for identification of antigen binding molecules such as antibodies from a sample by exposing the antigen binding molecules to an antigen conjugated to an oligonucleotide.

Abstract: The disclosure relates to an electronic device, including a flexible substrate, a driving structure layer, a display structure layer and a touch layer. The flexible substrate includes an area and a main area adjacent to the area. The driving structure layer is disposed on the flexible substrate. The driving structure layer includes an insulating structure, and the insulating structure includes a plurality of recesses. The display structure layer is disposed on the driving structure layer. The touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the area of the flexible substrate. At least a part of the plurality of recesses is disposed on the area of the flexible substrate.

Abstract: A semiconductor memory device includes first and second memory units, and first and second staircase vias. The first memory unit includes two first source/bit line portions separated from each other, a first word line surrounding the first source/bit line portions, a first memory film surrounding the first word line, and a first channel region between the first memory film and the first source/bit line portions. The second memory unit is disposed over the first memory unit, and includes two second source/bit line portions separated from each other, a second word line surrounding the second source/bit line portions, a second memory film surrounding the second word line, and a second channel region between the second memory film and the second source/bit line portions. The first and second staircase vias respectively penetrate the first and second memory films, and are respectively and electrically connected to the first and second word lines.

Abstract: A duty cycle detector includes a current steering network configured to steer a first current into a second current to charge a first capacitor when a clock is in a first state, and to steer the first current into a third current to charge a second capacitor when the clock is in a second state; a first charge sharing switch configured to enable charge sharing between the first capacitor and a third capacitor when the clock is in the second state; a second charge sharing switch configured to enable charge sharing between the second capacitor and a fourth capacitor when the clock is in the first state; a first discharging network configured to discharge the first capacitor when the clock is in a first state; and a second discharging network configured to discharge the second capacitor when the clock is in a second state.

Abstract: A semiconductor device and method for fabricating a semiconductor device includes etch selectivity tuning to enlarge epitaxy process windows. Through modification of etching processes and careful selection of materials, improvements in semiconductor device yield and performance can be delivered. Etch selectivity is controlled by using dilute gas, using assistive etch chemicals, controlling a magnitude of bias power used in the etching process, and controlling an amount of passivation gas used in the etching process, among other approaches. A recess is formed in a dummy fin in a region of the semiconductor where epitaxial growth occurs to further enlarge the epitaxy process window.

Abstract: A method includes selecting one or more candidate installation positions in a bottom area below a central horizontal line of the refrigerant heat exchanger, determining one or more highest risk leakage points each corresponding to one of the one or more candidate installation positions and reflecting a refrigerant leakage position in the refrigerant heat exchanger with a lowest probability of being detected by the refrigerant sensor installed at the corresponding candidate installation position, calculating one or more leakage limit distances each corresponding to one of the one or more highest risk leakage points, determining a target highest risk leakage point corresponding to a target leakage limit distance that is a smallest one of the one or more leakage limit distances, determining a target installation position based at least on the target highest risk leakage point, and installing the refrigerant sensor at the target installation position.

Abstract: Error alert encoding for improved error mitigation is described. In one or more implementations, a system includes a processor configured to receive an encoded signal indicating a type of an error detected in a memory, and output one or more mitigation commands to mitigate the type of the error detected in the memory based on the encoded signal. In one or more implementations, a memory system includes a memory and a buffer. The buffer is configured to output an encoded signal indicating a type of an error detected in the memory.

Abstract: A severity estimation system for one or more occupants located in an interior cabin of a vehicle involved in a vehicle-related incident includes one or more microphones located within the interior cabin of the vehicle that capture audio-based inputs, an occupant monitoring system (OMS) that collects scene recognition inputs indicative of a status of the occupants, a restraint system that collects a plurality of restraint-based inputs indicative of one or more restraint-based mechanisms associated with an occupant of the vehicle being activated during the vehicle-related incident, a motion-based indicator system that collect the plurality of motion-based inputs indicative of the motion of the vehicle during the vehicle-related incident, and one or more controllers. The one or more controllers fuse together the audio-based indicator, the OMS indicator, the restraint-based indicator, and the motion-based indicator to determine an incident severity indicator corresponding to the one or more occupants.

Abstract: Disclosed are a SERS nano-particle, a preparation method therefor, and an application thereof to a method for distinguishing CTCs from WBCs. The SERS nano-particle are formed by core magnetic particles, noble metal nano-particles, Raman signal molecules, hydrophilic molecules and target molecules. A method for distinguishing CTCs from WBCs comprises: enabling a SERS nano-particle to make contact with a to-be-detected solution containing CTCs and/or WBCs; performing incubation; then detecting SERS signal intensity of a cell combined with the SERS nano-particle; setting SERS signal intensity threshold; if SERS signal intensity of the cell combined with the SERS nano-particle exceeds SERS signal intensity threshold, determining the cell as CTS; otherwise, determining the cell as WBC. A ROC curve is used for the first time to assist the SERS technique in distinguishing CTCs from WBCs.