Abstract: A component installation/removal tweezer-type handpiece having two arms and a tinnable or nontinnable tip including a pair of legs respectively removably mounted with respect to the arms and a plurality of serially connected bands attached to the first and second legs such that an opening is formed within the serially connected bands so that the bands are adapted, upon closure of the tweezer-type handpiece, to clamp the terminals of an electronic component or the like and transmit heat to the terminals. In another embodiment a tweezer-type or probe-type handpiece includes a tinnable or nontinnable tip having first and second legs and one or more bands extending between the legs whereby the band(s) is adapted to transfer heat to terminals associated with an electronic component. In all embodiments of the invention the tips may be provided with a variety of sheathing or overlayer combinations to achieve a variety of application requirements.

Abstract: A device for installing or removing a component with respect to a substrate utilizing hot gas jets or other hot gas flow to reflow solder associated with the component.

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heater is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heate is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle for receiving solder from the reservoir; an element for conveying the molten solder in the reservoir to the nozzle; and a source connected to the contained space for introducing a pressurized gas into the space to raise the solder through the conveying means to a predetermined level within the nozzle and maintaining said solder at said predetermined level to thus effect the operation with the molten solder and then removing the gas to return the solder to the reservoir. The gas is pulsed at least during the time the solder approaches and reaches the predetermined level. The apparatus includes a plurality of different size hollow nozzles for receiving solder from the reservoir where the nozzles are removably attachable with respect to the reservoir.

Abstract: A replaceable tip for a hand-held pencil-like solder extractor for removing electronic components from a substrate. The tip comprises a tubular member having a first linear section of predetermined length with a first end coaxially receivable within a passageway in a solder extractor, a second linear section of predetermined length and having a free end, and a detent means intermediate the first and second sections for limiting the length of the tubular member received within the solder extractor passageway and for maintaining the free end of the tubular member a fixed distance from the solder extractor. The first and second linear sections each have a respective axis, and the axis of the first section forms an angle with the axis of the second section.

Abstract: A replaceable tip for a hand-held pencil-like solder extractor having an axis and a coaxial passageway for removing solder from a planar workpiece. The tip is a tubular member of predetermined outside diameter having a central bore of substantially constant cross-section, the tubular member having a first linear section of predetermined length which is coaxially received within the passageway of the solder extractor, a second linear section of predetermined length having a free end for contacting solder, and an intermediate curved section which acts as a detent for limiting the length of the tubular member which is insertable into the solder extractor passageway and maintains the free end a fixed distance from the solder extractor. The first and second sections are angled with respect to one another so that, in use, when an operator grasps the solder extractor in a pencil-like manner, the second linear section is disposed substantially perpendicularly to the planar surface of a workpiece, e.g.

Abstract: An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.