Abstract: A semiconductor radar module includes an integrated circuit (IC) radar device embedded within a wafer level package compound layer, the wafer level package compound layer extending at least partially lateral to the IC radar device. An interface layer abutting the wafer level package compound layer comprises a redistribution layer coupled to the IC radar device for connecting the IC radar device externally. An underfill material extends between the interface layer and an external substrate and abuts the interface layer and the external substrate. The interface layer is disposed between the wafer level package compound layer and the underfill material.

Abstract: A semiconductor radar module includes an integrated circuit (IC) radar device embedded within a wafer level package compound layer, the wafer level package compound layer extending at least partially lateral to the IC radar device. An interface layer abutting the wafer level package compound layer comprises a redistribution layer coupled to the IC radar device for connecting the IC radar device externally. An underfill material extends between the interface layer and an external substrate and abuts the interface layer and the external substrate. The interface layer is disposed between the wafer level package compound layer and the underfill material.

Abstract: A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.

Abstract: A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.

Abstract: A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.

Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.

Abstract: A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.

Abstract: A semiconductor module, comprises a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound, the integrated circuit device and the package molding compound having a common surface. Structures are formed to connect the semiconductor module to an external board, the structures electrically connected to the integrated circuit device. A layer is formed on the common surface, the layer comprising at least one integrated antenna structure, the integrated antenna structure being coupled to the IC device.

Abstract: A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

Abstract: A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.

Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.

Abstract: A device may include an oscillator circuit, a control circuit, a frequency detector circuit, and a processor circuit. The oscillator circuit may include a frequency control input to output an oscillator signal. The frequency of the oscillator signal depends on an input signal applied to the frequency control input. The control circuit is configured to apply a first input signal value, a second input signal value, and a third input signal value to the frequency control input. The frequency detector circuit is configured to detect the first frequency value of the oscillator signal when the first input signal value is applied to the frequency control input, a second frequency value of the oscillator signal when the second input signal value is applied to the frequency control input, and a third frequency value of the oscillator signal when the third input signal value is applied to the frequency control input.

Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.

Abstract: A device comprises an oscillator circuit, a control circuit, a frequency detector circuit, and a processor circuit. The oscillator circuit comprises a frequency control input and is configured to output an oscillator signal. The frequency of the oscillator signal depends on an input signal applied to the frequency control input. The control circuit is configured to apply a first input signal value, a second input signal value, and a third input signal value to the frequency control input. The frequency detector circuit is configured to detect the first frequency value of the oscillator signal when the first input signal value is applied to the frequency control input, a second frequency value of the oscillator signal when the second input signal value is applied to the frequency control input, and a third frequency value of the oscillator signal when the third input signal value is applied to the frequency control input.

Abstract: A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

Abstract: A phase locked loop has a controlled oscillator for outputting an oscillator signal depending on a control signal. A comparator generates a comparison result from a comparison between a reference frequency signal and a feedback signal derived from the oscillator signal. The phase locked loop also has a filter block for filtering the comparison result and for deriving the control signal from the comparison result, where the filter block has a loop filter and a rejection filter for the frequency-selective attenuation of at least one first interference frequency in the comparison result.

Abstract: A phase/frequency detector has a modulo counter for outputting a counter word with a predetermined word length depending on an oscillator signal. In addition, a modulo integrator for outputting an integrator word with the predetermined word length as a function of integration of a channel word is provided. The phase/frequency detector also has a difference element for outputting a phase error word with the predetermined word length as a function of a difference between the counter word and the integrator word.

Abstract: An arrangement for determining a gradient factor for a digitally controlled oscillator has a data alignment device and an identification device. The data alignment device can be supplied a modulation signal, a phase error signal and an oscillator control word. The data alignment device is configured to output a modulation setting word based on the modulation signal, output a time interval magnitude based on the phase error signal and a reference interval, and output an oscillator modulation word based on the oscillator control word. The identification device is configured to adapt and output the gradient factor based on the modulation setting word, the time interval magnitude and the oscillator modulation word.

Abstract: A phase locked loop has a controlled oscillator for outputting an oscillator signal depending on a control signal. A comparator generates a comparison result from a comparison between a reference frequency signal and a feedback signal derived from the oscillator signal. The phase locked loop also has a filter block for filtering the comparison result and for deriving the control signal from the comparison result, where the filter block has a loop filter and a rejection filter for the frequency-selective attenuation of at least one first interference frequency in the comparison result.