Abstract: Methods, systems, and devices for wire bonding for stacked memory dies are described. A memory system may include a stack of memory dies. As the stack grows to include more and more memory dies, the length of the wires coupling the memory dies with the control circuit may increase. Bonding multiple wires using an adhesive may increase a gap between neighboring wires coupled with the same memory die or different memory dies. For example, bonding one wire to a neighboring wire may pull one or both of the bonded wires away from their original placement, increasing a gap between the bonded wires and one or more neighboring wires. Bonding the wires coupled with a lower memory die may increase a gap such that sagging wires coupled with an upper memory die may be positioned in the gap to avoid shorting with the lower wires.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a first semiconductor die, a second semiconductor die in a stacked arrangement with the first semiconductor die, and a flexible interposer disposed between the first semiconductor die and the second semiconductor die. The flexible interposer may include a first flexible layer, a second flexible layer, and a conductive trace disposed between the first flexible layer and the second flexible layer. A spacer portion of the flexible interposer may space the first semiconductor die from the second semiconductor die. A connecting portion of the flexible interposer may extend from the spacer portion beyond edges of the first semiconductor die and the second semiconductor die.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a substrate, a flip chip die electrically coupled to the substrate via a plurality of electrical connections, and a non-conductive film disposed between the flip chip die and the substrate. The non-conductive film may surround the plurality of electrical connections and mechanically couple the flip chip die to the substrate.

Abstract: Substrates having stress-releasing features, and associated systems and methods are disclosed herein. In some embodiments, the substrate includes a core layer, a metallization layer formed on an outer surface of the core layer, and a solder mask formed over the metallization layer and the outer surface. The metallization layer can include at least one bond pad and the solder mask can include a first opening exposing the bond pad. The first opening can be surrounded by a bonding region of the solder mask that thermally interfaces with the bond pad and/or any conductive structure bonded thereon. The solder mask can also include one or more second openings adjacent the first opening. Each of the second openings provides space for the solder mask to expand into to release stress due to thermal expansions of the bond pad, the solder mask, and/or the conductive structure during manufacturing and/or operation.

Abstract: Methods, systems, and devices for connection designs for memory systems are described. A memory system may include a package and a printed circuit board (PCB). An interface of the package may be coupled with the PCB via a set of springs, where each spring may include a material configured to deform based at least in part on a shape of the package, a shape of the PCB, or both. The memory system may also include a set of latches that may secure the package in a fixed position relative to the PCB. That is, the set of springs may provide an electrical connection between the package and the PCB, and the set of latches may provide a mechanical connection between the package and the PCB. In some examples, the package, the PCB, or both, may include one or more connection structures configured to receive the latches.

Abstract: A method of manufacturing a semiconductor device includes disposing a plurality of a first type of light sensing units on a substrate; and disposing a plurality of a second type of light sensing units arranged on the substrate. Each of the first type of light sensing units is operable to receive less radiation than each of the second type of light sensing units. At least one of the second type of light sensing units is adjacent to a portion of at least one of the first type of light sensing units. The method includes disposing a first isolation structure between one of the first type of light sensing units and one of the second type of light sensing units; and disposing a second isolation structure between the adjacent first type of light sensing units. The method includes disposing a reflective layer above the first type of light sensing units.

Abstract: A manufacturing method of a semiconductor device includes: providing a semiconductor stack layer, wherein the semiconductor stack layer includes a first type semiconductor layer, a quantum well layer, and a second type semiconductor layer stacked in sequence; growing an aluminum nitride layer on the second type semiconductor layer; and annealing the aluminum nitride layer to achieve quantum well intermixing.

Abstract: A semiconductor package assembly includes a substrate, a die stack including at least a bottom die, an inert top spacer, and at least a first inert base spacer. The inert top and base spacers are exclusive of any circuits. A top surface of the inert top spacer is directly attached to a bottom surface of the bottom die in the die stack. A top surface of the first inert base spacer is directly attached to a bottom surface of the inert top spacer and a bottom surface of the first inert base spacer is directly attached to the substrate. The footprint of the inert base spacer is smaller than the footprint of the inert top spacer. In some embodiments, the footprint of the inert base spacer is positioned entirely within the footprint of the inert top spacer.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.

Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.

Abstract: An electronic device and a method for editing a resume are provided. The electronic device includes a display, a transceiver, a storage medium, and a processor. The processor receives personal information through the transceiver, and inputs the personal information into a plurality of item templates to generate an item template with personal information and a blank item template without personal information corresponding to the plurality of item templates. The processor displays the plurality of item templates through the display, and receives a first input operation to add a first item template and a second item template in the plurality of item templates to a resume display area to generate a resume. The processor outputs the resume through the transceiver.

Abstract: A nasal aspirator suction bin assembly comprises a suction bin base, which has a first connecting end connected with a host and a second connecting end connected with a suction bin cover; after the suction bin base is connected with the suction bin cover, a cavity is formed therein; the middle of the suction bin base is provided with an outlet tube, which runs through the suction bin base and extends into the cavity; the upper end of the suction bin cover is provided with a suction tube, which runs through the suction bin cover and extends into the cavity; a bracket is arranged in the cavity, and the bracket comprises a bracket tube which can be inserted on the outlet tube and a baffle arranged at the other free end of the bracket tube, and at least one air hole is arranged on the bracket tube to keep the suction tube and the outlet tube in communication all the time; the cavity is used to store the inhaled nasal fluid.

Abstract: The present invention provides compounds of Formulae (A), (B), (C), and (D), pharmaceutically acceptable salts, solvates, hydrates, polymorphs, co-crystals, tautomers, stereoisomers, isotopically labeled derivatives, and prodrugs thereof, pharmaceutical compositions thereof, and kits thereof. The present invention further provides methods of using the compounds to treat or prevent neurological disorders, including Alzheimer's disease, Parkinson's disease, Huntington's disease, ALS (amyotrophic lateral sclerosis), traumatic brain injury, ischemic brain injury, stroke, frontal temporal dementia, Pick's disease, corticobasal degeneration, supra cerebral palsy, prion diseases (e.g., Creutzfeldt-Jakob disease, Gerstmann-Straussler-Scheinker syndrome, Fatal Familial Insomnia, and Kuru), Nieman Pick type C, spinal cerebellar ataxia, spinal muscular dystrophy, ataxia telangiectasia, hippocampal sclerosis, Cockayne syndrome, Werner syndrome, xeroderma pigmentosaum, and Bloom syndrome.

Abstract: A structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.

Abstract: A semiconductor device includes a first type of light sensing units, where each instance of the first type of light sensing units is operable to receive a first amount of radiation; and a second type of light sensing units, where each instance of the second type of light sensing units is operable to receive a second amount of radiation, and the second type of light sensing units is arranged in an array with the first type of light sensing units to form a pixel sensor. The first amount of radiation is smaller than the second amount of radiation, and at least a first instance of the first type of light sensing units is adjacent to a second instance first type of light sensing unit.

Abstract: A data restoring method using compressed sensing and computer program product, the method includes (a) continuously measuring data for plural times to generate measurement results correspondingly, and processing the i-th measurement result using the compressed sensing, and starting to generate data matrix when times of measuring reaches a preset times of measurements N; (b) generating a first data matrix using the [(j+1)?N]th to the j—the measurements, and then generating a first restored data; (c) generating a second data matrix using the [(j+2)?N]th to the (j+1)—the measurements, and then generating a second restored data; (d) calculating an error between the first and the second restored data; (e) determining whether the error keeps constant for a predetermined number of times; (f) if not, repeating steps (c) to (e).

Abstract: An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

Abstract: The present invention provides compounds of Formulae (A), (B), (C), and (D), pharmaceutically acceptable salts, solvates, hydrates, polymorphs, co-crystals, tautomers, stereoisomers, isotopically labeled derivatives, and prodrugs thereof, pharmaceutical compositions thereof, and kits thereof. The present invention further provides methods of using the compounds to treat or prevent neurological disorders, including Alzheimer's disease, Parkinson's disease, Huntington's disease, ALS (amyotrophic lateral sclerosis), traumatic brain injury, ischemic brain injury, stroke, frontal temporal dementia, Pick's disease, corticobasal degeneration, supra cerebral palsy, prion diseases (e.g., Creutzfeldt-Jakob disease, Gerstmann-Straussler-Scheinker syndrome, Fatal Familial Insomnia, and Kuru), Nieman Pick type C, spinal cerebellar ataxia, spinal muscular dystrophy, ataxia telangiectasia, hippocampal sclerosis, Cockayne syndrome, Werner syndrome, xeroderma pigmentosaum, and Bloom syndrome.

Abstract: A structural member is disclosed. The structural member includes a body having a first surface, a second surface, and an end surface at an end portion of the structural member. The end portion of the structural member includes a root protrusion extending radially outward from the second surface of the structural member along a root protrusion radius to an outer end of the root protrusion to define a root protrusion height extending from the second surface of the structural member to the outer end of the root protrusion. The root protrusion further includes a root protrusion width extending between an inner edge and an outer edge of the outer end of the root protrusion. The root protrusion radius, the root protrusion height, and the root protrusion width are configured to define a stress protected weld root region isolated beyond and away from a root stress flow path propagated through the body of the structural member.