Patents by Inventor Ling Chen

Ling Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925454
    Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 12, 2024
    Inventors: Chia-Chi Su, Hsiao-Pao Yen, Pei-Ling Hsu, Chia-Hung Chen
  • Patent number: 11927488
    Abstract: A thermal detection system is provided. The thermal detection system includes a thermal detector, an area indicating unit and a control unit. The thermal detector includes a thermal sensor array. The thermal detector is configured to detect thermal radiation within a detection area around the thermal detector. The detection area is defined by a field of view of the thermal sensor array. The area indicating unit is arranged to indicate a human-perceptible area according to the detection area. The human-perceptible area is located within the detection area and indicates a geometric form of the detection area. The control unit, coupled to the thermal detector and the area indicating unit, is configured to generate a thermal detection result according to the detected thermal radiation. The thermal detection system further includes a notification unit for overheat indication, a communication unit for wireless signal transmission, and a protection unit for overheat protection.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 12, 2024
    Inventor: Chia-Ling Chen
  • Publication number: 20240080901
    Abstract: Methods, systems, and devices for wireless communication are described. A user equipment (UE) may be configured with two subscriber identity modules (SIMs). The UE may select a synchronization beam associated with a random access occasion of a first SIM based on the random access occasion not overlapping in time with a reception opportunity (e.g., a paging occasion) of the second SIM. In some examples, the UE may select the synchronization beam based on an identified signal quality of the synchronization beam (e.g., in comparison to other available synchronization beams that are non-overlapping with the reception opportunity). The UE may perform a random access procedure (e.g., using the first SIM) during the random access occasion associated with the selected synchronization beam and, in some cases, may also monitor (e.g., using the second SIM) resources associated with the paging opportunity.
    Type: Application
    Filed: April 1, 2021
    Publication date: March 7, 2024
    Inventors: Kamalakar GANTI, Anindya MAJUMDER, Ammar KITABI, Jun HU, Ling XIE, Qingxin CHEN
  • Patent number: 11923358
    Abstract: A device comprises a first transistor, a second transistor, a first contact, and a second contact. The first transistor comprises a first gate structure, first source/drain regions on opposite sides of the first gate structure, and first gate spacers spacing the first gate structure apart from the first source/drain regions. The second transistor comprises a second gate structure, second source/drain regions on opposite sides of the second gate structure, and second gate spacers spacing the second gate structure apart from the second source/drain regions. The first contact forms a first contact interface with one of the first source/drain regions. The second contact forms a second contact interface with one of the second source/drain regions. An area ratio of the first contact interface to top surface the first source/drain region is greater than an area ratio of the second contact interface to top surface of the second source/drain region.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Pin Huang, Hou-Yu Chen, Chuan-Li Chen, Chih-Kuan Yu, Yao-Ling Huang
  • Patent number: 11925087
    Abstract: Provided are a display substrate, a preparation method thereof, and a display apparatus. The display substrate includes: a first display region and a second display region; the first display region includes a plurality of first pixels, the first pixel includes a passive light-emitting device, the second display region includes a plurality of second pixels, the second pixel includes an active light-emitting device and a pixel drive circuit electrically connected to the active light-emitting device. The first display region further includes a plurality of first cathode blockers, and the first cathode blocker includes at least one first groove, wherein the first cathode blocker is provided between at least two adjacent columns of first pixels, to make the cathodes of the two adjacent columns of first pixels disconnected.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: March 5, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Yipeng Chen, Ling Shi, Ke Liu, Zhenhua Zhang
  • Patent number: 11925067
    Abstract: Disclosed are a display panel and a display device. The display panel includes a base substrate including a plurality of sub-pixels, at least one of the plurality of sub-pixels including a pixel circuit; a first conductive layer located on a side, facing away from the base substrate, of a first insulating layer; a second insulating layer located on a side, facing away from the base substrate, of the first conductive layer; a second conductive layer located on a side, facing away from the base substrate, of the second insulating layer; a fourth insulating layer located on a side, facing away from the base substrate, of the second conductive layer; and a third conductive layer located on a side, facing away from the base substrate, of the fourth insulating layer, the third conductive layer including a plurality of data wires arranged at intervals.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: March 5, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Yang Yu, Yipeng Chen, Ling Shi, Jingquan Wang
  • Patent number: 11921543
    Abstract: A system and method of docking an information handling system to an intelligent wireless fan dock comprising a docking sensor to detect a docking event, a wireless module to establish a wireless link of the intelligent wireless fan dock with the docked information handling system upon detection of a docking event and to receive a dynamic fan speed request command to adjust extended fan cooling airflow from fan dock control system operating at the docked information handling system, where the fan dock control system has determined that the docked information handling system and the intelligent wireless fan dock pairing enables an increased performance mode and altered power draw limitations for the docked information handling system relative to the information handling system in an undocked state, and increasing the extended fan cooling airflow of a cooling fan based on the dynamic fan speed request command from the docked information handling system.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: March 5, 2024
    Assignee: Dell Products, LP
    Inventors: Lee-Ching Kuo, Hong Ling Chen, Hou Chun Wang, En-Yu Jen, Chen-Yu Lin
  • Patent number: 11921260
    Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, wherein the first, second, third, fourth, fifth, and sixth lenses are arranged in order from an object side to an image side along an optical axis. The first lens is a meniscus lens with positive refractive power and includes a convex surface facing the object side and a concave surface facing the image side. The second, third, and fourth lenses are with refractive power. The fifth lens is with positive refractive power and includes a convex surface facing the image side. The sixth lens is with negative refractive power and includes a concave surface facing the image side. The lens assembly satisfies: 3<D1/T6<9; wherein D1 is an effective optical diameter of the convex surface of the first lens and T6 is a thickness of the sixth lens.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: March 5, 2024
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Chien-Hung Chen, Hsi-Ling Chang
  • Patent number: 11921947
    Abstract: A touch function setting method is provided. The method comprising: receiving a sequence parameter which includes multiple clicks, each of the clicks is corresponding to one of areas of a touch panel or screen; receiving a function parameter corresponding to the sequence parameter, the function parameter is corresponding to activate a function; and storing a group of touch function parameters, which includes the sequence parameter and the function parameter.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: March 5, 2024
    Assignee: EGALAX_EMPIA TECHNOLOGY INC.
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Chia-Ling Sun, Jia-Ming Chen
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20240067591
    Abstract: Disclosed in the present disclosure are a method and system for producing hexafluoro-1,3-butadiene. It includes: under the action of a catalyst, chlorotrifluoroethylene reacting with hydrogen gas in a first reactor to obtain a mixture, the mixture entering a rectification apparatus, trifluoroethylene obtained by rectification entering a second reactor and reacting with bromine under light to obtain 1,2-dibromo-trifluoroethane; in a third reactor pre-loaded with the 1,2-dibromo-trifluoroethane, adding the 1,2-dibromo-trifluoroethane and solid alkali, and performing reaction to obtain bromotrifluoroethylene; and adding the bromotrifluoroethylene to a fourth reactor holding with zinc powder, an initiator and an organic solvent for reaction, so as to obtain a trifluoroethenyl zinc bromide solution, performing filtration, and then adding a coupling agent for a coupling reaction, so as to obtain hexafluoro-1,3-butadiene.
    Type: Application
    Filed: February 27, 2023
    Publication date: February 29, 2024
    Inventors: Wucan LIU, Haifeng WU, Ling LI, Hao CHENG, Jingtian ZHANG, Jiexun CHEN
  • Patent number: 11916017
    Abstract: An integrated circuit includes a plurality of horizontal conducting lines in a first connection layer, a plurality of gate-conductors below the first connection layer, a plurality of terminal-conductors below the first connection layer, and a via-connector directly connecting one of the horizontal conducting lines with one of the gate-conductors or with one of the terminal-conductors. The integrated circuit also includes a plurality of vertical conducting lines in a second connection layer above the first connection layer, and a plurality of pin-connectors for a circuit cell. A first pin-connector is directly connected between a first horizontal conducting line and a first vertical conducting line atop one of the gate-conductors. A second pin-connector is directly connected between a second horizontal conducting line and a second vertical conducting line atop a vertical boundary of the circuit cell.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Ling Chang, Chih-Liang Chen, Chia-Tien Wu, Guo-Huei Wu
  • Patent number: 11912619
    Abstract: A textured glass article includes: a body comprising an aluminosilicate glass comprising greater than or equal to 16 wt % Al2O3, the body having at least a first surface; and a plurality of polyhedral surface features extending from the first surface, each of the plurality of polyhedral surface features comprising a base on the first surface, a plurality of facets extending from the first surface, and a surface feature size at the base greater than or equal to 10 ?m and less than or equal to 350 ?m, wherein the plurality of facets of each polyhedral surface feature converge toward one another.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: February 27, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Xinyu Cao, Christine Cecala, Ling Chen, Wanghui Chen, Yuhui Jin, Cameron Robert Nelson, Jayantha Senawiratne, David Lee Weidman
  • Publication number: 20240061764
    Abstract: A computer implemented method for debugging computer instructions is provided. The method comprises using a number processors to receive a computer program, including a source code and generate a number of information records associated with a number of computer instructions in the source code, wherein at least one of the computer instructions comprises a function enclosed by a macro. The processors create a data structure based on the information records and generate an index of identifiers in the data structure based on debug information of the computer instructions, wherein the index comprises respective identifying entries for the computer instructions. The processors update information records according to the identifying entries in the data structure.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 22, 2024
    Inventors: Xiao Ling Chen, Qi Ye, Heng Wang, Qi Li, Navya Ramanjulu
  • Patent number: 11905775
    Abstract: A driving system for a core drilling rig has a driving motor. The driving motor has an outer rotor and an inner stator, and mutually-matched convex ribs are provided on the inner wall of the outer rotor and the outer wall of the inner stator. The outer rotor and the inner stator are in clearance fit. A clearance between the outer rotor and the inner stator is a driving liquid channel. The length of the outer rotor is less than that of the inner stator. The outer rotor is provided between the front and rear ends of the inner stator. The outer rotor is connected to an outer cylinder. The rear end of the inner stator is connected to a coupling.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: February 20, 2024
    Assignees: SHENZHEN UNIVERSITY, SICHUAN UNIVERSITY
    Inventors: Mingzhong Gao, Heping Xie, Ling Chen, Jun Guo, Zhilong Zhang, Zetian Zhang, Yiqiang Lu, Cong Li, Zhiqiang He
  • Patent number: 11904699
    Abstract: A vehicle-mounted charging device is provided. The vehicle-mounted charging device includes a main body unit, at least one wireless charging coil and a plurality of wired charging units. The main body unit receives an input power, and provides at least one wireless charging power and a plurality of wired charging powers. The wireless charging coil is coupled to the main body unit for receiving the corresponding wireless charging power, and the wireless charging coil charges a wireless electronic device disposed thereon through electromagnetic coupling. Each wired charging unit includes a wire and an input terminal and an output terminal which are located at two sides of the wire respectively. The input terminal is coupled to the main body unit for receiving the corresponding wired charging power. The wired charging power is transmitted to the output terminal so as to charge the wired electronic device connected to the output terminal.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: February 20, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: May-Ling Chen, Benze Zou, Jianhong Zeng, Chao Li, Nan Ye
  • Publication number: 20240053979
    Abstract: The method of this disclosure may comprise generating a statement invocation relation for a source code by parsing intermediate representation of the source code produced by a compiler. The method of this disclosure may further comprise in response to a first statement in a first code snippet of the plurality of code snippet being changed, determining affected statements in the source code due to the change of the first statement based on the statement invocation relation.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 15, 2024
    Inventors: Wu Song Fang, Xiao Ling Chen, Xinzhe Wang, Jing Wang, Ting Xie, Ji Dong Li, Yi Huang
  • Publication number: 20240055402
    Abstract: An electronic package is provided, in which a stacking component and a plurality of conductive pillars are embedded in a packaging layer, and a routing structure is formed on the packaging layer, where the stacking component is formed by stacking a first electronic module and a second electronic module on each other, and a plurality of first conductive vias and a plurality of second conductive vias are served as the electrical connection paths between the first electronic module and the second electronic module, such that the transmission distance of electrical signals between a first electronic element in the first electronic module and a second electronic element in the second electronic module can be reduced.
    Type: Application
    Filed: December 8, 2022
    Publication date: February 15, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Lung-Yuan WANG, Feng KAO, Chiu-Ling CHEN, Hung-Kai WANG
  • Publication number: 20240054018
    Abstract: A computer-implemented method includes receiving an initial request from a client, splitting the initial request into a plurality of split requests based on a business logic, acquiring mapping information associated with the plurality of split requests, determining, based, at least in part, on the mapping information, respective split requests included in the plurality of split requests that are candidates for merger into a merged request, merging the respective split requests that are determined to be candidates for merger into one or more merged requests, and sending the one or more merged requests to one or more nodes capable of processing the one or more merged requests.
    Type: Application
    Filed: August 10, 2022
    Publication date: February 15, 2024
    Inventors: Xiao Zhen Zhu, Xiao Ling Chen, Yuan Yuan, Xiao Ming Liu, Ming Dong, Shao Fei Li
  • Publication number: 20240047420
    Abstract: An electronic package and a manufacturing method thereof are provided, where the manufacturing method is to dispose an electronic structure with a plurality of conductive bumps and a thermal conductor on its upper surface on a carrier structure via external bumps on its lower surface, so that when reflowing the external bumps, the heat of the heat source joint is conducted from the upper surface of the electronic structure to the external bumps on the lower surface via the thermal conductor, so as to facilitate the heating and reflowing of the external bumps to avoid the problem of non-wetting of the solder.
    Type: Application
    Filed: December 8, 2022
    Publication date: February 8, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventor: Yi-Ling CHEN