Abstract: The present disclosure relates to an improved method of forming interconnection layers to reduce voids and improve reliability, and an associated device. In some embodiments, a dielectric layer is formed over a semiconductor substrate having an opening arranged within the dielectric layer. A metal seed layer is formed on the surfaces of the opening using a chemical vapor deposition (CVD) process. Then a metal layer is plated onto the metal seed layer to fill the opening. Forming the metal seed layer using a CVD process provides the seed layer with a good uniformity, which allows for high aspect ratio openings in the dielectric layer to be filled without voids or pinch off.

Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.

Abstract: A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the substrate, and the connecting elements being disposed adjacent to the first surface of the substrate and encapsulated by the package body; and (b) removing a portion of the package body along one or more machining paths to expose the connecting elements, wherein each machining path has one or more first paths passing over, between, or along a side of at least two connecting elements, wherein a portion of each of the at least two connecting elements is within the package body, and another portion of each of the at least two connecting elements protrudes from a surface of the package body.

Abstract: A compound semiconductor device includes a substrate, including a top surface, a bottom surface, a side surface connecting the top surface and the bottom surface; and a semiconductor stack formed on the top surface, wherein the side surface includes a first deteriorated surface, a second deteriorated surface, a first crack surface between the first and second deteriorated surfaces, a second crack surface between the first deteriorated surface and the top surface, and a third crack surface between the second deteriorated surface and the bottom surface, wherein the first crack surface is inclined to the first deteriorated surface or the second deteriorated surface; and wherein the second crack surface or the third crack surface is substantially perpendicular to the top surface or the bottom surface.

Abstract: A RFID system for checking medical items includes a processing unit; two RFID readers connected with the processing unit; at least an antenna connected to each of the RFID readers; and a plurality of RFID tags being respectively attached to a plurality of medical items. The RFID tags are configured to store identification codes that respectively and uniquely correspond to the medical items that the RFID tags are attached to. The RFID readers are configured to respectively read the identification codes of the medical items from the RFID tags through the antennas before and after a surgical operation and send the identification codes to the processing unit. The processing unit is configured to receive the identification codes and determine the completeness of the medical items based on the received identification codes. A method for checking medical items with the RFID system is also provided.

Abstract: A solar power sunroof device having a low reflectance is for receiving and reflecting a solar ray and a visible ray. A substrate is illuminated by the solar ray. A front contact layer has a first upper connecting surface and a first lower connecting surface. The first upper connecting surface is connected to the substrate. A photoelectric conversion layer is connected between the first lower connecting surface and a back contact layer. A low reflective layer has a third upper connecting surface and a third lower connecting surface. The third upper connecting surface is connected to the back contact layer, and the third lower connecting surface has a visible light reflectance. The visible ray illuminates the third lower connecting surface of the low reflective layer, and the third lower connecting surface scatters or absorbs the visible ray so as to decrease the visible light reflectance.

Abstract: A compound semiconductor device includes a substrate, including a top surface, a bottom surface, a side surface connecting the top surface and the bottom surface; and a semiconductor stack formed on the top surface, wherein the side surface includes a first deteriorated surface, a second deteriorated surface, a first crack surface between the first and second deteriorated surfaces, a second crack surface between the first deteriorated surface and the top surface, and a third crack surface between the second deteriorated surface and the bottom surface, wherein a convex region or a concave region is formed by the first deteriorated surface, the first crack surface and the second crack surface, or the second deteriorated surface, the first crack surface and the third crack surface; and wherein the second crack surface or the third crack surface is substantially perpendicular to the top surface or the bottom surface.

Abstract: Receiving a first notification at a mobile device, displaying a first set of information related to the first notification for a first time period commencing when the first notification is received, analyzing data from a sensor of the mobile device to detect a presence of a user, in response to detecting the presence of the user, and also in response to receiving a subsequent notification, displaying an updated set of information related to the subsequent notification during a second time period that commences upon receipt of the subsequent notification.

Abstract: A method includes a processor of an electronic device receiving first input signals from a first sensor in response to user contact at a first edge of the device and second input signals from a second sensor in response to user contact at a second edge of the electronic device. The first and second sensors are covered by a housing of the device. The processor determines an external context of the device based on analysis of the first input signals and the second input signals. The determined external context indicates at least a position of the device relative to a user or an orientation of the device relative to a user. Responsive to determining the external context, the electronic device executes a particular user input action.

Abstract: A group outing provision system applicable to a plurality of mobile devices executing a group outing application, the group outing provision system including: an account management server, an itinerary management server, a route planning server and a group management server. The account management server enables each of the plurality of mobile devices to sign up for or sign in with a representative account. The itinerary management server enables the representative account to add or join at least one itinerary. The route planning server enables the representative account to input route information when adding the at least one itinerary or to acquire the route information when joining the at least one itinerary. The group management server enables the representative account to generate a group when adding the at least one itinerary or to join the group when joining the at least one itinerary.

Abstract: A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD) chamber. The method also includes introducing a plasma-forming gas into the PVD chamber, and the plasma-forming gas contains an oxygen-containing gas. The method further includes applying a radio frequency (RF) power to a metal target in the PVD chamber to excite the plasma-forming gas to generate plasma. In addition, the method includes directing the plasma towards the metal target positioned in the PVD chamber such that an etch stop layer is formed over the semiconductor substrate.

Abstract: A compound semiconductor device includes a substrate, including a top surface, a bottom surface, a side surface connecting the top surface and the bottom surface; and a semiconductor stack formed on the top surface, wherein the side surface includes a first deteriorated surface, a second deteriorated surface, a first crack surface between the first and second deteriorated surfaces, a second crack surface between the first deteriorated surface and the top surface, and a third crack surface between the second deteriorated surface and the bottom surface, wherein a convex region or a concave region is formed by the first deteriorated surface, the first crack surface and the second crack surface, or the second deteriorated surface, the first crack surface and the third crack surface; and wherein the second crack surface or the third crack surface is substantially perpendicular to the top surface or the bottom surface.

Abstract: This disclosure relates to novel xylose isomerases and their uses, particularly in fermentation processes that employ xylose-containing media.

Abstract: Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.

Abstract: The method includes repairing a nuclear reactor, where the reactor includes one or more submerged lines welded to one or more support brackets. The method involves removing a damaged section of the one or more submerged lines, and replacing the damaged section without welding.

Abstract: A control method for controlling a synchronous motor includes calculating d-axis and q-axis current commands according to a frequency command and frequency of the synchronous motor by a MTPA control unit; when a feedback output voltage of the synchronous motor is larger than a control level, outputting a flux-weakening current command by a voltage control unit; calculating a flux-weakening current feed-forward value according to the frequency, a target level and the q-axis current command by a feed-forward control unit; when the sum of the flux-weakening current command and the flux-weakening current feed-forward value is smaller than the d-axis current command, adjusting the d-axis current command by the sum of the flux-weakening current command and the flux-weakening current feed-forward value; and outputting d-axis and q-axis voltage commands according to the adjusted d-axis current command and the q-axis current command to control the synchronous motor.

Abstract: A wireless tag reading system including a frame, two or more antennas installed to the frame, and a turntable rotatable with respect to the frame. The turntable is adapted to support thereon an object containing one or more electronic tags. The turntable is adapted to rotate the object with respect to the two or more antennas, so that at least one of the two or more antennas is configured to read the one or more electronic tags at more than one distance, orientation, or phase. By rotating the object to vary the distance and/or orientation from the tags to the antennas, all the tags on the object can be scanned and correctly read by the wireless tag reader.

Abstract: A wireless tag reading system including a frame, two or more antennas installed to the frame, and a turntable rotatable with respect to the frame. The turntable is adapted to support thereon an object containing one or more electronic tags. The turntable is adapted to rotate the object with respect to the two or more antennas, so that at least one of the two or more antennas is configured to read the one or more electronic tags at more than one distance, orientation, or phase. By rotating the object to vary the distance and/or orientation from the tags to the antennas, all the tags on the object can be scanned and correctly read by the wireless tag reader.

Abstract: Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.

Abstract: An arc-bending translucent assembly is disclosed in the present disclosure. The arc-bending translucent assembly includes a first substrate and a second substrate. The first substrate has a first thickness and a second thickness at two sides thereof. The first substrate further includes a first arc surface and a second arc surface, in which a third thickness exists between a first top of the first arc surface and a second top of the second arc surface. The third thickness is larger than the first thickness or the second thickness. The second substrate is bent and disposed close to the second arc surface of the first substrate.