Patents by Inventor Ling Wu

Ling Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240242677
    Abstract: This application provides a shift register, a gate drive circuit, a display panel, and an electronic device. The shift register includes a node control module, electrically connected to a first level signal receiving end, a second level signal receiving end, a first node, and a second node; an input module, electrically connected to a first clock signal end, a trigger signal input end, and the second node; an output module, electrically connected to the first level signal receiving end, the second level signal receiving end, the first node, a third node, and a drive signal output end; a first voltage stabilizing module, electrically connected to the first node, a fourth node, and the second level signal receiving end; and a second voltage stabilizing module, electrically connected to the second node, the third node, the fourth node, and a second clock signal end.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 18, 2024
    Inventors: Linhong HAN, Wanming WU, Di GENG, Ling LI, Zheng TIAN
  • Publication number: 20240242661
    Abstract: A display device includes first and second pixel circuits, first and second gate lines, and first and second transmission lines. The first pixel circuit emits light according to a data signal, and is charged according to a first gate signal. The second pixel circuit emits light according to the data signal, and is charged according to a second gate signal. The first gate line is located between the first second pixel circuits, and provides the first gate signal. The second gate line provides the second gate signal. The first transmission line provides the second gate signal to the second gate line. The second transmission line is located between the first transmission line and the second pixel circuit, crosses over the second gate line, and provides the first gate signal to the first gate line.
    Type: Application
    Filed: July 7, 2023
    Publication date: July 18, 2024
    Inventors: Yueh-Chi WU, Shu-Wen LIAO, Ti-Kuei YU, Ya-Ling HSU, Sheng-Yen CHENG, Yueh-Hung CHUNG
  • Patent number: 12040255
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Publication number: 20240231637
    Abstract: Data is migrated. For instance, in response to detection of a failed group in a drive of groups comprising respective blocks, it is determined whether the total number of groups in the drive that have failed is less than a predetermined threshold. Data associated with the failed group is migrated to a reserved group in a reserved space of the drive according to a determination that the total number is less than the predetermined threshold; and a read/write (I/O) request to the failed group is redirected to the reserved group based on a mapping relationship from the failed group to the reserved group. Consequently, data does not need to be repaired on an entire drive due to one failed write request and replacing the drive is avoided, thereby saving resources, time and labor, and improving the impact of the failed write request on the performance of a storage system.
    Type: Application
    Filed: December 16, 2022
    Publication date: July 11, 2024
    Inventors: Andy Ling Wu, Yonghao Yu
  • Publication number: 20240223142
    Abstract: A low-cost and high-accuracy threshold voltage (Vth) sensor is shown. In addition to a current mirror implemented by an operational amplifier and two metal-oxide-semiconductor field-effect transistors (MOSFETs), the Vth sensor uses an active device and a diode-connected MOSFET. The active device is provided to determine a constant current that is mirrored from the first MOSFET to the second MOSFET of the current mirror. The diode-connected MOSFET is coupled between the drain terminal of the second MOSFET and the ground terminal. The constant current flows through the diode-connected MOSFET to generate an output voltage that contains information about a threshold voltage (Vth) of a MOSFET.
    Type: Application
    Filed: May 31, 2023
    Publication date: July 4, 2024
    Inventors: Wan-Ling WU, Hung-Chieh TSAI
  • Publication number: 20240203885
    Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.
    Type: Application
    Filed: February 28, 2024
    Publication date: June 20, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan LIN, Hsi Chung CHEN, Ji-Ling WU, Chih-Teng LIAO
  • Publication number: 20240183487
    Abstract: The application provides a foldable holder and an electronic device. A bottom plate of the foldable holder is rotationally connected to a first support plate through a first rotating portion, and a second support plate is rotationally connected to the first support plate through a second rotating portion. A clamping portion is mounted on the first support plate and slidable relative to the first support plate. When the foldable holder is in a closed state, the clamping portion clamps the second rotating portion to lock the first support plate and the second support plate, when the first support plate is at an angle to the bottom plate, the clamping portion is unlocked from the second rotating portion and clamped with the first rotating portion, the unlocking of the second rotating portion enables the second support plate to rotate relative to the first support plate.
    Type: Application
    Filed: September 7, 2022
    Publication date: June 6, 2024
    Inventors: Ling WU, Guoliang HUO, Feng TANG, Desen YANG
  • Patent number: 11997205
    Abstract: A method for verifying and issuing credential, includes providing, by a first credential management system of a first credential service provider, a sharing credential token and a service endpoint to a requesting device of the credential owner, upon a request; receiving, by a second credential management system of a second credential service provider, from a verifying device of a verifier through the requesting device, the sharing credential token and the service endpoint; sending, by the second credential management system, a proof request to the first credential management system based on the service endpoint; generating, by the first credential management system, a proof based on the proof request; and verifying, by the second credential management system, the proof based on credential cryptography information retrieved from a distributed ledger.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: May 28, 2024
    Assignee: TBCASOFT, INC.
    Inventors: Chiahsin Li, Ling Wu
  • Publication number: 20240162602
    Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 16, 2024
    Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
  • Publication number: 20240155785
    Abstract: A profiled display panel including a profiled edge, a regular display area, a profiled display area, and a plurality of pixel units, the profiled display area at least partially surrounding the regular display area, the profiled display area including the profiled edge; each pixel unit including a first pixel unit and a second pixel unit, the first pixel unit being located in the profiled display area, the second pixel unit being located in the regular display area, where an orthographic projection area of the first pixel unit on a light-emitting surface of the profiled display panel is S1, and an orthographic projection area of the second pixel unit on the light-emitting surface of the profiled display panel is S2, S1?S2.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 9, 2024
    Inventors: Ling WU, Chuhui FENG, Poping SHEN
  • Publication number: 20240142818
    Abstract: A display module and a display device are provided. The display module includes a backlight module; a light control cell; a display liquid crystal cell; a first polarizer; a second polarizer; and a composite optical film. Along a thickness direction of the display module, the light control cell is disposed between the backlight module and the display liquid crystal cell and on a light-exiting surface of the backlight module; the first polarizer is disposed on a side of the display liquid crystal cell facing away from the light control cell; the second polarizer is disposed between the display liquid crystal cell and the light control cell; the composite optical film is disposed between the display liquid crystal cell and the backlight module; and the composite optical film is configured to transmit P-polarized light and reflect S-polarized light.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 2, 2024
    Inventors: Liting FANG, Peiqin DENG, Ling WU, Boping SHEN
  • Publication number: 20240138572
    Abstract: An interlocking mechanism for a seat and a back of a chair is provided. A seat body and a chair chassis are pivotally connected, and a pad plate is pivotally connected with the seat body. Thereby the pad plate is moved around a pivotal connection between itself and the seat body when users sit on the pad plate. While a front side of the pad plate is moved downward, it is inclined to an angle slowly by a pad spring connected with the pad plate. When the use is leaning on the chair back connected with the seat body, the seat body is moved backward with a pivotal connection between itself and the chair chassis. The pivotal connection between the seat body and the pad plate can push the pad plate upward so that the seat body is inclined with the chair back and the user sits more comfortably.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: YU-LING WU, ARMIN ROLAND SANDER, MARTIN POTRYKUS
  • Publication number: 20240134536
    Abstract: Data is migrated. For instance, in response to detection of a failed group in a drive of groups comprising respective blocks, it is determined whether the total number of groups in the drive that have failed is less than a predetermined threshold. Data associated with the failed group is migrated to a reserved group in a reserved space of the drive according to a determination that the total number is less than the predetermined threshold; and a read/write (I/O) request to the failed group is redirected to the reserved group based on a mapping relationship from the failed group to the reserved group. Consequently, data does not need to be repaired on an entire drive due to one failed write request and replacing the drive is avoided, thereby saving resources, time and labor, and improving the impact of the failed write request on the performance of a storage system.
    Type: Application
    Filed: December 16, 2022
    Publication date: April 25, 2024
    Inventors: Andy Ling Wu, Yonghao Yu
  • Publication number: 20240121159
    Abstract: A method for automatic discovery of a Field Device during initial commissioning includes registering a Media Access Control (MAC) address of the Field Device with a Distributed Control System (DCS), and registering the Field Device with a Dynamic Host Configuration Protocol (DHCP) Server. An IP address may be assigned to the Field Device using the DHCP Server, and a DHCP client table may be polled using the DCS to recognize the MAC address of the Field Device. In response to the DCS recognizing the MAC address of the Field Device, the Field Device may be authenticated and authorized using the DCS.
    Type: Application
    Filed: August 4, 2023
    Publication date: April 11, 2024
    Applicants: Schneider Electric Systems USA, Inc., Schneider Electric USA, Inc.
    Inventors: Briane Ritchie, Ling Wu
  • Publication number: 20240121168
    Abstract: Systems/methods for monitoring and management of field devices and equipment at the edge provide an interworking component that runs on or at an edge device to facilitate monitoring and management of the field devices and equipment. In particular, the edge based interworking component allows operations, administration, and management (OA&M) services to be performed for both the hardware making up the devices as well as the operating systems and software applications running on the hardware. In some embodiments, OA&M services includes one or more IT orchestration services for the hardware as well as the operating systems and software applications running on the hardware. Such an arrangement allows monitoring and management of the field devices and equipment that have heretofore been performed by traditional control systems to be partly or entirely pushed down to the edge and/or pushed up to the cloud, depending on the particular implementation.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Applicants: Schneider Electric Systems USA, Inc., Schneider Electric USA, Inc.
    Inventors: Mark Bertolina, Richard Chaney, Sandip Mondal, Ling Wu
  • Publication number: 20240118669
    Abstract: A system and method are provided for managing infrastructures of an industrial system. The method includes receiving a desired state that models a state of two or more of infrastructures of the industrial system, wherein the two or more infrastructures are a virtual infrastructure of the industrial system and at least one a physical infrastructure and a network infrastructure of the industrial system. The method further includes receiving a current state that models a current state of the two or more infrastructures of the industrial system, determining a difference between the desired state and the current state, and causing, as a function of the determined difference, one or more changes to the current state of the infrastructures of the industrial system, wherein determining the difference and causing the one or more changes involves the two or more infrastructures.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Applicants: Schneider Electric USA, Inc., Schneider Electric Systems USA, Inc.
    Inventors: Ling Wu, Merrill Harriman, Sandip Mondal
  • Publication number: 20240118668
    Abstract: A method is provided for customizing orchestration of an industrial system infrastructure. The method includes receiving hardware user selections defining a plurality of hardware components of the industrial system infrastructure as a complete system, receiving application user selections defining applications to be deployed on the plurality of hardware components, receiving policy user selections defining rules for deployment of the plurality of hardware components and applications, and causing generation of logic that defines a plan for deployment of the applications on the plurality of hardware components in compliance with the rules for deployment, wherein the logic is configured to guide deployment of the applications on the plurality of hardware components.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 11, 2024
    Applicant: Schneider Electric USA, Inc.
    Inventors: Ling Wu, Alan Peter DeFreitas, Mickael Herve Robert Gouet, Merrill Harriman
  • Patent number: 11955430
    Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Hsuan Lin, Hsi Chung Chen, Ji-Ling Wu, Chih-Teng Liao
  • Patent number: 11944746
    Abstract: A fluid delivery apparatus comprises a first piston body, a second piston body, a fluid delivery pipe, and a sealing element. The first piston body has a first through hole, a first connecting portion, an accommodation space and a buffer space. The second piston body has a second through hole and a second connecting portion disposed inside the accommodation space. The fluid delivery pipe is accommodated in the first through hole and the second through hole, and movable between a first position and a second position. The sealing element encircles the fluid delivery pipe. When the fluid delivery pipe is at the first position, the sealing element is accommodated in the accommodation space. When the fluid delivery pipe is at the second position, a first part of the sealing element is accommodated in the accommodation space, and a second part of the sealing element is accommodated in the buffer space.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: April 2, 2024
    Assignee: MICROBASE TECHNOLOGY CORP.
    Inventors: Chiu-Ju Shen, Po Chuan Chen, Jo Ling Wu
  • Patent number: D1032196
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: June 25, 2024
    Assignee: Netronix, Inc.
    Inventors: Yi Li, Jui Hong Huang, Ling Ling Wu, Chien Te Hsieh