Patents by Inventor Ling Pan

Ling Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230402480
    Abstract: A method of manufacturing a semiconductor device includes disposing a plurality of a first type of light sensing units on a substrate; and disposing a plurality of a second type of light sensing units arranged on the substrate. Each of the first type of light sensing units is operable to receive less radiation than each of the second type of light sensing units. At least one of the second type of light sensing units is adjacent to a portion of at least one of the first type of light sensing units. The method includes disposing a first isolation structure between one of the first type of light sensing units and one of the second type of light sensing units; and disposing a second isolation structure between the adjacent first type of light sensing units. The method includes disposing a reflective layer above the first type of light sensing units.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Li-Wen HUANG, Chung-Lin FANG, Kuan-Ling PAN, Ping-Hao LIN, Kuo-Cheng LEE, Cheng-Ming WU
  • Publication number: 20230207488
    Abstract: A semiconductor package assembly includes a substrate, a die stack including at least a bottom die, an inert top spacer, and at least a first inert base spacer. The inert top and base spacers are exclusive of any circuits. A top surface of the inert top spacer is directly attached to a bottom surface of the bottom die in the die stack. A top surface of the first inert base spacer is directly attached to a bottom surface of the inert top spacer and a bottom surface of the first inert base spacer is directly attached to the substrate. The footprint of the inert base spacer is smaller than the footprint of the inert top spacer. In some embodiments, the footprint of the inert base spacer is positioned entirely within the footprint of the inert top spacer.
    Type: Application
    Filed: October 28, 2022
    Publication date: June 29, 2023
    Inventors: Faxing Che, Hong Wan Ng, Yeow Chon Ong, Wei Yu, Ling Pan, Lin Bu
  • Patent number: 11688662
    Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 27, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Ling Pan, Sook Har Leong, Kelvin Tan Aik Boo
  • Patent number: 11600754
    Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 7, 2023
    Assignee: Lumileds LLC
    Inventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan
  • Publication number: 20230061803
    Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Ling Pan, Sook Har Leong, Kelvin Tan Aik Boo
  • Publication number: 20230040241
    Abstract: An electronic device and a method for editing a resume are provided. The electronic device includes a display, a transceiver, a storage medium, and a processor. The processor receives personal information through the transceiver, and inputs the personal information into a plurality of item templates to generate an item template with personal information and a blank item template without personal information corresponding to the plurality of item templates. The processor displays the plurality of item templates through the display, and receives a first input operation to add a first item template and a second item template in the plurality of item templates to a resume display area to generate a resume. The processor outputs the resume through the transceiver.
    Type: Application
    Filed: July 11, 2022
    Publication date: February 9, 2023
    Applicant: Trantor Tech, Inc.
    Inventors: Chun Yi Liu, Cheng-Min Ting, Chun Ling Pan
  • Publication number: 20220288295
    Abstract: A nasal aspirator suction bin assembly comprises a suction bin base, which has a first connecting end connected with a host and a second connecting end connected with a suction bin cover; after the suction bin base is connected with the suction bin cover, a cavity is formed therein; the middle of the suction bin base is provided with an outlet tube, which runs through the suction bin base and extends into the cavity; the upper end of the suction bin cover is provided with a suction tube, which runs through the suction bin cover and extends into the cavity; a bracket is arranged in the cavity, and the bracket comprises a bracket tube which can be inserted on the outlet tube and a baffle arranged at the other free end of the bracket tube, and at least one air hole is arranged on the bracket tube to keep the suction tube and the outlet tube in communication all the time; the cavity is used to store the inhaled nasal fluid.
    Type: Application
    Filed: May 30, 2022
    Publication date: September 15, 2022
    Inventor: Ling Pan
  • Publication number: 20220064151
    Abstract: The present invention provides compounds of Formulae (A), (B), (C), and (D), pharmaceutically acceptable salts, solvates, hydrates, polymorphs, co-crystals, tautomers, stereoisomers, isotopically labeled derivatives, and prodrugs thereof, pharmaceutical compositions thereof, and kits thereof. The present invention further provides methods of using the compounds to treat or prevent neurological disorders, including Alzheimer's disease, Parkinson's disease, Huntington's disease, ALS (amyotrophic lateral sclerosis), traumatic brain injury, ischemic brain injury, stroke, frontal temporal dementia, Pick's disease, corticobasal degeneration, supra cerebral palsy, prion diseases (e.g., Creutzfeldt-Jakob disease, Gerstmann-Straussler-Scheinker syndrome, Fatal Familial Insomnia, and Kuru), Nieman Pick type C, spinal cerebellar ataxia, spinal muscular dystrophy, ataxia telangiectasia, hippocampal sclerosis, Cockayne syndrome, Werner syndrome, xeroderma pigmentosaum, and Bloom syndrome.
    Type: Application
    Filed: August 9, 2021
    Publication date: March 3, 2022
    Applicants: Massachusetts Institute of Technology, The General Hospital Corporation d/b/a Massachusetts General Hospital
    Inventors: Li-Huei Tsai, Ling Pan, Stephen J. Haggarty, Debasis Patnaik
  • Patent number: 11253956
    Abstract: A structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: February 22, 2022
    Assignee: Caterpillar Inc.
    Inventors: David R. Griffith, Michael Noble, William Ulrich, Christopher Lu, Ling Pan, Huijun Wang, Donald Stickel, Keith Egland, Jeremy R. Hammar, Seth Johnson, Timothy W. Olmsted
  • Publication number: 20220020787
    Abstract: A semiconductor device includes a first type of light sensing units, where each instance of the first type of light sensing units is operable to receive a first amount of radiation; and a second type of light sensing units, where each instance of the second type of light sensing units is operable to receive a second amount of radiation, and the second type of light sensing units is arranged in an array with the first type of light sensing units to form a pixel sensor. The first amount of radiation is smaller than the second amount of radiation, and at least a first instance of the first type of light sensing units is adjacent to a second instance first type of light sensing unit.
    Type: Application
    Filed: April 1, 2021
    Publication date: January 20, 2022
    Inventors: Li-Wen HUANG, Chun-Lin FANG, Kuan-Ling PAN, Ping-Hao LIN, Kuo-Cheng LEE, Cheng-Ming WU
  • Patent number: 11227369
    Abstract: A data restoring method using compressed sensing and computer program product, the method includes (a) continuously measuring data for plural times to generate measurement results correspondingly, and processing the i-th measurement result using the compressed sensing, and starting to generate data matrix when times of measuring reaches a preset times of measurements N; (b) generating a first data matrix using the [(j+1)?N]th to the j—the measurements, and then generating a first restored data; (c) generating a second data matrix using the [(j+2)?N]th to the (j+1)—the measurements, and then generating a second restored data; (d) calculating an error between the first and the second restored data; (e) determining whether the error keeps constant for a predetermined number of times; (f) if not, repeating steps (c) to (e).
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: January 18, 2022
    Assignees: National Tsing Hua University, Advanced ACEBIOTEK CO., LTD.
    Inventors: Ci-Ling Pan, Bo-Lin Jian, Anup Kumar Sahoo
  • Publication number: 20210400831
    Abstract: An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
    Type: Application
    Filed: May 16, 2019
    Publication date: December 23, 2021
    Inventors: Lan MA, Haiyan JIN, Ling PAN, Na YU, Liang CHEN
  • Patent number: 11084803
    Abstract: The present invention provides compounds of Formulae (A), (B), (C), and (D), pharmaceutically acceptable salts, solvates, hydrates, polymorphs, co-crystals, tautomers, stereoisomers, isotopically labeled derivatives, and prodrugs thereof, pharmaceutical compositions thereof, and kits thereof. The present invention further provides methods of using the compounds to treat or prevent neurological disorders, including Alzheimer's disease, Parkinson's disease, Huntington's disease, ALS (amyotrophic lateral sclerosis), traumatic brain injury, ischemic brain injury, stroke, frontal temporal dementia, Pick's disease, corticobasal degeneration, supra cerebral palsy, prion diseases (e.g., Creutzfeldt-Jakob disease, Gerstmann-Straussler-Scheinker syndrome, Fatal Familial Insomnia, and Kuru), Nieman Pick type C, spinal cerebellar ataxia, spinal muscular dystrophy, ataxia telangiectasia, hippocampal sclerosis, Cockayne syndrome, Werner syndrome, xeroderma pigmentosaum, and Bloom syndrome.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: August 10, 2021
    Assignees: Massachusetts Institute of Technology, The General Hospital Corporation
    Inventors: Li-Huei Tsai, Ling Pan, Stephen J. Haggarty, Debasis Patnaik
  • Patent number: 10981253
    Abstract: A structural member is disclosed. The structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: April 20, 2021
    Assignee: Caterpillar Inc.
    Inventors: David R. Griffith, Michael Noble, William Ulrich, April J. Lu, Ling Pan, Huijun Wang, Donald Stickel, Keith Egland, Jeremy R. Hammar, Seth Johnson, Timothy W. Olmsted
  • Publication number: 20200302581
    Abstract: A data restoring method using compressed sensing and computer program product, the method includes (a) continuously measuring data for plural times to generate measurement results correspondingly, and processing the i-th measurement result using the compressed sensing, and starting to generate data matrix when times of measuring reaches a preset times of measurements N; (b) generating a first data matrix using the [(j+1)?N]th to the j-the measurements, and then generating a first restored data; (c) generating a second data matrix using the [(j+2)?N]th to the (j+1)-the measurements, and then generating a second restored data; (d) calculating an error between the first and the second restored data; (e) determining whether the error keeps constant for a predetermined number of times; (f) if not, repeating steps (c) to (e).
    Type: Application
    Filed: July 3, 2019
    Publication date: September 24, 2020
    Applicants: National Tsing Hua University, Advanced ACEBIOTEK CO., LTD.
    Inventors: Ci-Ling Pan, Bo-Lin Jian, Anup Kumar Sahoo
  • Patent number: 10754201
    Abstract: A liquid crystal photoelectric apparatus including an upper substrate, a lower substrate, a plurality of alignment layers, and a liquid crystal material is provided. The alignment layers include an upper alignment layer, a lower alignment layer, and at least one intermediate alignment layer. The upper alignment layer has a first orientation direction. The lower alignment layer has a second orientation direction. The at least one intermediate alignment layer has an intermediate orientation direction. The intermediate orientation direction is between the first orientation direction and the second orientation direction. The liquid crystal material includes a plurality of liquid crystal material portions. Each of the liquid crystal material portions is disposed between any adjacent two alignment layers. A manufacturing method of the liquid crystal photoelectric apparatus is also provided.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: August 25, 2020
    Assignees: National Tsing Hua University, Advanced Comm. Engineering Solution Co., Ltd.
    Inventors: Ci-Ling Pan, Anup Kumar Sahoo, Chun-Ling Yen, Chan-Shan Yang, Yi-Hsin Lin, Hung-Chun Lin, Yu-Jen Wang
  • Publication number: 20200230749
    Abstract: A structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.
    Type: Application
    Filed: April 3, 2020
    Publication date: July 23, 2020
    Applicant: Caterpillar Inc.
    Inventors: David R. Griffith, Michael Noble, William Ulrich, Christopher Lu, Ling Pan, Huijun Wang, Donald Stickel, Keith Egland, Jeremy R. Hammar, Seth Johnson, Timothy W. Olmsted
  • Patent number: 10718707
    Abstract: A liquid crystal photoelectric apparatus includes a first and a second quartz glass substrates, an upper alignment layer disposed between the first and the second quartz glass substrates, a lower alignment layer disposed between the upper alignment layer and the second quartz glass substrate, a liquid crystal material disposed between the upper and the lower alignment layers, a first transparent conductive layer disposed between the upper alignment layer and the first quartz glass substrate and including at least one first main portion and first finger portions extending from the corresponding first main portion and a second transparent conductive layer second transparent conductive layer disposed between the lower alignment layer and the second quartz glass substrate and including a second main portion and second finger portions extending from the second main portion in an extension direction perpendicular to that of the first finger portions. An optical imaging processing system is provided.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 21, 2020
    Assignees: National Tsing Hua University, Advanced Comm. Engineering Solution Co., Ltd.
    Inventors: Ci-Ling Pan, Anup Kumar Sahoo, Chan-Shan Yang, Chun-Ling Yen, Yuan-Chun Lu
  • Patent number: 10688600
    Abstract: A structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: June 23, 2020
    Assignee: Caterpillar Inc.
    Inventors: David R. Griffith, Michael Noble, William Ulrich, Christopher Lu, Ling Pan, Huijun Wang, Donald Stickel, Keith Egland, Jeremy R. Hammar, Seth Johnson, Timothy W. Olmsted
  • Publication number: 20200161521
    Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
    Type: Application
    Filed: November 25, 2019
    Publication date: May 21, 2020
    Inventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan