Abstract: A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping a first area of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping a second area of the first polishing pad, the first area and the second area are opposite to each other. When the first polishing pad will be disconnected from the bottom surface of the polishing head and replaced by a second polishing pad, the first clamping element and the second clamping element are released from the first polishing pad.

Abstract: The invention provides a novel control method combining fuzzy logic control with gain auto-tuning sliding mode control. A control error signal e(t) from the detection mechanism and an error change signal ce(t) are combined together as a sliding variable s(t)=ce(t)+?e(t) and used as the fuzzy input control variable. Using the control method, 2D fuzzy control rule is simplified into 1D fuzzy control rule through the sliding variable definition for enhancing the efficiency of computation and saving computation resources. Accordingly, both the quick transient response and steady state precision positioning can be achieved. The present method can overcome the disadvantages of current controller, which can not reach the desired transient and steady state responses simultaneously.

Abstract: A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping one end of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping another end of the first polishing pad. When the first clamping element and the second clamping element clamp the first polishing pad and are unloaded from the polishing head, the first polishing head slides out from the first clamping element and the second clamping element. Then, a second polishing pad slides into the first clamping element and the second clamping element.

Abstract: The present invention relates to a vibration attenuation/isolation device. An implementation of the invention provides an improved whole-spacecraft vibration attenuation/isolation by separating the vibration load on the spacecraft that arise from the launch vehicle and fairing into longitudinal and lateral components, and effectively attenuates and/or isolates those components. The invention also provides a general method for reducing vibrations in an assembly by using a vibration control device that separates the vibrational forces into perpendicular components that can be separately damped or attenuated.