Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards
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Description
The sole FIGURE is a top plan view of the frame of dual in line package pads utilized to replace damaged pads on printed circuit boards showing my new design. The frame is flat with no substantial thickness and the bottom surface is identical to the top.
Referenced Cited
Patent History
Patent number: D288436
Type: Grant
Filed: Feb 21, 1984
Date of Patent: Feb 24, 1987
Assignee: Pace, Incorporated (Laurel, MD)
Inventor: Linus E. Wallgren (Rockville, MD)
Primary Examiner: Susan J. Lucas
Attorneys: Gerald J. Ferguson, Jr., Michael P. Hoffman, Ronni S. Malamud
Application Number: 6/582,028
Type: Grant
Filed: Feb 21, 1984
Date of Patent: Feb 24, 1987
Assignee: Pace, Incorporated (Laurel, MD)
Inventor: Linus E. Wallgren (Rockville, MD)
Primary Examiner: Susan J. Lucas
Attorneys: Gerald J. Ferguson, Jr., Michael P. Hoffman, Ronni S. Malamud
Application Number: 6/582,028
Classifications
Current U.S. Class:
D13/99
